검색결과 : 35건
No. | Article |
---|---|
1 |
Fabrication of superamphiphobic Cu surfaces using hierarchical surface morphology and fluorocarbon attachment facilitated by plasma activation Cai JY, Wang TYY, Hao W, Ling HQ, Hang T, Chung YW, Li M Applied Surface Science, 464, 140, 2019 |
2 |
Design of thermally stable insulation film by radical grafting poly (methylacrylic acid) on silicon surface Liu Y, Dong MY, Wang TYY, Xiong LS, Hang T, Ling HQ, Hu AM, Gao LM, Li M Applied Surface Science, 464, 627, 2019 |
3 |
Exceptional electrocatalytic oxygen evolution efficiency and stability from electrodeposited NiFe alloy on Ni foam Jin J, Xia JB, Qian X, Wu TL, Ling HQ, Hu AM, Li M, Hang T Electrochimica Acta, 299, 567, 2019 |
4 |
3D hierarchical nanostructured Ni-Co alloy electrodes on porous nickel for hydrogen evolution reaction Zhang XD, Li Y, Guo YK, Hu AM, Li M, Hang T, Ling HQ International Journal of Hydrogen Energy, 44(57), 29946, 2019 |
5 |
Competitive Effect of Leveler's Electrochemical Behavior and Impurity on Electrical Resistance of Electroplated Copper Zhang ZY, Wu YW, Zhang YM, Hang T, Hu AM, Ling HQ, Li M Journal of the Electrochemical Society, 166(13), D577, 2019 |
6 |
Effects of 2-mercaptopyridine and Janus Green B as levelers on electrical resistance of electrodeposited copper thin film for interconnects Zhang YM, Hang T, Dong MY, Wu YW, Ling HQ, Hu AM, Li M Thin Solid Films, 677, 39, 2019 |
7 |
Chemical grafting of the superhydrophobic surface on copper with hierarchical microstructure and its formation mechanism Cai JY, Wang SH, Zhang JH, Liu Y, Hang T, Ling HQ, Li M Applied Surface Science, 436, 950, 2018 |
8 |
Genome sequence of the progenitor of wheat A subgenome Triticum urartu Ling HQ, Ma B, Shi XL, Liu H, Dong LL, Sun H, Cao YH, Gao Q, Zheng SS, Li Y, Yu Y, Du HL, Qi M, Li Y, Lu HW, Yu H, Cui Y, Wang N, Chen CL, Wu HL, Zhao Y, Zhang JC, Li YW, Zhou WJ, Zhang BR, Hu WJ, van Eijk MJT, Tang JF, Witsenboer HMA, Zhao SC, Li ZS, Zhang AM, Wang DW, Liang CZ Nature, 557(7705), 424, 2018 |
9 |
Facile Fabrication of Au Nanoparticles-Decorated Ni Nanocone Arrays as Effective Surface-Enhanced Raman Scattering Substrates Xia YY, Mo X, Ling HQ, Hang T, Li M Journal of the Electrochemical Society, 163(10), D575, 2016 |
10 |
Linear Sweep Voltammetric Study on the Copper Electrodeposition of Though-Silicon-Vias Cao HY, Hang T, Ling HQ, Gao LM, Li M Journal of the Electrochemical Society, 161(6), D349, 2014 |