| 1 |
Evaluation of coating rate and adhesive force for copper deposition on the surface of polypropylene
Fulazzaky MA, Fulazzaky M, Sumeru K
Journal of Adhesion Science and Technology, 33(13), 1438, 2019 |
| 2 |
Direct Micropatterning of Initiator Layers for Surface-initiated ATRP: Spatially-regulated Growth of Polymer Brush and Subsequent Copper Electroless Plating
Sato T, Urata C
Molecular Crystals and Liquid Crystals, 688(1), 98, 2019 |
| 3 |
Electrochemical and stress characteristics of SiO/Cu/expanded graphite composite as anodes for lithium ion batteries
Zhang JZ, Zhang J, Bao TZ, Xie XH, Xia BJ
Journal of Power Sources, 348, 16, 2017 |
| 4 |
Higher-resolution selective metallization on alumina substrate by laser direct writing and electroless plating
Lv M, Liu JG, Wang SH, Ai J, Zeng XY
Applied Surface Science, 366, 227, 2016 |
| 5 |
Electromagnetic shielding effectiveness and serviceability of the multilayer structured cuprammonium fabric/polypyrrole/copper (CF/PPy/Cu) composite
Zhao H, Hou L, Lu YX
Chemical Engineering Journal, 297, 170, 2016 |
| 6 |
High-adhesion Cu patterns fabricated by nanosecond laser modification and electroless copper plating
Lv M, Liu JG, Zeng XY, Du QF, Ai J
Applied Surface Science, 353, 1150, 2015 |
| 7 |
Adhesion improvement of electroless copper plating on phenolic resin matrix composite through a tin-free sensitization process
Wang Y, Bian C, Jing XL
Applied Surface Science, 271, 303, 2013 |
| 8 |
A study of the environmentally friendly polycarbonate surface etching system containing H2SO4-MnO2 colloid
Zhao WX, Li ZX, Wang ZL
Journal of Adhesion Science and Technology, 27(13), 1455, 2013 |
| 9 |
Prevention of blister formation in electrolessly deposited copper film on organic substrates
Seo JW, Nam HS, Lee S, Won YS
Korean Journal of Chemical Engineering, 29(4), 529, 2012 |
| 10 |
The effect of nickel on the strain evolution in chemical copper films
Bamberg S, Perry LK, Muir B, Abuzir A, Bruning F, Bruning R
Thin Solid Films, 520(23), 6935, 2012 |
