검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
A Study on the Bonding Process of Cu Bump/Sn/Cu Bump Bonding Structure for 3D Packaging Applications Lee B, Park J, Jeon SJ, Kwon KW, Lee HJ Journal of the Electrochemical Society, 157(4), H420, 2010 |
| 2 |
Micro-electron-beam welding with a modified scanning electron microscopy: Findings and prospects Reisgen U, Dorfmuller T Journal of Vacuum Science & Technology B, 27(3), 1310, 2009 |