화학공학소재연구정보센터
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No. Article
1 Density-functional theory molecular dynamics simulations of a-HfO2/a-SiO2/SiGe and a-HfO2/a-SiO2/Ge with a-SiO2 and a-SiO suboxide interfacial layers
Chagarov EA, Kavrik MS, Fang ZW, Tsai W, Kummel AC
Applied Surface Science, 443, 644, 2018
2 Effects of Anneal and Silicon Interface Passivation Layer Thickness on Device Characteristics of In0.53Ga0.47As Metal-Oxide-Semiconductor Field-Effect Transistors
Zhu F, Zhao H, Ok I, Kim HS, Yum J, Lee JC, Goel N, Tsai W, Gaspe CK, Santos MB
Electrochemical and Solid State Letters, 12(4), H131, 2009
3 Interface properties of MBE-grown MOS structures with InGaAs/InAlAs buried channel and in-situ high-k oxide
Oktyabrsky S, Tokranov V, Koveshnikov S, Yakimov M, Kambhampati R, Bakhru H, Moore R, Tsai W
Journal of Crystal Growth, 311(7), 1950, 2009
4 Atomic Layer Deposition of Hafnium Oxide on Ge and GaAs Substrates: Precursors and Surface Preparation
Delabie A, Brunco DP, Conard T, Favia P, Bender H, Franquet A, Sioncke S, Vandervorst W, Van Elshocht S, Heyns M, Meuris M, Kim E, McIntyre PC, Saraswat KC, LeBeau JM, Cagnon J, Stemmer S, Tsai W
Journal of the Electrochemical Society, 155(12), H937, 2008
5 Oxide scalability in Al2O3/Ga2O3(Gd2O3)/In0.20Ga0.80As/GaAs heterostructures
Shiu KH, Chiang CH, Lee YJ, Lee WC, Chang P, Tung LT, Hong M, Kwo J, Tsai W
Journal of Vacuum Science & Technology B, 26(3), 1132, 2008
6 Metal gate HfO2 metal-oxide-semiconductor structures on InGaAs substrate with varying Si interface passivation layer and postdeposition anneal condition
Ok I, Kim H, Zhang M, Zhu F, Park S, Yum J, Koveshnikov S, Tsai W, Tokranov V, Yakimov M, Oktyabrsky S, Lee JC
Journal of Vacuum Science & Technology B, 25(4), 1491, 2007
7 Effect of postdeposition anneal conditions on defect density of HfO2 layers measured by wet etching
Claes M, De Gendt S, Witters T, Kaushik V, Conard T, Zhao C, Manabe Y, Delabie A, Rohr E, Chen J, Tsai W, Heyns MM
Journal of the Electrochemical Society, 151(11), F269, 2004
8 Simulation of Uniformity and Lifetime Effects in Collimated Sputtering
Tait RN, Dew SK, Tsai W, Hodul D, Smy T, Brett MJ
Journal of Vacuum Science & Technology B, 14(2), 679, 1996
9 High Selectivity Plasma-Etching of Silicon Dioxide with a Dual-Frequency 27/2 MHz Capacitive Radio-Frequency Discharge
Tsai W, Mueller G, Lindquist R, Frazier B, Vahedi V
Journal of Vacuum Science & Technology B, 14(5), 3276, 1996
10 CONTRIBUTION OF THE COMBINED HEAT AND POWER PROCESS TO THE CO2 REDUCTION IN COMPARISON WITH OTHER OPTIONS
ARDONE A, FICHTNER W, TSAI W, WIETSCHEL M, RENTZ O
Brennstoff-Warme-Kraft, 47(6), 247, 1995