검색결과 : 46건
No. | Article |
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1 |
Effects of chemical mechanical planarization slurry additives on the agglomeration of alumina nanoparticles II: Aggregation rate analysis Brahma N, Talbot JB Journal of Colloid and Interface Science, 419, 25, 2014 |
2 |
Effects of CMP slurry additives on the agglomeration of alumina nanoparticles 1: General aggregation rate behavior Brahma N, Talbot JB Journal of Colloid and Interface Science, 419, 56, 2014 |
3 |
Electrophoretic Deposition of Nano- and Micron-Sized Ba2SiO4:Eu2+ Phosphor Particles Choi JI, Anc M, Piquette A, Hannah ME, Mishra KC, Talbot JB, McKittrick J Journal of the Electrochemical Society, 161(3), D111, 2014 |
4 |
Europium-Activated KSrPO4-(Ba,Sr)(2)SiO4 Solid Solutions as Color-Tunable Phosphors for Near-UV Light-Emitting Diode Applications Han JK, Hannah ME, Piquette A, Talbot JB, Mishra KC, McKittrick J Journal of the American Ceramic Society, 96(5), 1526, 2013 |
5 |
The Effect of Nanoparticles on Mass Transfer for an Impinging Jet Electrode Sirajuddin S, Talbot JB Journal of the Electrochemical Society, 158(9), D557, 2011 |
6 |
Influence of hydrodynamics and pulse plating parameters on the electrocodeposition of nickel-alumina nanocomposite films Thiemig D, Bund A, Talbot JB Electrochimica Acta, 54(9), 2491, 2009 |
7 |
Patterned Electroless Nickel Plating on a Tacky Photopolymer Petrov AS, Talbot JB Journal of the Electrochemical Society, 156(3), D92, 2009 |
8 |
Study of Luminescence from GaN:Tb3+ Powders and Thin Films Deposited by MOVPE and PLD Methods Tao JH, Laski J, Perea-Lopez N, Shimizu S, McKittrick J, Talbot JB, Mishra KC, Hamby DW, Raukas M, Klinedinst K, Hirata G Journal of the Electrochemical Society, 156(6), J158, 2009 |
9 |
Effect of CMP slurry chemistry on copper nanohardness Ihnfeldt R, Talbot JB Journal of the Electrochemical Society, 155(6), H412, 2008 |
10 |
A study of oxygen content in GaN, AlN, and GaAlN powders Tao JH, Perea-Lopez N, McKittrick J, Talbot JB, Han B, Raukas M, Klinedinst K, Mishra KC Journal of the Electrochemical Society, 155(6), J137, 2008 |