검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Wetting process of copper filling in through silicon vias Zhang JH, Luo W, Li Y, Gao LM, Li M Applied Surface Science, 359, 736, 2015 |
| 2 |
세라믹 방열 복합체의 열전도도 분석 및 Wetting Process를 이용한 SiC/에폭시 복합체 황용선, 김주헌, 조원철 Polymer(Korea), 38(6), 782, 2014 |
| 3 |
Wetting process of electrolyte in high density Cu/Sn micro-bumps electrodepositing Bi JL, Ling HQ, Hu AM, Hang T, Li M Applied Surface Science, 257(8), 3723, 2011 |