| 1 |
On the Time Resolution of Electrochemical Scanning Flow Cell Coupled to Downstream Analysis
Shkirskiy V, Speck FD, Kulyk N, Cherevko S
Journal of the Electrochemical Society, 166(16), H866, 2019 |
| 2 |
Oxygen and hydrogen evolution reactions on Ru, RuO2, Ir, and IrO2 thin film electrodes in acidic and alkaline electrolytes: A comparative study on activity and stability
Cherevko S, Geiger S, Kasian O, Kulyk N, Grote JP, Savan A, Shrestha BR, Merzlikin S, Breitbach B, Ludwig A, Mayrhofer KJJ
Catalysis Today, 262, 170, 2016 |
| 3 |
Pt Sub-Monolayer on Au: System Stability and Insights into Platinum Electrochemical Dissolution
Cherevko S, Keeley GP, Kulyk N, Mayrhofer KJJ
Journal of the Electrochemical Society, 163(3), I1228, 2016 |
| 4 |
Numerical Simulation of an Electrochemical Flow Cell with V-Shape Channel Geometry
Kulyk N, Cherevko S, Auinger M, Laska C, Mayrhofer KJJ
Journal of the Electrochemical Society, 162(12), H860, 2015 |
| 5 |
Copper electroless plating in weakly alkaline electrolytes using DMAB as a reducing agent for metallization on polymer films
Kulyk N, Cherevko S, Chung CH
Electrochimica Acta, 59, 179, 2012 |
| 6 |
Utilization of surface active sites on gold in preparation of highly reactive interfaces for alcohols electrooxidation in alkaline media
Cherevko S, Kulyk N, Chung CH
Electrochimica Acta, 69, 190, 2012 |
| 7 |
Nanoporous Pt@AuxCu100-x by Hydrogen Evolution Assisted Electrodeposition of AuxCu100-x and Galvanic Replacement of Cu with Pt: Electrocatalytic Properties
Chereyko S, Kulyk N, Chung CH
Langmuir, 28(6), 3306, 2012 |
| 8 |
Study on electrochemical mechanical polishing process of copper circuit on PCB
Kulyk N, An CY, Oh JH, Cho SM, Ryu C, Ko YK, Chung CH
Korean Journal of Chemical Engineering, 27(1), 310, 2010 |
