검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Effect of a Multi-Step Gap-Filling Process to Improve Adhesion between Low-K Films and Metal Patterns Lee W, Kim TH, Choa YH Korean Journal of Materials Research, 26(8), 427, 2016 |
| 2 |
Inter-metal inorganic spin-on-glass dielectric layer in 100 nm generation technology Da Cheng M, Luoh T, Su CT, Yang TH, Chen KC, Lu CY Thin Solid Films, 516(23), 8726, 2008 |
| 3 |
A novel multi-level interconnect scheme with air as low K inter-metal dielectric for ultradeep submicron application Chen CH, Fang YK, Lin CS, Yang CW, Hsieh JC Solid-State Electronics, 45(1), 199, 2001 |
| 4 |
Plasma enhanced chemical vapor deposition of thermally stable and low-dielectric-constant fluorinated amorphous carbon films using low-global-warming-potential gas C5F8 Shirafuji T, Kamisawa A, Shimasaki T, Hayashi Y, Nishino S Thin Solid Films, 374(2), 256, 2000 |