| 1 |
Packaged food detection method based on the generalized Gaussian model for line-scan Raman scattering images
Liu ZF, Huang M, Zhu QB, Qin JW, Kim MS
Journal of Food Engineering, 258, 9, 2019 |
| 2 |
A novel acoustic emission detection module for leakage recognition in a gas pipeline valve
Li ZL, Zhang HF, Tan DJ, Chen X, Lei HX
Process Safety and Environmental Protection, 105, 32, 2017 |
| 3 |
항공기용 복합소재의 개발 및 연구동향
김득주, 오대윤, 정문기, 남상용
Applied Chemistry for Engineering, 27(3), 252, 2016 |
| 4 |
Applying the heat conduction-based 3D normalization and thermal tomography to pulsed infrared thermography for defect characterization in composite materials
Pawar SS, Vavilov VP
International Journal of Heat and Mass Transfer, 94, 56, 2016 |
| 5 |
Strain Profile Measurement for Structural Health Monitoring of Woven Carbon-fiber Reinforced Polymer Composite Bonded joints by Fiber Optic Sensing Using an Optical Backscatter Reflectometer
Bernasconi A, Kharshiduzzaman MD, Comolli L
Journal of Adhesion, 92(6), 440, 2016 |
| 6 |
The method of distinguishing the drum from the plasma wave effect in the photoacoustic spectra on the example of CdSe and CdMgSe crystals
Chrobak L, Malinski M, Zakrzewski J
Thermochimica Acta, 641, 79, 2016 |
| 7 |
Simultaneous determination of the thermal diffusivity and a drum factor for CdSeMnTe crystals with the photoacoustic method
Chrobak L, Malinski M, Zakrzewski J
Thermochimica Acta, 606, 84, 2015 |
| 8 |
Push-out bonding strengths of four different dowel systems luted with two different adhesive systems
Orucoglu H, Yavuz T, Demir N, Ozturk N, Ozturk B
Journal of Adhesion Science and Technology, 28(22-23), 2305, 2014 |
| 9 |
Extensometric and Thermo-Elasticimetric Measurements to Characterize the Damage Evolution in Adhesively Bonded Joints: Application for the Adhesively Bonded Double Scarf Joint
Gacoin A, Pron H, Assih J, Objois A, Delmas Y
Journal of Adhesion, 88(2), 171, 2012 |
| 10 |
Nondestructive Reconstruction and Analysis of Solid Oxide Fuel Cell Anodes Using X-Ray Computed Tomography at Sub-50 nm Resolution (vol 155, pg B504, 2008)
Izzo JR, Joshi AS, Grew KN, Chiu WKS, Tkachuk A, Wang SH, Yun WB
Journal of the Electrochemical Society, 157(2), S5, 2010 |
