| 1 |
Lateral Crystallization Velocity in Explosive Crystallization of Amorphous Silicon Films Induced by Flash Lamp Annealing
Ohdaira K, Tomura N, Ishii S, Matsumura H
Electrochemical and Solid State Letters, 14(9), H372, 2011 |
| 2 |
Effects of LiPON Thin-Film Coating on Thermal Behavior of Delithiated Li1-x(Ni0.53Co0.2Mn0.27)O-2 Cathode
Park YS, Choi KH, Park HK, Lee SM
Journal of the Electrochemical Society, 157(7), A850, 2010 |
| 3 |
Electrostatic quadrupole plasma mass spectrometer measurements during thin film depositions using simultaneous matrix assisted pulsed laser evaporation and magnetron sputtering
Hunter CN, Check MH, Muratore C, Voevodin AA
Journal of Vacuum Science & Technology A, 28(3), 419, 2010 |
| 4 |
Surface topography and physicochemistry of silver containing titanium nitride nanocomposite coatings
Whitehead K, Kelly P, Li HQ, Verran J
Journal of Vacuum Science & Technology B, 28(1), 180, 2010 |
| 5 |
Fabrication and electron field-emission properties of titanium oxide nanowire on glass substrate
Wakaya F, Miki M, Fukuyama C, Murakami K, Abo S, Takai M
Journal of Vacuum Science & Technology B, 28(2), C2B24, 2010 |
| 6 |
Luminescent characteristics in blue-emitting Bi-activated multicomponent oxide phosphor thin films
Minami T, Miyata T, Ishino J, Sahara K
Journal of Vacuum Science & Technology B, 28(2), C2B56, 2010 |
| 7 |
Planarization of high aspect ratio p-i-n diode pillar arrays for blanket electrical contacts
Voss LF, Shao Q, Reinhardt CE, Graff RT, Conway AM, Nikolic RJ, Deo N, Cheung CL
Journal of Vacuum Science & Technology B, 28(5), 916, 2010 |
| 8 |
Changing Superfilling Mode for Copper Electrodeposition in Blind Holes from Differential Inhibition to Differential Acceleration
Luhn O, Radisic A, Vereecken PM, Van Hoof C, Ruythooren W, Celis JP
Electrochemical and Solid State Letters, 12(5), D39, 2009 |
| 9 |
Effect of Nitrogen Flow Ratios on the Microstructure and Properties of Ta-Al-N Thin Films by Reactive Cosputtering
Chung CK, Chen TS
Journal of the Electrochemical Society, 156(2), H119, 2009 |
| 10 |
Failure Mechanism of 5 nm Thick Ta-Si-C Barrier Layers Against Cu Penetration at 750-800 degrees C
Fang JS, Chiu CF, Lin JH, Lin TY, Chin TS
Journal of the Electrochemical Society, 156(2), H147, 2009 |
