| 1 |
Adsorption and Desorption Kinetics of a Block Copolymer Wetting Agent Used in Copper Electroplating
Willey MJ, McInerney EJ
Journal of the Electrochemical Society, 156(3), D98, 2009 |
| 2 |
Integrated multiscale three-dimensional simulation approach in local interconnect gap-fill optimization
Sukharev V, Kumar K, Li WD, Zhao J, Pyka W, McInerney EJ, Joh S
Journal of Vacuum Science & Technology B, 19(5), 1879, 2001 |
| 3 |
Design of a 300 mm chemical vapor deposition tungsten reactor using computational fluid dynamics
McInerney EJ, Pratt TM, Taheri A
Journal of Vacuum Science & Technology A, 17(4), 1352, 1999 |
| 4 |
Experimental and analytical study of seed layer resistance for copper damascene electroplating
Broadbent EK, McInerney EJ, Gochberg LA, Jackson RL
Journal of Vacuum Science & Technology B, 17(6), 2584, 1999 |
| 5 |
Appliance manufacturers' perspective on energy standards
McInerney EJ, Anderson V
Energy and Buildings, 26(1), 17, 1997 |
| 6 |
Study of Station Flow Dynamics in a Sequential Multiwafer Chemical-Vapor-Deposition Batch Reactor Using Reactor Modeling
Mcinerney EJ
Journal of Vacuum Science & Technology A, 14(3), 1152, 1996 |
