검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Cryogenic inductively coupled plasma etching for fabrication of tapered through-silicon vias Kamto A, Divan R, Sumant AV, Burkett SL Journal of Vacuum Science & Technology A, 28(4), 719, 2010 |
| 2 |
Reliability study of through-silicon via (TSV) copper filled interconnects Kamto A, Liu Y, Schaper L, Burkett SL Thin Solid Films, 518(5), 1614, 2009 |
| 3 |
Fabrication and testing of through-silicon vias used in three-dimensional integration Abhulimen IU, Kamto A, Liu Y, Burkett SL, Schaper L Journal of Vacuum Science & Technology B, 26(6), 1834, 2008 |