| 1333 - 1333 |
Untitled
Mittal K |
| 1335 - 1337 |
Untitled
da Silva LFM |
| 1339 - 1354 |
Microwave Performance of Flip Chip Interconnects With Anisotropic and Non-conductive Films
Kim JW, Lee YC, Ko JH, Nah W, Jeong MY, Kwon HC, Jung SB |
| 1355 - 1364 |
Evaluation of Thermal and Hygro-Thermal Behaviors of Flip Chip Packages With a Non-conductive Paste
Noh BI, Lee JB, Kim JW, Jung SB |
| 1365 - 1378 |
A New Finite Element Formulation for Thin Non-Homogeneous Heat-Conducting Adhesive Layers
Ochsner A, Mishuris G |
| 1379 - 1386 |
Measurement of Adhesion Force by a Symmetric AFM Probe for Nano-imprint Lithography Application
Lee HJ, Hyun S, Kim JH, Lee HJ, Choi DG, Lee DI, Jeong JH, Lee ES |
| 1387 - 1400 |
Molecular Dynamics Simulation of Polymer-Metal Bonds
Suarez JC, Miguel S, Pinilla P, Lopez F |
| 1401 - 1423 |
Curing Behavior and Adhesion Performance of UV-Curable Styrene-Isoprene-Styrene-Based Pressure-Sensitive Adhesives
Park YJ, Lim DH, Kim HJ, Joo HS, Do HS |
| 1425 - 1442 |
Surface Modification of Low Density Polyethylene (LDPE) Film Using Corona Discharge Plasma for Technological Applications
Pascual M, Sanchis R, Sanchez L, Garcia D, Balart R |
| 1443 - 1459 |
The Effect of Surface Modification of Silica Microfillers in an Epoxy Matrix on the Thermo-mechanical Properties
Olmos D, Baselga J, Mondragon I, Gonzalez-Benito J |
| 1461 - 1475 |
Influence of Silanisation Parameters With gamma-Methacryloxypropyltrimethoxysilane on Durability of Aluminium/Acrylic Adhesive Joints
Del Real JC, de Santayana MC, Abenojar J, Pantoja M, Martinez MA |
| 1477 - 1494 |
Parametric Study of Adhesively Bonded Single Lap Joints by the Taguchi Method
da Silva LFM, Critchlow GW, Figueiredo MAV |
| 1495 - 1522 |
Peel Behaviour of Aircraft Fuel Tank Sealants: the Effect of Peel Angle, Sealant Layer Thickness and Peel Rate
Giannis S, Adams RD, Clark LJ, Taylor MA |
| 1523 - 1540 |
Identification of the Strain Rate Parameters for Structural Adhesives
Fancello E, Goglio L, Stainier L, Vassoler JM |
| 1541 - 1563 |
On Modelling the Non-linear Behaviour of Thin Adhesive Films in Bonded Assemblies With Interface Elements
Creac'hcadec R, Cognard JY, Heuze T |
| 1565 - 1591 |
Computational Modelling of the Residual Strength of Repaired Composite Laminates Using a Cohesive Damage Model
Campilho RDSG, de Moura MFSF, Domingues JJMS, Morais JJL |
