검색결과 : 10건
| No. | Article |
|---|---|
| 1 |
Flexible-templated imprinting for fluorine-free, omniphobic plastics with re-entrant structures Zhao XX, Park DS, Choi J, Park S, Soper SA, Murphy MC Journal of Colloid and Interface Science, 585, 668, 2021 |
| 2 |
Robust, transparent, superhydrophobic coatings using novel hydrophobic/hydrophilic dual-sized silica particles Zhao XX, Park DS, Choi J, Park S, Soper SA, Murphy MC Journal of Colloid and Interface Science, 574, 347, 2020 |
| 3 |
Liquid-liquid segmented flows in polycarbonate microchannels with cross-sectional expansions Kim N, Murphy MC, Soper SA, Nikitopoulos DE International Journal of Multiphase Flow, 58, 83, 2014 |
| 4 |
Modeling of misalignment effects in microfluidic interconnects for modular Rani SD, Park T, You BH, Soper SA, Murphy MC, Nikitopoulos DE Electrophoresis, 34(20-21), 2988, 2013 |
| 5 |
Electrodeposition of High Aspect Ratio Super Invar Microstructures Kim H, Murphy MC, Podlaha EJ Journal of the Electrochemical Society, 159(9), D549, 2012 |
| 6 |
Composition variability of spent mushroom compost in Ireland Jordan SN, Mullen GJ, Murphy MC Bioresource Technology, 99(2), 411, 2008 |
| 7 |
Highly efficient circulating tumor cell isolation from whole blood and label-free enumeration using polymer-based microfluidics with an integrated conductivity sensor Adams AA, Okagbare PI, Feng J, Hupert ML, Patterson D, Gottert J, McCarley RL, Nikitopoulos D, Murphy MC, Soper SA Journal of the American Chemical Society, 130(27), 8633, 2008 |
| 8 |
Thermal expansion of electrodeposited nanoscale multilayers of Invar with copper Iyer D, Palaparti D, Podlaha EJ, Henk MC, Murphy MC Electrochemical and Solid State Letters, 9(5), C88, 2006 |
| 9 |
Resist-free patterning of surface architectures in polymer-based microanalytical devices McCarley RL, Vaidya B, Wei SY, Smith AF, Patel AB, Feng J, Murphy MC, Soper SA Journal of the American Chemical Society, 127(3), 842, 2005 |
| 10 |
Security vulnerability assessment in the chemical industry Dunbobbin BR, Medovich TJ, Murphy MC, Ramsey AL Process Safety Progress, 23(3), 214, 2004 |