2263 - 2279 |
Review of Secondary-Ion Mass-Spectrometry Characterization of Contamination Associated with Ion-Implantation Stevie FA, Wilson RG, Simons DS, Current MI, Zalm PC |
2280 - 2292 |
Schottky-Barrier Study of Ion-Implantation Damage in GaAs Wang YG, Ashok S |
2293 - 2298 |
Temperature-Dependence of Photoluminescence Linewidth in GaAs/GaAsP Strained-Layer Quantum-Well Structures Zhang XN, Shiraki Y, Yaguchi H, Onabe K, Ito R |
2299 - 2304 |
Optical-Properties of InAs/InP Surface-Layers Formed During the Arsenic Stabilization Process Tabata A, Benyattou T, Guillot G, Gendry M, Hollinger G, Viktorovitch P |
2305 - 2309 |
FEP Precipitates in Hydride-Vapor Phase Epitaxially Grown Inpfe Luysberg M, Gobel R, Janning H |
2310 - 2321 |
Comparison of Advanced Plasma Sources for Etching Applications .1. Etching Rate, Uniformity, and Profile Control in a Helicon and a Multiple Electron-Cyclotron-Resonance Source Tepermeister I, Blayo N, Klemens FP, Ibbotson DE, Gottscho RA, Lee JT, Sawin HH |
2322 - 2332 |
Comparison of Advanced Plasma Sources for Etching Applications .2. Langmuir Probe Studies of a Helicon and a Multipole Electron-Cyclotron-Resonance Source Tepermeister I, Ibbotson DE, Lee JT, Sawin HH |
2333 - 2341 |
Comparison of Advanced Plasma Sources for Etching Applications .3. Ion Energy-Distribution Functions for a Helicon and a Multipole Electron-Cyclotron-Resonance Source Gibson GW, Sawin HH, Tepermeister I, Ibbotson DE, Lee JT |
2342 - 2346 |
Effects of Substrate-Temperature and Bias Potential on Hydrogen Plasma-Etching of Silicon Ishii M, Nakashima K, Hayakawa T, Tajima I, Yamamoto M |
2347 - 2351 |
Analytic Models for Plasma-Assisted Etching of Semiconductor Trenches Abrahamshrauner B |
2352 - 2355 |
Reactive Ion Etching of Ta-Si-N Diffusion-Barriers in Cf4+o2 Mclane GF, Casas L, Reid JS, Kolawa E, Nicolet MA |
2356 - 2360 |
Fabrication of Ultrafine Anisotropic SiO2 Mask by the Combination of Electron-Beam Lithography and SF6 Reactive Ion-Beam Etching Using Aluminum Lift-Off Technique Nishibe T |
2361 - 2371 |
Resist Pattern Fluctuation Limits in Extreme-Ultraviolet Lithography Scheckler EW, Ogawa T, Yamanashi H, Soga T, Ito M |
2372 - 2375 |
Radiation Stability of SiO2-Antireflective Film-Coated Sin and SiC X-Ray Mask Membranes Arakawa T, Okuyama H, Yamashita Y, Syoki T, Nagasawa H, Yamaguchi Y, Matsuo T, Noguchi F |
2376 - 2379 |
Effect of MeV Electron-Irradiation on Gold Atom Implantation into Silicon-Carbide and Silicon-Nitride Mori H, Sakata T, Yasuda H, Maeda M |
2380 - 2387 |
Cost Estimates for Commercial Plasma Source Ion-Implantation Rej DJ, Alexander RB |
2388 - 2393 |
Microfabrication by Ion Milling - The Lathe Technique Vasile MJ, Biddick C, Schwalm SA |
2394 - 2399 |
Laser System for Fine-Pitch Tape Automated Bonding Economikos L |
2400 - 2404 |
Characterization of Metal-Oxide-Semiconductor Capacitors with Improved Gate Oxides Prepared by Repeated Rapid Thermal Annealings in N2O Wu YL, Hwu JG |
2405 - 2408 |
In-Situ Sputter Cleaning of Vias Using a Getter Electrode Bauer HJ |
2409 - 2413 |
Sodium Contamination Free Ashing Process Using O2+h2O Plasma Downstream Fujimura S, Suzuki MT, Shinagawa K, Nakamura M |
2414 - 2421 |
Glow-Discharge Processing to Enhance Field-Emitter Array Performance Schwoebel PR, Spindt CA |
2422 - 2428 |
Ballistic-Electron-Emission Microscopy on the Au/N-Si(111)7X7 Interface Cuberes MT, Bauer A, Wen HJ, Vandre D, Prietsch M, Kaindl G |
2429 - 2433 |
Deposition and Subsequent Removal of Single Si Atoms on the Si(111)-7X7 Surface by a Scanning Tunneling Microscope Huang DH, Uchida H, Aono M |
2434 - 2436 |
Scanning-Tunneling-Microscopy Observation of Al-Induced Reconstructions of the Si(111) Surface - Growth Dynamics Yoshimura M, Takaoka K, Yao T, Sueyoshi T, Sato T, Iwatsuki M |
2437 - 2439 |
Investigation of Porous Silicon by Scanning-Tunneling-Microscopy and Atomic-Force Microscopy Yu T, Laiho R, Heikkila L |
2440 - 2442 |
Cross-Sectional Scanning Tunneling and Scanning Force Microscopy of Amorphous Hydrogenated Silicon PN-Doping Superlattices in Nitrogen and in Air Teuschler T, Hundhausen M, Eckstein R, Ley L |
2443 - 2450 |
Study of Dislocations in ZnSe and ZnS by Scanning Force Microscopy Nickolayev O, Petrenko VF |
2451 - 2455 |
Statics and Dynamics of Ferroelectric Domains Studied with Scanning Force Microscopy Luthi R, Haefke H, Gutmannsbauer W, Meyer E, Howald L, Guntherodt HJ |
2456 - 2458 |
Topography of Brittle-Fracture Surfaces of Titanium Aluminide Alloy as Revealed by a Scanning Tunneling Microscope Wang Z, Bai C, Dai C, Huang G, Zhang P, Zhang Y, Chu W, Qiao L, Wang Y |
2459 - 2461 |
Scanning Tunneling Microscope Observation on the Surface of Iron Meteorite Zhang LP, Hu J, Xu L, Yao XW, Zhang GG, Zhang Y, Xu YL, Li MQ, Li ZH, Xie XD, Xu YF, Zhang DT |
2462 - 2464 |
Design of an Atom-Cluster Generator for a Transmission Electron-Microscope and in-Situ Observation of the Deposition Process of Large Atom Clusters Mori H, Fujii K, Komatsu M, Miyauchi K |
2465 - 2466 |
Flexible-Diaphragm Force Microscope Rice P, Moreland J |
2469 - 2469 |
Papers from the 21st Annual Conference on the Physics and Chemistry of Semiconductor Interfaces - 24-28 January 1994 Mohonk-Mountain-House New-Paltz, New-York - Preface Wolford DJ, Dow JD, Aspnes DE |
2470 - 2474 |
Theoretical-Study of the Band Offsets at GaN/AlN Interfaces Albanesi EA, Lambrecht WR, Segall B |
2475 - 2479 |
Angle-Resolved Photoemission of Diamond (111) and (100) Surfaces - Negative Electron-Affinity and Band-Structure Measurements Vanderweide J, Nemanich RJ |
2480 - 2483 |
Electrical-Properties of Blue-Green Diode-Lasers Fan Y, Grillo DC, Ringle MD, Han J, He L, Gunshor RL, Salokatve A, Jeon H, Hovinen M, Nurmikko AV, Hua GC, Otsuka N |
2484 - 2492 |
Optical 2nd-Harmonic Generation - A Probe of Atomic-Structure and Bonding at Si-SiO2 Interfaces, and Other Chemically-Modified Si Surfaces Emmerichs U, Meyer C, Bakker HJ, Wolter F, Kurz H, Lucovsky G, Bjorkman CE, Yasuda T, Ma Y, Jing Z, Whitten JL |
2493 - 2499 |
Synchrotron-Radiation X-Ray Photoelectron-Spectroscopy Study of Hydrogen-Terminated Si Surfaces and Their Oxidation Mechanism Yamamoto K, Hasegawa M |
2500 - 2503 |
X-Ray Photoelectron-Spectroscopy and X-Ray-Absorption Near-Edge Spectroscopy Study of SiO2/Si(100) Tao Y, Lu ZH, Graham MJ, Tay SP |
2504 - 2510 |
Deposition of Single-Phase, Homogeneous Silicon Oxynitride by Remote Plasma-Enhanced Chemical-Vapor-Deposition, and Electrical Evaluation in Metal-Insulator-Semiconductor Devices Ma Y, Lucovsky G |
2511 - 2515 |
Structure of Oxygen-Doped Silicon Grown by Chemical-Vapor-Deposition at Low-Temperature Lilientalweber Z, Schwartz PV, Wu CC, Sturm JC |
2516 - 2520 |
Structural and Optical-Properties of Self-Assembled InGaAs Quantum Dots Leonard D, Fafard S, Pond K, Zhang YH, Merz JL, Petroff PM |
2521 - 2526 |
Scanning Tunneling Microscope and Electron-Beam-Induced Luminescence in Quantum Wires Samuelson L, Gustafsson A, Lindahl J, Montelius L, Pistol ME, Malm JO, Vermeire G, Demeester P |
2527 - 2531 |
Strained-Layer Epitaxy - How Do Capping Layers and Oppositely Strained Intermediate Layers Enhance the Critical Thickness Lefebvre I, Priester C, Lannoo M, Hollinger G |
2532 - 2540 |
Real-Time Scanning Microprobe Reflection High-Energy Electron-Diffraction Observations of InGaAs Surfaces During Molecular-Beam Epitaxy on InP Substrates Morishita Y, Goto S, Nomura Y, Tamura M, Isu T, Katayama Y |
2541 - 2546 |
Monolayer Growth Oscillations and Surface-Structure of GaAs(001) During Metalorganic Vapor-Phase Epitaxy Growth Reinhardt F, Jonsson J, Zorn M, Richter W, Ploska K, Rumberg J, Kurpas P |
2547 - 2551 |
ZnSe Nucleation on the GaAs(001)Se-(2X1) Surface Observed by Scanning-Tunneling-Microscopy Li D, Pashley MD |
2552 - 2557 |
Investigation of Spontaneous Ordering in GaInP Using Reflectance Difference Spectroscopy Luo JS, Olson JM, Bertness KA, Raikh ME, Tsiper EV |
2558 - 2561 |
Identification of Ordered and Disordered Ga0.51In0.49P Domains by Spatially-Resolved Luminescence and Raman-Spectroscopy Krost A, Esser N, Selber H, Christen J, Richter W, Bimberg D, Su LC, Stringfellow GB |
2562 - 2567 |
Molecular-Beam Epitaxy of InAs and Its Interaction with a GaAs Overlayer on Vicinal GaAs (001) Substrates Lin XW, Lilientalweber Z, Washburn J, Weber ER, Sasaki A, Wakahara A, Nabetani Y |
2568 - 2573 |
Mechanisms of Strained Island Formation in Molecular-Beam Epitaxy of InAs on GaAs(100) Chen P, Xie Q, Madhukar A, Chen L, Konkar A |
2574 - 2578 |
Growth-Mechanism of GaAs on (110) GaAs Studied by High-Energy Electron-Diffraction and Atomic-Force Microscopy Wassermeier M, Yang H, Tournie E, Daweritz L, Ploog K |
2579 - 2583 |
Atomic Step Organization in Homoepitaxial Growth on GaAs(111)B Substrates Schowalter LJ, Yang K, Thundat T |
2584 - 2586 |
Molecular-Beam Epitaxial Heterostructures in the (311)A Orientation Hsu Y, Wang WI, Kuan TS |
2587 - 2591 |
CdTe/GaAs(100) Heterojunctions - Growth Modification by Thin Silicon Interface Layers Cairns JW, Woolf DA, Bennett MR, Williams RH, Ballingall RA |
2592 - 2597 |
Scanning-Tunneling-Microscopy of InAs/GaSb Superlattices - Subbands, Interface Roughness, and Interface Asymmetry Feenstra RM, Collins DA, Ting DZ, Wang MW, Mcgill TC |
2598 - 2604 |
Light-Scattering-Studies of ZnSe/GaAs Heterostructures Talaat H, Elissa L, Negm S, Burstein E, Yeganeh MS, Yodh AG |
2605 - 2609 |
Study of Surface Stoichiometry and Luminescence Efficiency of Near-Surface Quantum-Wells Treated by Hydrogen-Ions and Atomic-Hydrogen Chang YL, Widdra W, Yi SI, Merz J, Weinberg WH, Hu E |
2610 - 2615 |
Comparative-Study of Cross-Sectional Scanning-Tunneling-Microscopy Spectroscopy on III-V Heterostructures and Homostructures - Ultrahigh Vacuum-Cleaved Versus Sulfide Passivated Smith AR, Gwo S, Sadra K, Shih YC, Streetman BG, Shih CK |
2616 - 2620 |
Structural and Electronic-Properties of an Organic-Inorganic Semiconductor Interface - Ptcda GaAs(100) Hirose Y, Chen W, Haskal EI, Forrest SR, Kahn A |
2621 - 2624 |
Optimization of Contacts and Mobilities for (001) Oriented 2-Dimensional Hole Gases Cheng TS, Johnston D, Middleton J, Strickland K, Hughes OH, Harris JJ, Foxon CT, Mellor CJ |
2625 - 2628 |
Measurement of Heterojunction Band Offsets Using Ballistic-Electron-Emission Microscopy Oshea JJ, Sajoto T, Bhargava S, Leonard D, Chin MA, Narayanamurti V |
2629 - 2633 |
In-Situ Study of Epitaxial CoSi2/Si(111) by Ballistic-Electron-Emission Microscopy Sirringhaus H, Lee EY, Vonkanel H |
2634 - 2638 |
Lateral Variation in the Schottky-Barrier Height of Au/PtSi/(100)Si Diodes Talin AA, Williams RS, Morgan BA, Ring KM, Kavanagh KL |
2639 - 2645 |
ZnSe(100) - The Surface and the Formation of Schottky Barriers with Al and Au Chen W, Kahn A, Soukiassian P, Mangat PS, Gaines J, Ponzoni C, Olego D |
2646 - 2652 |
Probing the CaF2 Density-of-States at Au/CaF2/N-Si(111) Interfaces with Photoelectron-Spectroscopy and Ballistic-Electron-Emission Microscopy Cuberes MT, Bauer A, Wen HJ, Prietsch M, Kaindl G |
2653 - 2659 |
Modification of Al/GaAs(001) Schottky Barriers by Means of Heterovalent Interface Layers Cantile M, Sorba L, Faraci P, Yildirim S, Biasiol G, Bratina G, Franciosi A, Miller TJ, Nathan MI, Tapfer L |
2660 - 2666 |
Novel in-Situ Electrochemical Technology for Formation of Oxide-Free and Defect-Free Schottky Contact to GaAs and Related Low-Dimensional Structures Hashizume T, Schweeger G, Wu NJ, Hasegawa H |
2667 - 2674 |
Dynamical Transmission Effects and Impact Ionization in Hot-Electron Transport Across Nisi2/Si(111)7X7 Interfaces Bauer A, Ludeke R |
2675 - 2677 |
Relation Between Atomic-Structure and Surface-Stress Anisotropy - Calculations for the Clean Si(001) Surface Dabrowski J, Pehlke E, Scheffler M |
2678 - 2683 |
1st-Principles Study of Zn-Stabilized and Se-Stabilized ZnSe(100) Surface Reconstructions Garcia A, Northrup JE |
2684 - 2688 |
Reflectance Anisotropy of Reconstructed GaAs(001) Surfaces Morris SJ, Bass JM, Matthai CC, Milman V, Payne MC |
2689 - 2693 |
Step Bunching and Step Equalization on Vicinal GaAs(001) Surfaces Pond K, Lorke A, Ibbetson J, Bresslerhill V, Maboudian R, Weinberg WH, Gossard AC, Petroff PM |
2694 - 2698 |
Structural-Properties of the Na/Si(111)2X1 Surface Studied by Photoemission Extended X-Ray-Absorption Fine-Structures Mangat PS, Soukiassian P, Huttel Y, Hurych Z |
2699 - 2704 |
Strict Thermal Nitridation Selectivity Between Si and Ge Used as a Chemical Probe of the Outermost Layer of Si1-xGex Alloys and Ge/Si(001) or Si/Ge(001) Heterostructures Aubel D, Diani M, Bischoff JL, Bolmont D, Kubler L |
2705 - 2708 |
Aluminum on Si(100) - Growth and Structure of the 1st Layer Brocks G, Kelly PJ, Car R |
2709 - 2712 |
Cs-Induced Highest E(F) Jump Above InAs(110) Conduction-Band Minimum Aristov VY, Lelay G, Soukiassian P, Hricovini K, Bonnet JE, Osvald J, Olsson O |
2713 - 2719 |
Macroscopic Electronic Behavior and Atomic Arrangements of GaAs-Surfaces Immersed in HCl Solution Ishikawa Y, Ishii H, Hasegawa H, Fukui T |
2721 - 2726 |
Do Manufacturing Technologies Need Federal-Policies Schmitt RW |
2727 - 2740 |
Concepts in Competitive Microelectronics Manufacturing Liehr M, Rubloff GW |
2741 - 2748 |
Film Interface Control in Integrated Processing Systems Granneman EH |
2749 - 2751 |
Single-Wafer Process Integration for Submicron Structures Masnari NA |
2752 - 2757 |
Applications of Computational Fluid-Dynamics for Improved Performance in Chemical-Vapor-Deposition Reactors Kotecki DE, Conti RA, Barbee SG, Cacouris TD, Chapplesokol JD, Eschbach RJ, Wilson DL, Wong J, Zuhoski SP |
2758 - 2762 |
Mechanism of Particle Formation in the Sputtering and Reactive Ion Etching of Si and SiO2 Yoo WJ, Steinbruchel C |
2763 - 2767 |
Causes of Anomalous Solid Formation in the Exhaust Systems of Low-Pressure Chemical-Vapor-Deposition and Plasma-Enhanced Chemical-Vapor-Deposition Semiconductor Processes Abreu RA, Troup AP, Sahm MK |
2768 - 2778 |
Materials and Failure Analysis-Methods and Systems Used in the Development and Manufacture of Silicon Integrated-Circuits Diebold AC |
2779 - 2784 |
High-Speed Spectral Ellipsometry for in-Situ Diagnostics and Process-Control Duncan WM, Henck SA, Kuehne JW, Loewenstein LM, Maung S |
2785 - 2794 |
Statistical Metrology - At the Root of Manufacturing Control Bartelink DJ |
2795 - 2799 |
Improving Productivity on a Single-Wafer Aluminum Ether by the Use of Total Productive Maintenance Hackenberg J, Flaim D |
2800 - 2804 |
Gate Technology for 0.1-Mu-M Si Complementary Metal-Oxide-Semiconductor Using G-Line Exposure and Deep-Ultraviolet Hardening Jeon DY, Chin GM, Lee KF, Yan RH, Westerwick E, Cerullo M |
2805 - 2809 |
Characterization of Plasma Etch Processes Using Measurements of Discharge Impedance Bose F, Patrick R, Baltes HP |
2810 - 2817 |
1st-Wafer Effect in Remote Plasma Processing - The Stripping of Photoresist, Silicon-Nitride, and Polysilicon Loewenstein LM, Stefani JA, Butler SW |
2818 - 2821 |
Repeated Compressive Stress Increase with 400 Degrees-C Thermal Cycling in Tantalum Thin-Films Due to Increases in the Oxygen-Content Cabral C, Clevenger LA, Schad RG |
2822 - 2825 |
Thermal-Stability of Thin Poly-Si/Ta2O5/Tin Capacitors for Dynamic Random-Access Memory Applications Ishibashi K, Patnaik BK, Parikh NR, Sandhu GS, Fazan PC |
2826 - 2829 |
Planarization of Aluminum Films by a Technique with the Combination of Molecular-Beam Deposition and Annealing for Ultralarge-Scale Integration Metallization Mukai R, Ozawa S |
2830 - 2834 |
Application of a Dry Turbo Vacuum Pump to Semiconductor Manufacturing Processes Nagaoka T, Mase M |
2835 - 2838 |
Integration of Materials and Processes for Reliable Silicon Interconnections Paraszczak J |
2839 - 2847 |
Formation of Si-SiO2 Stacked-Gate Structures by Plasma-Assisted and Rapid-Thermal Processing - Improved Device Performance Through Process Integration Lucovsky G, Wortman JJ, Yasuda T, Xu XL, Misra V, Hattangady SV, Ma Y, Hornung B |
2848 - 2851 |
Wafer-Scale Processing of InGaAsP/InP Lasers Dzioba S, Cook JP, Herak TV, Livermore S, Young M, Rousina R, Jatar S, Shepherd FR |
2852 - 2859 |
The Adequat Project for Development and Transfer of 0.25 Mu-M Logic Complementary Metal-Oxide-Semiconductor Modules Dekeersmaecker R, Declerck G, Felix P, Haond M, Hill C, Janssen G, Lorenz J, Maes H, Montree A, Neppl F, Patruno P, Rudan M, Ryssel H, Vandenhove L, Vandervorst W, Vanommen A |
2860 - 2867 |
Sensor Integration into Plasma Etch Reactors of a Developmental Pilot Line Barna GG, Loewenstein LM, Brankner KJ, Butler SW, Mozumder PK, Stefani JA, Henck SA, Chapados P, Buck D, Maung S, Saxena S, Unruh A |