Journal of the Electrochemical Society

Journal of the Electrochemical Society, Vol.166, No.1 Entire volume, number list

ISSN: 0013-4651 (Print)

In this Issue (34 articles)

Y1 - Y1	Preface-Advances in Electrochemical Processes for Interconnect Fabrication in Integrated Circuits Akolkar R, Broekmann P
D3001 - D3005	Deposition of Copper Nanofilms by Surface-Limited Redox Replacement of Underpotentially Deposited Lead on Polycrystalline Gold Dornhof J, Urban GA, Kieninger J
D3006 - D3012	Effect of Reverse Pulse on Additives Adsorption and Copper Filling for Through Silicon Via Zhu QS, Zhang X, Liu CZ, Liu HY
D3013 - D3021	Pb Monolayer Mediated Thin Film Growth of Cu and Co: Exploring Different Concepts Wu D, Solanki DJ, Joi A, Dordi Y, Dole N, Litvnov D, Brankovic SR
D3022 - D3034	Bottom-up Filling of Damascene Trenches with Gold in a Sulfite Electrolyte Josell D, Moffat TP
D3035 - D3041	Aluminum Electrochemical Nucleation and Growth onto a Glassy Carbon Electrode from a Deep Eutectic Solvent Rodriguez-Clemente E, Manh TL, Guinto-Pano CE, Romero-Romo M, Mejia-Caballero I, Morales-Gil P, Palacios-Gonzalez E, Ramirez-Silva MT, Palomar-Pardave M
D3042 - D3048	Modeling of the Coadsorption of Chloride and Hydrogen Ions on Copper Electrode Surface Yang HL, Dianat A, Bobeth M, Cuniberti G
D3049 - D3057	Review-In-Situ Surface X-ray Diffraction Studies of Copper Electrodes: Atomic-Scale Interface Structure and Growth Behavior Grunder Y, Stettner J, Magnussen OM
D3058 - D3065	Observation of the Behavior of Additives in Copper Electroplating Using a Microfluidic Device Akita T, Tomie M, Ikuta R, Egoshi H, Hayase M
D3066 - D3071	Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology Menk LA, Josell D, Moffat TP, Baca E, Blain MG, Smith A, Dominguez J, McClain J, Yeh PD, Hollowell AE
D3072 - D3096	Review-Management of Copper Damascene Plating Carpio R, Jaworski A
D3097 - D3099	Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect Zhu QS, Zhang X, Li SJ, Liu CZ, Li CF
D3100 - D3109	Annealing and Impurity Effects in Co Thin Films for MOL Contact and BEOL Metallization Kelly J, Kamineni V, Lin X, Pacquette A, Hopstaken M, Liang Y, Amanapu H, Peethala B, Jiang L, Demarest J, Shobha H, Raymond M, Haran B
D3110 - D3119	Aspects and Modeling of Oscillatory Acid Copper Electroplating Haubner K, Fischer T, Brunner H, Pohlmann L, Donner C
D3120 - D3128	NTBC and MTT Reduction Electrochemistry: Impact on Cu Superconformal Plating for Fabrication of Glass Interposers Li JX, Dimitrov N
D3129 - D3135	Differential Inhibition during Cu Electrodeposition on Ru: Combined Electrochemical and Real-Time TEM Studies Vereecken PM, Radisic A, Ross FM
D3136 - D3141	Mechanism of Cobalt Bottom-Up Filling for Advanced Node Interconnect Metallization Wu J, Wafula F, Branagan S, Suzuki H, van Eisden J
D3142 - D3154	Pulsed Galvanostatic Electrodeposition of Copper on Cobalt Using a pH-Neutral Plating Bath and Electroless Seeds Simpson DE, Johnson CA, Roy D
D3155 - D3157	Communication-Defect-Free Filling of High Aspect Ratio Through Vias in Ultrathin Glass Chang YH, Tseng PL, Lin JC, Chen JC, Huang MC, Lin HY, Pollard S, Mazumder P
D3158 - D3166	Epitaxial Bonding and Transfer Processes for Large-Scale Heterogeneously Integrated Electronic-Photonic Circuitry Carlson JA, Williams CG, Ganjoo M, Dallesasse JM
D3167 - D3174	The Critical Role of pH Gradient Formation in Driving Superconformal Cobalt Deposition Rigsby MA, Brogan LJ, Doubina NV, Liu YH, Opocensky EC, Spurlin TA, Zhou J, Reid JD
D3175 - D3181	Effects of Dimethylglyoxime and Cyclohexane Dioxime on the Electrochemical Nucleation and Growth of Cobalt Hu Y, Huang Q
D3182 - D3189	Modeling of Dendrite Formation as a Consequence of Diffusion-Limited Electrodeposition Lupo C, Schlettwein D
D3190 - D3199	Review-Laser Ablation Ionization Mass Spectrometry (LIMS) for Analysis of Electrodeposited Cu Interconnects Grimaudo V, Moreno-Garcia P, Riedo A, Lopez AC, Tulej M, Wiesendanger R, Wurz P, Broekmann P
D3200 - D3204	High-Resolution Nanoprinting Approach through Self-Driven Electrodeposition Feng ZG, Xie YY, Georgescu NS
D3205 - D3211	Palladium Nanoparticles Electrodeposition onto Glassy Carbon from a Deep Eutectic Solvent at 298 K and Their Catalytic Performance toward Formic Acid Oxidation Espino-Lopez IE, Romero-Romo M, de Oca-Yemha MGM, Morales-Gil P, Ramirez-Silva MT, Mostany J, Palomar-Pardave M
D3212 - D3218	The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni Rao Z, Hearne SJ, Chason E
D3219 - D3225	Review-Ruthenium as Diffusion Barrier Layer in Electronic Interconnects: Current Literature with a Focus on Electrochemical Deposition Methods Bernasconi R, Magagnin L
D3226 - D3231	Galvanostatic Plating with a Single Additive Electrolyte for Bottom-Up Filling of Copper in Mesoscale TSVs Menk LA, Baca E, Blain MG, McClain J, Dominguez J, Smith A, Hollowell AE
D3232 - D3237	Influence of Current Density on Orientation-Controllable Growth and Characteristics of Electrochemically Deposited Au Films Liu LT, Zhu XL, Wei SH, Zhang J, Baklanov MR, Fanta ABD, Niu JB, Xie CQ
D3238 - D3245	Thermal Expansion and Thermal Stress Behavior of Electroless-Plated Fe-Ni-B Alloy Thin Film for High-Density Packaging Yamamoto T, Nagayama T, Nakamura T
D3246 - D3253	In-Situ Stress Measurements during Cobalt Electrodeposition Graciano VP, Bertocci U, Stafford GR
D3254 - D3258	Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias Josell D, Menk LA, Hollowell AE, Blain M, Moffat TP
D3259 - D3271	Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias Braun TM, Josell D, Silva M, Kildon J, Moffat TP