1461 - 1461 |
Non volatile memories with discrete storage nodes - Foreword De Salvo B, Lombardo S |
1463 - 1473 |
Silicon nanocrystal based memory devices for NVM and DRAM applications Rao RA, Steimle RF, Sadd M, Swift CT, Hradsky B, Straub S, Merchant T, Stoker M, Anderson SGH, Rossow M, Yater J, Acred B, Harber K, Prinz EJ, White BE, Muralidhar R |
1475 - 1481 |
Engineering on tunnel barrier and dot surface in Si nanocrystal memories Baik SJ, Choi S, Chung UI, Moon JT |
1483 - 1488 |
Nanocrystal memories for FLASH device applications Ammendola G, Ancarani V, Triolo V, Bileci M, Corso D, Crupi I, Perniola L, Gerardi C, Lombardo S, DeSalvo B |
1489 - 1495 |
Spatial characterization of localized charge trapping and charge redistribution in the NROM device Shappir A, Levy D, Shacham-Diamand Y, Lusky E, Bloom I, Eitan B |
1497 - 1502 |
Study of nanocrystal memory reliability by CAST structures Compagnoni CM, Ielmini D, Spinelli AS, Lacaita AL, Gerardi C |
1503 - 1509 |
Growth and characterization of LPCVD Si quantum dots on insulators Baron T, Mazen F, Hartmann JM, Mur P, Puglisi RA, Lombardo S, Ammendola G, Gerardi C |
1511 - 1517 |
Silicon nanocrystal memory devices obtained by ultra-low-energy ion-beam synthesis Dimitrakis P, Kapetanakis E, Tsoukalas D, Skarlatos D, Bonafos C, Ben Asssayag G, Claverie A, Perego M, Fanciulli M, Soncini V, Sotgiu R, Agarwal A, Ameen M, Sohl C, Normand P |
1519 - 1524 |
Development of silicon nitride dots for nanocrystal memory cells Wan YM, Buffet N, van der Jeugd K, Mur P, Mariolle D, Nicotra G, Lombardo S |
1525 - 1530 |
Characterization of the spatial charge distribution in local charge-trapping memory devices using the charge-pumping technique Rosmeulen M, Breuil L, Lorenzini M, Haspeslag L, Van Houdt J, De Meyer K |
1531 - 1537 |
Characteristics of bonds produced by full ceramic and composite ultrasonic transducers Xu CH, Chan HLW, Ng WY, Cheung KYM, Liu PCK |
1539 - 1548 |
Derivation of Shockley-Read-Hall recombination rates in bulk and PD-SOI MOSFET's channels valid in all modes of operation Sallese JM, Krummenacher F, Fazan P |
1549 - 1553 |
Surface treatment for enhancing current gain of AlGaAs/GaAs heterojunction bipolar transistor Oh TK, Baek CH, Kang BK |
1555 - 1562 |
Theoretical limit estimation of lateral wide band-gap semiconductor power-switching device Saito W, Omura I, Ogura T, Ohashi H |
1563 - 1568 |
Electrical properties of thermally stable Pt/Re/Au ohmic contacts to p-type GaN Reddy VR, Kim SH, Song JO, Seong TY |
1569 - 1577 |
Silicon carbide TUNNETT diodes Buniatyan VV, Aroutiounian VM, Zekentes K, Camara N, Soukiassian P |
1579 - 1586 |
Investigation of defect properties in Cu(In,Ga)Se-2 solar cells by deep-level transient spectroscopy Kerr LL, Li SS, Johnston SW, Anderson TJ, Crisalle OD, Kim WK, Abushama J, Noufi RN |
1587 - 1595 |
High-voltage planar Si detectors for high-energy physics experiments: comparison between metal-overhang and field-limiting ring techniques Ranjan K, Bhardwaj A, Namrata, Chatterji S, Srivastava AK, Jha MK, Kumar A, Shivpuri RK |
1597 - 1600 |
GaN-based light-emitting diodes with Ni-Mg solid solution/Au p-type ohmic contact Song JO, Leem DS, Kim SH, Kwak JS, Nam OH, Park Y, Seong TY |
1601 - 1606 |
Prediction study of elastic properties under pressure effect for zincblende BN, AlN, GaN and InN Kanoun MB, Merad AE, Merad G, Cibert J, Aourag H |
1607 - 1612 |
Comparison of raised source/drain versus raised extension in ultra-thin body, fully-depleted-SOI, including effects of BEOL via capacitances Egley JL, Vandooren A, Winstead B, Verret E, Workman C, White B, Nguyen BY |
1613 - 1622 |
A unified analytical model for charge transport in Heterojunction Bipolar Transistors Reddy KV, DasGupta A |
1623 - 1627 |
The role of surface adsorbates on electrical properties of MOVPE grown HgCdTe onto (001) GaAs substrates Kim JS, Kim YH, Kim BK, Je HJ |
1629 - 1635 |
Effects of a trench under the gate in high voltage RESURF LDMOSFET for SOI power integrated circuits Son WS, Sohn YH, Choi SY |
1637 - 1641 |
Current gain increase by SiNx passivation in self-aligned InGaAs/InP heterostructure bipolar transistor with compositionally graded base Jin Z, Otten F, Reimann T, Neumann S, Prost W, Tegude FJ |
1643 - 1650 |
Characterization of symmetrical spiral inductor in 0.35 mu m CMOS technology for RF application Teo TH, Choi YB, Liao HL, Xiong YZ, Fu JS |
1651 - 1654 |
1.3 mu m compressive-strain GaInAsP/GaInAsP multiple- quantum-well laser diodes with a tensile-strain GaInP electron stopper layer Wu MY, Tsai CL, Wu MC, Lei PH, Ho CL, Ho WJ |
1655 - 1660 |
Realizing high breakdown voltages (> 600 V) in partial SOI technology Tadikonda R, Hardikar S, Narayanan EMS |
1661 - 1666 |
Quantum mechanical effect in temperature dependence of threshold voltage of extremely thin SOI MOSFETs Omura Y, Nakakubo A, Nakatsuji H |
1667 - 1672 |
An improved In-based ohmic contact to n-GaSb Robinson JA, Mohney SE |
1673 - 1677 |
Determination of optimal insulator thickness for MISiC hydrogen sensors Xu JP, Lai PT, Han B, Tang WM |
1679 - 1681 |
Photoelectromagnetic detector on the basis of CdxHg1-xTe Gaziyev FN, Huseynov EK |
1683 - 1686 |
Fabrication of GaAs Schottky diode by liquid phase chemical enhanced oxidation Wang CC, Huang HK, Wang YH, Houng MP, Wu CL, Chang CS |
1687 - 1690 |
Characteristics of low-energy nitrogen ion-implanted oxide and NO-annealed gate dielectrics Lee SC, Simoen E, Badenes G |