| 1 |
Investigation of Thermal and Dielectric Properties of Epoxy Based Hybrid Composites for Microelectronics Applications
Agrawal A, Satapathy A
International Polymer Processing, 33(4), 506, 2018 |
| 2 |
Synthesis of Polyester Amide by Carbonylation-Polycondensation Reaction Using Immobilized Palladium Metal Containing Ionic Liquid on SBA-15 as a Phosphine-Free Catalytic System
Satapathy A, Gadge ST, Kusumawati EN, Harada K, Sasaki T, Nishio-Hamane D, Bhanage BM
Catalysis Letters, 145(3), 824, 2015 |
| 3 |
Epoxy Composites Filled with Micro-Sized AlN Particles for Microelectronic Applications
Agrawal A, Satapathy A
Particulate Science and Technology, 33(1), 2, 2015 |
| 4 |
A Study on Microsized Titanium Oxide-Filled Epoxy with Enhanced Heat Conductivity for Microelectronic Applications
Sahu M, Satapathy A
Particulate Science and Technology, 33(1), 109, 2015 |
| 5 |
Processing and Characterization of Plasma Spray Coatings of Glass Microspheres Premixed with Al2O3 Particles
Gupta G, Satapathy A
Particulate Science and Technology, 33(2), 145, 2015 |
| 6 |
Processing and Wear Analysis of Blast Furnace Slag Filled Polypropylene Composites Using Taguchi Model and ANN
Padhi PK, Satapathy A
International Polymer Processing, 29(2), 233, 2014 |
| 7 |
Erosion Behavior of Glass-epoxy Composites Filled with SiC from Bamboo Leaf
Mantry S, Mohapatra S, Mohapatra S, Singh SK, Manda A, Satapathy A
International Polymer Processing, 26(2), 164, 2011 |
| 8 |
Erosion Wear Analysis of SiC Filled Glass-Epoxy Composites using Taguchi Technique
Biswas S, Satapathy A
International Polymer Processing, 25(1), 23, 2010 |
| 9 |
An Assessment of Erosion Wear Response of SiC Filled Epoxy Composites Reinforced with Glass and Bamboo Fibers
Biswas S, Satapathy A
International Polymer Processing, 25(3), 205, 2010 |
| 10 |
Mass transfer effects on MHD flow and heat transfer past a vertical porous plate through a porous medium under oscillatory suction and heat source
Das SS, Satapathy A, Das JK, Panda JP
International Journal of Heat and Mass Transfer, 52(25-26), 5962, 2009 |
