검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Annealing effect of platinum-based electrodes on physical properties of PZT thin films Jeong YS, Lee HU, Lee SA, Kim JP, Kim HG, Jeong SY, Cho CR Current Applied Physics, 9(1), 115, 2009 |
| 2 |
Effect of Ru crystal orientation on the adhesion characteristics of Cu for ultra-large scale integration interconnects Kim H, Koseki T, Ohba T, Ohta T, Kojima Y, Sato H, Hosaka S, Shimogaki Y Applied Surface Science, 252(11), 3938, 2006 |
| 3 |
Ti glue layer, Boron dopant, N 2 plasma 처리들이 Cu와 low-k 접착력에 미치는 효과 이섭, 이재갑 Korean Journal of Materials Research, 13(5), 338, 2003 |