1473 - 1473 |
PAPERS SELECTED FROM THE INTERNATIONAL SEMICONDUCTOR DEVICE RESEARCH SYMPOSIUM 2007-ISDRS 2007 Foreword Iliadis AA, Richter C |
1474 - 1481 |
Impact of source-to-drain tunnelling on the scalability of arbitrary oriented alternative channel material nMOSFETs Rafhay Q, Clerc R, Ghibaudo G, Pananakakis G |
1482 - 1485 |
Design and optimization of the SOI field effect diode (FED) for ESD protection Yang Y, Salman AA, Ioannou DE, Beebe SG |
1486 - 1490 |
Capacitance modeling of short-channel double-gate MOSFETs Borli H, Kolberg S, Fjeldly TA |
1491 - 1497 |
Characterization of scaled MANOS nonvolatile semiconductor memory (NVSM) devices Wang G, White MH |
1498 - 1504 |
Fabrication and characterization of fin SONOS flash memory with separated double-gate structure Yun JG, Kim Y, Park IH, Lee JH, Kang S, Lee DH, Cho S, Kim DH, Lee GS, Sim WB, Son Y, Shin H, Lee JD, Park BG |
1505 - 1511 |
Vertical silicon-on-nothing FET: Threshold voltage calculation using compact capacitance model Svilicic B, Jovanovic V, Suligoj T |
1512 - 1517 |
Characteristics and thermal stability of MOS devices with MoN/TiN and TiN/MoN metal gate stacks Fu CH, Chien PY, Chang-Liao KS, Wang TK, Wu WF |
1518 - 1524 |
Impacts of a buffer layer and hydrogen-annealed wafers on the performance of strained-channel nMOSFETs with SiN-capping layer Tsai TI, Lin HC, Lee YJ, Chen KS, Wang J, Hsueh FK, Chao TS, Huang TY |
1525 - 1529 |
New EEPROM concept for single bit operation Raguet JR, Laffont R, Bouchakour R, Bidal V, Regnier A, Mirabel JM |
1530 - 1535 |
Characterization of CoxNiyO hybrid metal oxide nanoparticles as charge trapping nodes in nonvolatile memory devices Cheng CL, Liu CW, Chang-Liao KS, Tsai PH, Jeng JT, Huang SW, Dai BT |
1536 - 1541 |
Impact of high-kappa dielectric and metal nanoparticles in simultaneous enhancement of programming speed and retention time of nano-flash memory Pavel AA, Khan MA, Kirawanich P, Islam NE |
1542 - 1549 |
Sensitivity of static noise margins to random dopant variations in 6-T SRAM cells Oniciuc L, Andrei P |
1550 - 1554 |
An experimental method allowing quantifying and localizing failed cells of an EEPROM CAST after a retention test Le Roux C, Lopez L, Firiti A, Ogier JL, Lalande F, Laffont R, Micolau G |
1555 - 1562 |
Band gap engineered resistor for mitigating linear energy transfer sensitivities in scaled submiron CMOS technology SRAM cells Kanyogoro E, Peckerar M, Hughes H, Liu M |
1563 - 1568 |
Two-band k center dot p model for the conduction band in silicon: Impact of strain and confinement on band structure and mobility Sverdlov V, Karlowatz G, Dhar S, Kosina H, Selberherr S |
1569 - 1572 |
The role of carbon on performance of strained-Si:C surface channel NMOSFETs Lee MH, Chang ST, Maikap S, Huang CF |
1573 - 1577 |
Novel SONOS - type nonvolatile memory device with stacked tunneling and charge trapping layers Tsai PH, Chang-Liao KS, Wu TY, Wang TK, Tzeng PJ, Lin CH, Lee LS, Tsai MJ |
1578 - 1583 |
NEMS switch with 30 nm-thick beam and 20 nm-thick air-gap for high density non-volatile memory applications Jang WW, Yoon JB, Kim MS, Lee JM, Kim SM, Yoon EJ, Cho KH, Lee SY, Choi IH, Kim DW, Park D |
1584 - 1588 |
Impacts of SiN deposition parameters on n-channel metal-oxide-semiconductor field-effect-transistors Lu CS, Lin HC, Huang TY |
1589 - 1593 |
Latch-up effects in CMOS inverters due to high power pulsed electromagnetic interference Kim K, Iliadis AA |
1594 - 1601 |
Effects of mechanical strain on laser crystallized polysilicon thin film transistors and ring oscillators fabricated on stainless steel foil Jamshidi-Roudbari A, Kuo PC, Hatalis M |
1602 - 1605 |
High-speed thermal analysis of high power diode arrays Rada N, Triplett G, Graham S, Kovaleski S |
1606 - 1609 |
A 2D non-parabolic six-moments model Vasicek M, Cervenka J, Wagner M, Karner M, Grasser T |
1610 - 1614 |
Gate dielectric engineering of quarter sub micron AlGaN/GaN MISHFET: A new device architecture for improved transconductance and high cut-off frequency Aggarwal R, Agrawal A, Gupta M, Gupta RS |
1615 - 1618 |
Self-aligned inversion n-channel In0.2Ga0.8As/GaAs metal-oxide-semiconductor field-effect-transistors with TiN gate and Ga2O3(Gd2O3) dielectric Chen CP, Lin TD, Lee YJ, Chang YC, Hong M, Kwo J |
1619 - 1624 |
Auxiliary components for kilopixel transition edge sensor arrays Brown AD, Chuss D, Mikula V, Henry R, Wollack E, Zhao Y, Hilton GC, Chervenak JA |
1625 - 1630 |
Modeling and design of a monolithically integrated power converter on SiC Yu LC, Sheng K, Zhao JH |
1631 - 1635 |
Challenges in SiC power MOSFET design Matocha K |
1636 - 1646 |
Demonstration of the first SiC power integrated circuit Sheng K, Zhang YX, Su M, Zhao JH, Li XQ, Alexandrov P, Fursin L |
1647 - 1651 |
Amorphous SiC as a structural layer in microbridge-based RF MEMS switches for use in software-defined radio Parro RJ, Scardelletti MC, Varaljay NC, Zimmerman S, Zorman CA |
1652 - 1659 |
Proton-induced SEU in SiGe digital logic at cryogenic temperatures Sutton AK, Moen K, Cressler JD, Carts MA, Marshall PW, Pellish JA, Ramachandran V, Reed RA, Alles ML, Nju G |
1660 - 1668 |
Efficient simulation of hole transport in strained Si and SiGe on insulator inversion layers Pham AT, Jungemann C, Klawitter M, Meinerzhagen B |
1669 - 1673 |
Tuning nonlinear susceptibility in strained AlGaAs/InGaAs quantum cascade lasers Roberts D, Triplett G |
1674 - 1679 |
Characteristic temperature of a tunneling-injection quantum dot laser: Effect of out-tunneling from quantum dots Han DS, Asryan LV |
1680 - 1686 |
An empirical study of dynamic properties of an individual carbon nanotube electron source system Ribaya BP, Niemann DL, Makarewicz J, Gunther NG, Nguyen CV, Rahman M |