검색결과 : 14건
| No. | Article |
|---|---|
| 1 |
수계 Cu 나노입자 잉크에서 Poly(styrene-co-maleic acid) 접착 증진제가 잉크 레올로지와 인쇄패턴의 접착력에 미치는 영향 조예진, 서영희, 정선호, 최영민, 김의덕, 오석헌, 류병환 Korean Journal of Materials Research, 25(12), 719, 2015 |
| 2 |
Synthesis and electrical characterization of low-temperature thermal-cured epoxy resin/functionalized silica hybrid-thin films for application as gate dielectrics Na M, Kang YT, Kim SC, Kim ED Thin Solid Films, 539, 274, 2013 |
| 3 |
Stable Aqueous Based Cu Nanoparticle Ink for Printing Well-Defined Highly Conductive Features on a Plastic Substrate Jeong S, Song HC, Lee WW, Lee SS, Choi Y, Son W, Kim ED, Paik CH, Oh SH, Ryu BH Langmuir, 27(6), 3144, 2011 |
| 4 |
Adipose-specific deletion of stearoyl-CoA desaturase 1 up-regulates the glucose transporter GLUT1 in adipose tissue Hyun CK, Kim ED, Flowers MT, Liu XQ, Kim E, Strable M, Ntambi JM Biochemical and Biophysical Research Communications, 399(4), 480, 2010 |
| 5 |
Trench formation on ion implanted SiC surface after thermal oxidation Bahng W, Song GH, Kim NK, Kim SC, Kim HW, Seo KS, Kim ED Materials Science Forum, 483, 777, 2005 |
| 6 |
Numerical simulation and optimization for 900V 4H-SiC DiMOSFET fabrication Kim SC, Bahng W, Kim NK, Kim ED, Ayalew T, Grasser T, Selberherr S Materials Science Forum, 483, 793, 2005 |
| 7 |
Edge termination technique for SiC power devices Kim HW, Bahng W, Song GH, Kim SC, Kim NK, Kim ED Materials Science Forum, 457-460, 1241, 2004 |
| 8 |
Suppression of macrostep formation in 4H-SiC using a cap oxide layer Bahng W, Kim NK, Kim SC, Song GH, Kim ED Materials Science Forum, 389-3, 863, 2002 |
| 9 |
Effects of interfacial reactions on electrical properties of Ni ohmic contacts on n-type 4H-SiC Han SY, Kim NK, Kim ED, Lee JL Materials Science Forum, 389-3, 897, 2002 |
| 10 |
Titanium-based ohmic contact on p-type 4H-SiC Jung KH, Cho NI, Lee JH, Yang SJ, Kim CK, Lee BT, Rim KH, Kim NK, Kim ED Materials Science Forum, 389-3, 913, 2002 |