295 - 298 |
Bipolaron formation in para-sexiphenyl thin films upon Cs doping Koch N, Leising G, Yu LM, Rajagopal A, Pireaux JJ, Johnson RL |
299 - 305 |
Appearance potential mass spectrometry: Discrimination of dissociative ionization products Singh H, Coburn JW, Graves DB |
306 - 311 |
Electronic core levels of HgPX3 chalcogenophosphates Calareso C, Curro GM, Grasso V, Silipigni L |
312 - 319 |
Secondary ion emission from molecular overlayers: Thiols on gold Rading D, Kersting R, Benninghoven A |
320 - 324 |
Structural analysis of Si(111)-7 x 7 domain boundaries with takayanaki cores Zhao YF, Zhang ZH, Yang HQ, Xue ZQ, Pang SJ |
325 - 328 |
Photoemission studies of K-promoted oxidation of the GaAs(110) surface Lin G, Zhao TX, Liu HT, Yang HW, Ji MR |
329 - 333 |
Effect of CaO addition on properties of ion-induced secondary electron emission of MgO films Cho J, Park JW |
334 - 337 |
Desorption of fragment ions from condensed Si(OCH3)(4) by localized inner-shell electron excitation at the silicon, oxygen, and carbon K edges Baba Y, Sekiguchi T |
338 - 342 |
Determination of atomic oxygen density with a nickel catalytic probe Sorli I, Rocak R |
343 - 348 |
Apparatus for quantitative analysis of residual gases in flat panel vacuum packages Chalamala BR, Uebelhoer D, Dean KA |
349 - 355 |
New combination of a three-component gas, Ne-Xe-Ar, for a high efficiency plasma display panel Min BK, Lee SH, Park HG |
356 - 360 |
Wide band gap amorphous hydrogenated carbon films grown by plasma enhanced chemical vapor deposition Convertino A, Visconti P, Cingolani R |
361 - 366 |
Growth characteristics and deposition mechanism of SrTiO3 thin films by plasma enhanced metalorganic chemical vapor deposition Kim DO, Choi RJ, Nahm KS, Hahn YB |
367 - 371 |
Thickness distribution of large-area diamondlike carbon films formed by CH4/H-2 supermagnetron plasma chemical vapor deposition with application of a stationary magnetic field Kinoshita H, Nomura S, Honda M |
372 - 376 |
A comparative study on inductively-coupled plasma high-density plasma, plasma-enhanced, and low pressure chemical vapor deposition silicon nitride films Yota J, Hander J, Saleh AA |
377 - 384 |
Plasma enhanced chemical vapor deposition of fluorocarbon thin films via CF3H/H-2 chemistries: Power, pressure, and feed stock composition studies Senkevich JJ, Sherrer DW |
385 - 387 |
Anisotropic plasma etching of polymers using a cryo-cooled resist mask Schuppert B, Brose E, Petermann K, Moosburger R |
388 - 392 |
Improvement in downflow etching rate using Au as a catalyst Kataoka Y, Shinmura T, Kanoh M |
393 - 400 |
Inductively coupled, point-of-use plasma abatement of perfluorinated compounds and hydrofluorinated compounds from etch processes utilizing O-2 and H2O as additive gases Tonnis EJ, Graves DB, Vartanian VH, Beu L, Lii T, Jewett R |
401 - 404 |
Effects of chemical etching with sulfuric acid on glass surface Jang HK, Chung YD, Whangbo SW, Lee YS, Lyo IW, Whang CN, Lee SJ, Kim G |
405 - 410 |
Application of direct bias control in high-density inductively coupled plasma etching equipment Patrick R, Baldwin S, Williams N |
411 - 416 |
On the active surface layer in CF3+ etching of Si: Atomistic simulation and a simple mass balance model Abrams CF, Graves DB |
417 - 422 |
Use of neural networks to model low-temperature tungsten etch characteristics in high density SF6 plasma Kim B, Sun JH, Choi CJ, Lee DD, Seol YS |
423 - 434 |
Study of the ignition behavior of a pulsed dc discharge used for plasma-assisted chemical-vapor deposition Beer TA, Laimer J, Stori H |
435 - 437 |
Compounds of the CdTe-In2Te3 system in CdTe-In film grown by the close-spaced vapor transport technique combined with free evaporation Hernandez MP, Iribarren A, Torres MZ, Bartolo P, Sosa V, Pena JL |
438 - 449 |
Studies of heteroepitaxial growth of thin II-VI semiconductor layers by sequential ultrahigh vacuum dosing Luo Y, Han M, Slater DA, Osgood RM |
450 - 456 |
Effects of growth temperature on Mg-doped GaN epitaxial films grown by plasma-assisted molecular beam epitaxy Myoung JM, Kim K |
457 - 460 |
Characteristics of BeTe films grown by molecular beam epitaxy Cho MW, Chang JH, Saeki S, Wang SQ, Yao T |
461 - 464 |
Growth of GaNAs by molecular beam expitaxy using a N-2/Ar rf plasma Gotthold DW, Govindaraju S, Mattord T, Holmes AL, Streetman BG |
465 - 469 |
Characterization of magnesium fluoride thin films deposited by direct electron beam evaporation Dumas L, Quesnel E, Robic JY, Pauleau Y |
470 - 476 |
Nondestructive characterization of thin silicides using x-ray reflectivity Detavernier C, De Gryse R, Van Meirhaeghe RL, Cardon F, Ru GP, Qu XP, Li BZ, Donaton RA, Maex K |
477 - 484 |
Single shot laser damage in ultraviolet mirrors with a stepwise reflectivity profile Diso D, Perrone MR, Piegari A, Protopapa ML, Scaglione S |
485 - 491 |
Photoinduced dichroism and its low-temperature characteristics in obliquely deposited amorphous As-Ge-Se-S thin films Lee HY, Chun JY, Yeo CH, Chung HB |
492 - 496 |
Removal conditions for trapped microparticles in a stored electron beam using electrostatic electrodes Saeki H, Momose T |
497 - 502 |
Measurements of rf bias effect in a dual electron cyclotron resonance-rf methane plasma using the Langmuir probe method Hong JG, Granier A, Leteinturier C, Peignon MC, Turban G |
503 - 508 |
Dynamic simulations of pulsed reactive sputtering processes Jonsson LB, Nyberg T, Berg S |
509 - 514 |
Study on nanosized TiO/WO3 thin films achieved by radio frequency sputtering Guidi V, Comini E, Ferroni M, Martinelli G, Sberveglieri G |
515 - 523 |
Bonding and morphology study of carbon nitride films obtained by dual ion beam sputtering Quiros C, Prieto P, Fernandez A, Elizalde E, Morant C, Schlogl R, Spillecke O, Sanz JM |
524 - 528 |
Mechanical properties of titanium nitride coatings deposited by inductively coupled plasma assisted direct current magnetron sputtering Lim JW, Park HS, Park TH, Lee JJ, Joo J |
529 - 535 |
Role of the surface roughness in laser induced crystallization of nanostructured silicon films Hadjadj A, Boufendi L, Huet S, Schelz S, Cabarrocas PRI, Estrade-Szwarckopf H, Rousseau B |
536 - 542 |
Epitaxial growth and surface structure of cuprous halide thin films Wake T, Saiki K, Koma A |
543 - 551 |
Three-dimensional flow analysis of spiral-grooved turbo booster pump in slip and continuum flow Cheng HP, Jou RY, Chen FZ, Chang YW, Iwane M, Hanaoka T |
552 - 553 |
Hermetic indium metal-to-glass-tube seal Lenzen M, Collins RE |
554 - 556 |
Characterization of plasma deposited Ta2O5 films using grazing incidence x-ray scattering Four S, Devine RAB, Brunel M |
557 - 559 |
Molybdenum-ruthenium/beryllium multilayer coatings Bajt S |
560 - 562 |
Investigation of persistent photoconductivity in a Ge-doped ZnSe epilayer Zhang L, Dai N, Hu GJ, Chen LY, Tamargo MC |
563 - 566 |
Simple self-selective method of velocity measurement for particles in impact-based deposition Lebedev M, Akedo J, Mori K, Eiju T |
567 - 569 |
Cryogenic ultrahigh vacuum manipulator for angle dependent x-ray photoelectron spectroscopy studies Hawkridge AM, Gardella JA, Sagerman GR |
573 - 573 |
Papers from the Ninth Canadian Semiconductor Technology Conference - 10-13 August 1999 - The Chateau Laurier Hotel Ottawa, Canada - Preface Janz S, Das SR, Landheer D |
574 - 577 |
Optical breakdown of InGaAsP/InP based multiquantum well optical attenuators Boudreau M, Yan J, Hobbs L |
578 - 581 |
Widely tunable self-assembled quantum dot lasers Hinzer K, Allen CN, Lapointe J, Picard D, Wasilewski ZR, Fafard S, Thorpe AJS |
582 - 587 |
Light absorption in a resistive-gate GaAs charge-coupled device Hu S, Cresswell JV, Bryman DA, Kwok HL |
588 - 592 |
Si/Si1-xGex photodetectors using three-dimensional growth modes to enhance photoresponse at lambda=1550 nm Janz S, Baribeau JM, Lockwood DJ, McCaffrey JP, Moisa S, Rowell NL, Xu DX, Lafontaine H, Pearson MRT |
593 - 596 |
Selective doping of multilayer organic light emitting devices Lam J, Gorjanc TC, Tao Y, D'Iorio M |
597 - 600 |
Effect of interface states on the performance of GaAs p(+)-i far-infrared detectors Perera AGU, Shen WZ, Ershov M, Liu HC, Buchanan M, Gunapala SD, Bandara SV, Liu JK, Ye HH, Schaff WJ |
601 - 604 |
Progress on optimization of p-type GaAs/AlGaAs quantum well infrared photodetectors Shen A, Liu HC, Buchanan M, Gao M, Szmulowicz F, Brown GJ, Ehret J |
605 - 609 |
Optical properties of semiconductor heterostructures for active photonic device modeling Tolstikhin VI |
610 - 614 |
Two-dimensional gain profiles of InP/InGaAs separate absorption, grading, charge, and multiplication avalanche photodiodes modeled by a simplified stochastic approach Xiao YGG, Deen MJ |
615 - 620 |
Photoconductor selection for digital flat panel x-ray image detectors based on the dark current Kasap SO, Rowlands JA |
621 - 625 |
Photoresponse of photodiode arrays for solid-state image sensors Lee JS, Hornsey RI |
626 - 629 |
Double-gated microtip emitters for brighter field-emission displays Py C, Gao M, Das SR, Grant P, Marshall P, LeBrun L |
630 - 634 |
Ultrafast silicon based photodetectors Buchal C, Loken M, Lipinsky T, Kappius L, Mantl S |
635 - 638 |
Room temperature YBaCuO microbolometers Phong LN, Qiu SN |
639 - 642 |
X-ray phosphor deposition technology for co-integration with amorphous silicon imaging arrays Gu ZH, Tao S, Chan I, Nathan A |
643 - 647 |
Infrared characterization of GaN and GaN/AlGaN molecular beam epitaxial layers Bardwell JA, Dharma-Wardana MWC, Tang H, Webb JB |
648 - 651 |
Growth mechanisms and modeling for metalorganic chemical vapor deposition selective-area epitaxy on InP substrates Greenspan JE, Zhang X, Puetz N, Emmerstorfer B |
652 - 655 |
Growth of high-performance GaN modulation-doped field-effect transistors by ammonia-molecular-beam epitaxy Tang H, Webb JB, Bardwell JA, MacElwee T |
656 - 660 |
Copper electroplating for future ultralarge scale integration interconnection Gau WC, Chang TC, Lin YS, Hu JC, Chen LJ, Chang CY, Cheng CL |
661 - 664 |
1/f noise in p-type amorphous silicon Johanson RE, Kasap SO, Gaspari F, Yeghikyan D, Zukotynski S |
665 - 670 |
Growth characteristics of vacuum coated thick a-Se films for device applications Juhasz C, Gembala V, Kasap SO |
671 - 675 |
Parameters of vacuum deposition of ZnS : Mn active layer for electroluminescent displays Krasnov AN, Hofstra PG, McCullough MT |
676 - 680 |
Electrical characterization of metal-oxide-semiconductor capacitors with anodic and plasma-nitrided oxides Landsberger LM, Ghayour R, Sayedi M, Kahrizi M, Landheer D, Bardwell JA, Riopel Y, Jean C, Logiudice V |
681 - 684 |
Study of the effect of layer thickness, beam energy, and metal density on the resistless silicide direct-write electron-beam lithography process for the fabrication of nanostructures Lavallee E, Beauvais J, Drouin D, Corbin J |
685 - 687 |
Optimization of n(+) mu c-Si : H contact layer for low leakage current in a-Si : H thin film transistors Murthy RVR, Servati P, Nathan A, Chamberlain SG |
688 - 692 |
Intrinsic thin film stresses in multilayered imaging pixels Park B, Karim KS, Nathan A |
693 - 696 |
Annealing studies on monocrystalline CuInSe2 used as substrates in photovoltaic cells Champness CH, Ahmad GI |
697 - 700 |
Surface passivation of InGaAs for heterojunction bipolar transistor applications Driad R, McKinnon WR, Lu ZH, McAlister SP, Poole PJ, Charbonneau S |
701 - 704 |
Photoluminescence and Hall effect measurements of Te segregation in Te-doped GaSb grown in terrestrial and microgravity conditions Labrie D, O'Brien J, Redden RF, Audet N, Lent B, Micklethwaite WF |
705 - 708 |
Laser infrared photothermal radiometry of electronic solids: Principles and applications to industrial semiconductor Si wafers Mandelis A, Riopel Y |
709 - 712 |
Magnetic field induced changes in electron states of a superlattice Paranjape VV |
713 - 716 |
Study of doping concentration variation in InGaAs/InP high electron mobility transistor layer structures by Raman scattering Radhakrishnan K, Patrick THK, Zheng HQ, Zhang PH, Yoon SF |
717 - 719 |
Secondary defects engineering in c-Si: Influence of implantation dose, temperature, and oxygen concentration Poirier R, Schiettekatte F, Roorda S, Fortin MO |
720 - 723 |
Evaluation of single- and multilayered amorphous tantalum nitride thin films as diffusion barriers in copper metallization Chen GS, Chen ST, Yang LC, Lee PY |
724 - 729 |
Ultrathin oxynitride formation by low energy ion implantation Khoueir A, Lu ZH, Ng WT, Ma Y |
730 - 733 |
Fabrication of parallel quantum point contacts with submicron airbridges Feng Y, Sachrajda AS, Zawadzki P, Kolind S, Buchanan M, Smet JH, Lapointe J, Marshall PA |
734 - 737 |
Residual strain and resultant postrelease deflection of surface micromachined structures Hubbard T, Wylde J |
738 - 742 |
Dual-doped TMAH silicon etchant for microelectromechanical structures and systems applications Paranjape M, Pandy A, Brida S, Landsberger L, Kahrizi M, Zen M |
743 - 745 |
Silicon micromachining for millimeter-wave applications Guillon B, Grenier K, Pons P, Cazaux JL, Lalaurie JC, Cros D, Plana R |
746 - 749 |
Bistable microelectrothermal actuator in a standard complementary metal-oxide-semiconductor process Ressejac IC, Landsberger LM, Currie JF |
750 - 753 |
Fabrication of high performance GaN modulation doped field effect transistors Bardwell JA, Foulds I, Lamontagne B, Tang H, Webb JB, Marshall P, Rolfe SJ, Stapledon J, MacElwee TW |
754 - 756 |
Temperature distribution over a GaAs heterojunction bipolar transistor measured by fluorescent microthermal imaging Boyer N, Oliver B, Hagley A, Masson DP, Simard-Normandin M, Meunier M |
757 - 760 |
Direct extraction of the channel thermal noise in metal-oxide-semiconductor field effect transistor from measurements of their rf noise parameters Chen CH, Deen MJ |
761 - 764 |
Design and performance of InP/GaAsSb/InP double heterojunction bipolar transistors Dvorak MW, Matine N, Bolognesi CR, Xu XG, Watkins SP |
765 - 769 |
Hot-carrier effects on radio frequency noise characteristics of LDD n-type metal-oxide-semiconductor field effect transistors Kwan WS, Chen CH, Deen MJ |
770 - 774 |
The temperature dependence of the dc characteristics of silicon germanium bipolar transistors McAlister SP, Kovacic S, Renaud A, Zhou ZF |
775 - 779 |
Application of the traditional compact expressions for estimating the regional signal-delay times of heterojunction bipolar transistors Pulfrey DL, Fathpour S, St Denis A, Vaidyanathan M, Hagley WA, Surridge RK |
780 - 782 |
120 degrees C fabrication technology for a-Si : H thin film transistors on flexible polyimide substrates Sazonov A, Nathan A |
783 - 786 |
Scaling the SiGe channel pmetal-oxide-semiconductor field effect transistor: The case for p plus SiGe gates Wong DM, Tarr NG |
787 - 792 |
Two-dimensional simulation of the transient electrothermal effects during the gate turn-off thyristor turn-off Mezroua FZ, Abid R |