1131 - 1131 |
3rd International Workshop on Ultimate Integration of Silicon - March 7-8, 2002, Munich, Germany - Foreword Risch L |
1133 - 1139 |
Strained SiCMOS (SS CMOS) technology: opportunities and challenges Rim K, Anderson R, Boyd D, Cardone F, Chan K, Chen H, Christansen S, Chu J, Jenkins K, Kanarsky T, Koester S, Lee BH, Lee K, Mazzeo V, Mocuta A, Mocuta D, Mooney PM, Oldiges P, Ott J, Ronsheim P, Roy R, Steegen A, Yang M, Zhu H, Ieong M, Wong HSP |
1141 - 1145 |
Quantum corrections in the simulation of decanano MOSFETs Asenov A, Brown AR, Watling JR |
1147 - 1153 |
Characterization of effective mobility by split C(V) technique in N-MOSFETs with ultra-thin gate oxides Lime F, Guiducci C, Clerc R, Ghibaudo G, Leroux C, Ernst T |
1155 - 1160 |
Static and low frequency noise characterization in surface- and buried-mode 0.1 mu m PMOSFETS Fadlallah M, Ghibaudo G, Jomaah J, Guegan G |
1161 - 1165 |
The impact of short channel and quantum effects on the MOS transistor mismatch Difrenza R, Llinares P, Ghibaudo G |
1167 - 1171 |
A new model for the current factor mismatch in the MOS transistor Difrenza R, Llinares P, Ghibaudo G |
1173 - 1177 |
High performance Si/SiGe pMOSFETs fabricated in a standard CMOS process technology Collaert N, Verheyen P, De Meyer K, Loo R, Caymax M |
1179 - 1182 |
High frequency n-type MODFETs on ultra-thin virtual SiGe substrates Hackbarth T, Herzog HJ, Rinaldi F, Soares T, Hollander B, Mantl S, Luysberg M, Fichtner PFP |
1183 - 1186 |
Fabrication of Schottky barrier MOSFETs on SOI by a self-assembly COSi2-patterning method Zhao QT, Kluth P, Winnerl S, Mantl S |
1187 - 1192 |
Simulation of the Esaki-tunneling FET Wang PF, Nirschl T, Schmitt-Landsiedel D, Hansch W |
1193 - 1198 |
Simulation and optimization of EJ-MOSFETs Kittler M, Granzner R, Schwierz F, Henschel W, Wahlbrink T, Kurz H |
1199 - 1203 |
Design considerations for fully depleted SOI transistors in the 25-50 nm gate length regime Luyken RJ, Schulz T, Hartwich J, Dreeskornfeld L, Stadele M, Rosner W |
1205 - 1211 |
Evaluation of circuit performance of ultra-thin-body SOICMOS Pacha C, Schmal A, Schulz T, Gottsche R, Steinhogl W |
1213 - 1218 |
Shrinking from 0.25 down to 0.12 mu m SOICMOS technology node: a contribution to low-frequency noise in partially depleted N-MOSFETs Dieudonne F, Haendler S, Jomaah J, Balestra F |
1219 - 1225 |
Two-dimensional modeling of quantum ballistic transport in ultimate double-gate SOI devices Munteanu D, Autran JL |
1227 - 1231 |
Ag metallization with high electromigration resistance for ULSI Hauder M, Hansch W, Gstottner J, Schmitt-Landsiedel D |
1233 - 1236 |
Electrical characterization of copper interconnects with end-of-roadmap feature sizes Schindler G, Steinlesberger G, Engelhardt M, Steinhogl W |
1237 - 1241 |
Processing technology for the investigation of sub-50 nm copper damascene interconnects Steinlesberger G, Engelhardt M, Schindler G, Kretz J, Steinhogl W, Bertagnolli E |
1243 - 1248 |
Impact of parasitic elements on the performance of digital CMOS circuits with Gigabit feature size Schwantes S, Gottsche R, Krautschneider W |