1171 - 1174 |
Effect of fabrication process on the charge trapping behavior of SiON thin films Wang SY, Lue HT, Lai EK, Yang LW, Gong J, Chen KC, Hsieh KY, Ku J, Lu CY |
1175 - 1177 |
In0.75Ga0.25As channel layers with record mobility exceeding 12,000 cm(2)/Vs for use in high-kappa dielectric NMOSFETs Droopad R, Rajagopalan K, Abrokwah J, Canonico M, Passlack M |
1178 - 1182 |
Modelling of semiconductor diodes made of high defect concentration, irradiated, high resistivity and semi-insulating material: The capacitance-voltage characteristics Saadoune A, Dehimi L, Sengouga N, McPherson M, Jones BK |
1183 - 1188 |
Edge termination strategies for a 4 kV 4H-SiC thyristor Brosselard P, Planson D, Scharnholz S, Raynaud C, Zorngiebel V, Lazar M, Chante JP, Spahn E |
1189 - 1193 |
Investigation of oxygen annealing effects on RF sputter deposited SiC thin films Todi RM, Sundaram KB, Warren AP, Scammon K |
1194 - 1200 |
An investigation of the effects of radiation exposure on stability constraints in epitaxial SiGe strained layers Chen TB, Sutton AK, Haugerud BM, Henderson W, Prakash APG, Cressler JD, Doolittle A, Liu XF, Joseph A, Marshall PW |
1201 - 1205 |
A novel high performance insulated gate bipolar transistor Zhang F, Shi LN, Li CF |
1206 - 1211 |
Device-partition method using equivalent-circuit model in three-dimensional device simulation Chang CC, Li SJ, Tsai YT |
1212 - 1215 |
Iridium-based semi-transparent current spreading layer on short-period-superlattice (SPS) tunneling contact of InGaN/GaN LEDs Chuang RW, Chiu YJ, Yu CL |
1216 - 1218 |
Full-swing pentacene organic inverter with enhancement-mode driver and depletion-mode load Lee CA, Jin SH, Jung KD, Lee JD, Park BG |
1219 - 1226 |
Impact of device scaling on the 1/f noise performance of deep submicrometer thin gate oxide CMOS devices Chew KW, Yeo KS, Chu SFS, Cheng M |
1227 - 1233 |
Influence of different deposition conditions of top and bottom electrode on the reliability of Sr0.8Bi2.2Ta2O9 ferroelectric capacitors Goux L, Xu Z, Paraschiv V, Lisoni JG, Maes D, Haspeslagh L, Groeseneken G, Wouters DJ |
1234 - 1237 |
Simple parameter extraction method for illuminated solar cells Chegaar M, Azzouzi G, Mialhe P |
1238 - 1243 |
Carrier transport mechanisms and photovoltaic properties of Au/p-ZnPc/Al device Aziz MS |
1244 - 1251 |
Modeling and optimization of series resistance of planar MIM capacitors Bajolet A, Clerc R, Pananakakis G, Picollet E, Segura N, Boret S, Bruyere S, Manceau JP, Giraudin JC, Delpech P, Montes L, Ghibaudo G |
1252 - 1260 |
Analytical modeling of CMOS circuit delay distribution due to concurrent variations in multiple processes Harish BP, Bhat N, Patil MB |
1261 - 1268 |
C-infinity-continuous high-temperature model for low-doped accumulation mode silicon-on-insulator pMOSFETs Houk Y, Iniguez B, Flandre D, Nazarov A |
1269 - 1275 |
Determination of the interface properties of Ni-silicided strained-Si/SiGe heterostructure Schottky diodes using capacitance-voltage technique Saha AR, Chattopadhyay S, Das R, Bose C, Maiti CK |
1276 - 1282 |
An explicit analytical charge-based model of undoped independent double gate MOSFET Reyboz M, Rozeau O, Poiroux T, Martin P, Jomaah J |
1283 - 1290 |
Design and simulation of integrated inductors on porous silicon in CMOS-compatible processes Contopanagos H, Nassiopoulou AG |
1291 - 1298 |
A study on the synthesis from Li2CO3, NiO and Co3O4 and the electrochemical properties of cathode materials LiNi1-yCoyO2 for lithium secondary battery Park HR, Yoon SD |
1299 - 1309 |
An explicit surface-potential-based MOSFET model incorporating the quantum mechanical effects Basu D, Dutta AK |
1310 - 1314 |
Electronic properties of Ge nanocrystals for non volatile memory applications Kanoun M, Busseret C, Poncet A, Souifi A, Baron T, Gautier E |
1315 - 1319 |
Charge transport mechanism of Al/Bi2Te3/Al thin film devices Dheepa J, Sathyamoorthy R, Sebastian PJ |
1320 - 1329 |
Surface-potential solutions to the Pao-Sah voltage equation Shangguan WZ, Saeys M, Zhou X |
1330 - 1336 |
Low optical power characterization of a base current-biased four-terminal dual-emitter heterojunction phototransistor Chen WT, Chen HR, Hsu MK, Chiu SY, Chen GH, Chang YC, Lour WS |
1337 - 1340 |
Drivability improvement in Schottky barrier source/drain MOSFETs with strained-Si channel by Schottky barrier height reduction Zhu SY, Li MF |
1341 - 1348 |
A carbon nanotube field effect transistor with tunable conduction-type by electrostatic effects Chen BH, Wei JH, Lo PY, Wang HH, Lai MJ, Tsai MJ, Chao TS, Lin HC, Huang TY |
1349 - 1354 |
Microwave dielectric properties of (1-x)(Mg0.95Co0.05)-TiO3-xCa(0.6)La(0.8/3)TiO(3) ceramics with V2O5 addition Huang CL, Wang JJ |
1355 - 1358 |
Growth and characterization of indium oxide diodes prepared by reactive magnetron sputtering Chen LC, Liu SC |
1359 - 1367 |
Design of single-gate n-channel and p-channel MOSFETs with enhanced current-drive due to simultaneous switching of front and back channels in SOICMOS technology Bindu B, Lakshmi N, Bhat KN, DasGupta A |
1368 - 1370 |
High power 4H-SiC pin diodes (10 kV class) with record high carrier lifetime Ivanov PA, Levinshtein ME, Palmour JW, Das MK, Hull BA |
1371 - 1374 |
A new analytic approximation to general diode equation He J, Fang M, Li B, Cao Y |
1375 - 1381 |
A new analytic method to design multiple floating field limiting rings of power devices He J, Chan MS, Zhang X, Wang YY |
1382 - 1388 |
Elastic and optical properties of BeS, BeSe and BeTe under pressure Khenata R, Bouhemadou A, Hichour M, Baltache H, Rached D, Rerat M |
1389 - 1394 |
Application of PVD silver for integrated microwave passives in silicon technology Levenets VV, Amaya RE, Tarr NG, Smy TJ |
1395 - 1399 |
An improved junction capacitance model for junction field-effect transistors Ding H, Liou JJ, Cirba CR, Green K |
1400 - 1405 |
Rapid and precise calculations of energy and particle flux for detailed-balance photovoltaic applications Levy MY, Honsberg C |
1406 - 1412 |
Fabrication and analysis of high-efficiency String Ribbon Si solar cells Nakayashiki K, Rousaville B, Yelundur V, Kirn DS, Rohati A, Clark-Phelps R, Hanoka JI |
1413 - 1419 |
Energy band alignment and interface states in AlGaN/4H-SiC vertical heterojunction diodes Johnson BJ, Capano MA, Mastro MA |
1420 - 1424 |
Band gap widening and narrowing in moderately and heavily doped n-ZnO films Jain A, Sagar P, Mehra RM |
1425 - 1429 |
Structural properties of alloyed Ti/Al/Ti/Au and Ti/Al/Mo/Au ohmic contacts to AlGaN/GaN Vertiatchikh A, Kaminsky E, Teetsov J, Robinson K |
1430 - 1439 |
Dependence of low frequency noise in SiGe heterojunction bipolar transistors on the dimensional and structural features of extrinsic regions Ul Hoque MM, Celik-Butler Z, Martin S, Knorr C, Bulucea C |
1440 - 1449 |
Physical modeling of degenerately doped compound semiconductors for high-performance HBT design Li JC, Sokolich M, Hussain T, Asbeck PM |
1450 - 1460 |
Universal MOSFET gate impedance model for 200 MHz-20 GHz frequency range Bandi SPR, Washburn C, Mukund PR, Kolnik J, Paradis K, Howard S, Burleson J |
1461 - 1465 |
Colloidal quantum dot active layers for light emitting diodes Pagan JG, Stokes EB, Patel K, Burkhart CC, Ahrens MT, Barletta PT, O'Steen M |
1466 - 1471 |
Minimization of MuGFET source/drain resistance using wrap-around NiSi-HDD contacts Dixit A, Anil KG, Collaert N, Zimmerman P, Jurczak M, De Meyer K |
1472 - 1474 |
Modeling for reduced gate capacitance of nanoscale MOSFETs Dai YH, Chen JN, Ke DM, Xu C, Sun JE |