1287 - 1297 |
Miniature fuel cells for portable power: Design considerations and challenges Maynard HL, Meyers JP |
1298 - 1302 |
Control of shape of silicon needles fabricated by highly selective anisotropic dry etching Kanechika M, Sugimoto N, Mitsushima Y |
1303 - 1310 |
Probabilistic gel formation theory in negative tone chemically amplified resists used in optical and electron beam lithography Patsis GP, Glezos N |
1311 - 1316 |
Wetting effect on gap filling submicron damascene by an electrolyte free of levelers Chang SC, Shieh JM, Lin KC, Dai BT, Wang TC, Chen CF, Feng MS, Li YH, Lu CP |
1317 - 1320 |
Characterization of the crotalus durissus terrificus venom by atomic force microscopy Baranauskas V, Dourado DM, Zhao JG, da Cruz-Hofling MA |
1321 - 1326 |
Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition Kim H, Cabral C, Lavoie C, Rossnagel SM |
1327 - 1330 |
Effect of H-2 on the etch profile of InP/InGaAsP alloys in Cl-2/Ar/H-2 inductively coupled plasma reactive ion etching chemistries for photonic device fabrication Rommel SL, Jang JH, Lu W, Cueva G, Zhou L, Adesida I, Pajer G, Whaley R, Lepore A, Schellanbarger Z, Abeles JH |
1331 - 1333 |
Silicon dioxide film with lower deposition temperature in hot-wall, single-type chamber Yoon S, Park H, Song J |
1334 - 1338 |
Effective repair to ultra-low-k dielectric material (k-2.0) by hexamethyidisilazane treatment Mor YS, Chang TC, Liu PT, Tsai TM, Chen CW, Yan ST, Chu CJ, Wu WF, Pan FM, Lur W, Sze SM |
1339 - 1341 |
Gallium nitride: Method of defect characterization by wet oxidation in an oxalic acid electrolytic cell Sundararajan SP, Crouse D, Lo YH |
1342 - 1347 |
Study of the acid-diffusion effect on line edge roughness using the edge roughness evaluation method Yoshizawa M, Moriya S |
1348 - 1355 |
Electrical contrast observations and voltage measurements by Kelvin probe force gradient microscopy Girard P, Ramonda M, Saluel D |
1356 - 1359 |
Molecular beam epitaxy of IV-VI mid-infrared vertical cavity surface-emitting quantum well laser structures Wu H, Zhao F, Jayasinghe L, Shi Z |
1360 - 1363 |
Characteristics of HfO2/HfSixOy film as an alternative gate dielectric in metal-oxide-semiconductor devices Kang H, Roh Y, Bae G, Jung D, Yang CW |
1364 - 1367 |
Improved GaNxAs1-x quality grown by molecular beam pitaxy with dispersive nitrogen source Wang SZ, Yoon SF, Loke WK, Ng TK, Fan WJ |
1368 - 1378 |
Structure and photoluminescence features of nanocrystalline Si/SiO2 films produced by plasma chemical vapor deposition and post-treatment Wu XC, Ossadnik C, Eggs C, Veprek S, Phillipp F |
1379 - 1383 |
Getter requirements for a cathode ray tube with a diamond coated field emitter electron source Nemanic V, Zumer M, Zajec B, Tyler T |
1384 - 1387 |
Impact of pitting defect on 0.25 mu m standard random access memory Chiu CM, Yen TF, Chiu KF |
1388 - 1393 |
Improvements of characteristics of fluorinated dielectric films integrated as interlayer dielectrics Shieh JM, Tsai KC, Suen SC, Dai BT |
1394 - 1401 |
Effects of a Ni cap layer on transparent-Ni/Au ohmic contacts to p-GaN Liu B, Lambers E, Alexander WB, Holloway PH |
1402 - 1405 |
Mechanism of cleaning Si(100) surface using Sr or SrO for the growth of crystalline SrTiO3 films Wei Y, Hu XM, Liang Y, Jordan DC, Craigo B, Droopad R, Yu Z, Demkov A, Edwards JL, Ooms WJ |
1406 - 1409 |
Low-temperature formation of highly reliable silicon-nitride gate dielectrics with suppressed soft-breakdown phenomena for advanced complementary metal-oxide-semiconductor technology Nakajima A, Khosru QDM, Yoshimoto T, Kidera T, Yokoyama S |
1410 - 1418 |
Fabrication of single-electron tunneling transistors with an electrically formed Coulomb island in a silicon-on-insulator nanowire Kim DH, Sung SK, Kim KR, Lee JD, Park BG |
1419 - 1426 |
Morphological evolution of epitaxial cobalt-semiconductor compound layers during growth in a scanning tunneling microscope Goldfarb I, Briggs GAD |
1427 - 1430 |
Electrical characteristics of polycrystalline silicon thin film transistors using the Cu-field aided lateral crystallization process Kwon SY, Park KW, Lee JB, Choi DK |
1431 - 1435 |
Thermal effects in atomic-order nitridation of Si by a nitrogen plasma Seino T, Muto D, Matsuura T, Murota J |
1436 - 1443 |
Triple crystal diffractometry, x-ray standing wave, and transmission electron microscopy investigation of shallow BF2 implantation in Si Bocchi C, Germini F, Ghezzi G, Gombia E, Mosca R, Nasi L, Mukhamedzhanov EK, Privitera V, Spinella C |
1444 - 1447 |
Comparison of two different Ti/Al/Ti/Au ohmic metallization schemes for AlGaN/GaN Bardwell JA, Sproule GI, Liu Y, Tang H, Webb JB, Fraser J, Marshall P |
1448 - 1451 |
Influence of in situ ultrasound treatment during ion implantation on amorphization and junction formation in silicon Kruger D, Romanyuk B, Melnik V, Olikh Y, Kurps R |
1452 - 1456 |
Enhancement of implantation efficiency by grid biasing in radio-frequency inductively coupled plasma direct-current plasma immersion ion implantation Tong HH, Fu RKY, Zeng XC, Kwok DTK, Chu PK |
1457 - 1464 |
Studieson the plasma localization of a magnetic neutral loop discharge using normalized radio frequency electric field Sung YM, Honda C |
1465 - 1470 |
Process and realization of a three-dimensional gold electroplated antenna on a flexible epoxy film for wireless micromotion system Basset P, Kaiser A, Collard D, Buchaillot L |
1471 - 1475 |
TiSiN films produced by chemical vapor deposition as diffusion barriers for Cu metallization Joseph S, Eizenberg M, Marcadal C, Chen L |
1476 - 1481 |
Reduction of etching plasma damage on low dielectric constant fluorinated amorphous carbon films by multiple H-2 plasma treatment Shieh JM, Tsai KC, Dai BT, Wu YC, Wu YH |
1482 - 1488 |
Photoresist selectivity mechanism in SiO2 etching by inductively coupled plasma using fluorocarbon gases Imai S, Motomura H, Tachibana K |
1489 - 1492 |
Formation of InAs/GaAs quantum dots by dewetting during cooling Mirin RP, Roshko A, van der Puijl M, Norman AG |
1493 - 1495 |
Room temperature oscillation of self-organized In0.2Ga0.8As/GaAs quantum wire lasers grown on (221)A GaAs substrates by molecular beam epitaxy Kanamori H, Hyodo K, Ohno Y, Shimomura S, Hiyamizu S, Okamoto Y |
1496 - 1500 |
Microstructural interpretation of Ni ohmic contact on n-type 4H-SiC Han SY, Shin JY, Lee BT, Lee JL |
1501 - 1507 |
Magneto-photoluminescence study of intermixed self-assembled InAs/GaAs quantum dots Menard S, Beerens J, Morris D, Aimez V, Beauvais J, Fafard S |
1508 - 1513 |
Profile control of high aspect ratio trenches of silicon. I. Effect of process parameters on local bowing Boufnichel M, Aachboun S, Grangeon F, Lefaucheux P, Ranson P |
1514 - 1521 |
Selective and deep plasma etching of SiO2: Comparison between different fluorocarbon gases (CF4, C2F6, CHF3) mixed with CH4 or H-2 and influence of the residence time Gaboriau F, Cartry G, Peignon MC, Cardinaud C |
1522 - 1526 |
Ta and Ta-N diffusion barriers sputtered with various N-2/Ar ratios for Cu metallization Wang JH, Chen LJ, Lu ZC, Hsiung CS, Hsieh WY, Yew TR |
1527 - 1536 |
Real-time spectro-ellipsometric characterization of Si/Si1-xGex multiple quantum wells grown on Si(100) substrates Akazawa H |
1537 - 1541 |
Formation of Ag nanometer particles at the interface of Ag thin film and poly(ethylene terephthalate) substrate under visible light irradiation Fukuda S, Kawamoto S, Gotoh Y, Nozaki S, Nakaura M |
1542 - 1547 |
Wafer temperature measurements during dielectric etching in a MERIE etcher Gabriel CT |
1548 - 1555 |
Low temperature remote plasma cleaning of the fluorocarbon and polymerized residues formed during contact hole dry etching Seo H, Kim SB, Song J, Kim Y, Soh H, Kim YC, Jeon H |
1556 - 1560 |
Impact ot the colloidal silica particle size on physical vapor deposition tungsten removal rate and surface roughness Bouvet D, Beaud P, Fazan P, Sanjines R, Jacquinot E |
1561 - 1566 |
Eliminating dielectric degradation of low-k organosilicate glass by trimethylchlorosilane treatment Chang TC, Liu PT, Mor YS, Tsai TM, Chen CW, Mei YJ, Pan FM, Wu WF, Sze SM |
1567 - 1569 |
Atomic resolution imaging of a single-crystal Cu (100) surface by scanning tunneling microscopy in ultrahigh vacuum at room temperature Zou ZQ, Dong ZC, Trifonov AS, Nejo H |
1570 - 1573 |
Increased thickness of buried oxide layer of silicon on insulator in separation by implantation of oxygen with water plasma Chen J, Chen M, Dong YM, Wang X, Zheng ZH, Wang X |
1574 - 1577 |
Effects of photowashing treatment on electrical properties of an AlGaN/GaN heterostructure field-effect transistor Choi KJ, Jeon CM, Jang HW, Lee JL |
1578 - 1578 |
Proximity exposure effect analysis using the phenomenon of resist debris formation in electron beam lithography (vol B20, pg 710, 2002) Deshmukh PR |
1581 - 1581 |
Papers from the 29th Conference on the Physics and Chemistry of Semiconductor Interfaces - 6-10 January 2002 - Santa Fe, New Mexico - Preface Yu ET, Aspnes DE |
1582 - 1585 |
Ferromagnetism in (In,Mn)As diluted magnetic semiconductor thin films grown by metalorganic vapor phase epitaxy Blattner AJ, Wessels BW |
1586 - 1590 |
Growth of Fe/Ge(001) heterostructures by molecular beam epitaxy: Interface structure, electronic and magnetic properties Tari S, Sporken R, Aoki T, Smith DJ, Metlushko V, AbuEl-Rub K, Sivananthan S |
1591 - 1599 |
Structure and interface composition of Co layers grown on As-rich GaAs(001) c(4X4) surfaces Ludge K, Schultz BD, Vogt P, Evans MMR, Braun W, Palmstrom CJ, Richter W, Esser N |
1600 - 1608 |
ErAs interlayers for limiting interfacial reactions in Fe/GaAs(100) heterostructures Schultz BD, Farrell HH, Evans MMR, Ludge K, Palmstrom CJ |
1609 - 1613 |
Characterization for strontium titinate/Fe3O4 and TiN/Fe3O4 interfaces Lussier A, Idzerda YU, Stadler S, Ogale SB, Shinde SR, Venkatesan V |
1614 - 1619 |
Interactions of alkylamines with the silicon (001) surface Cao XP, Hamers RJ |
1620 - 1625 |
Core level photoemission and scanning tunneling microscopy study of the interaction of pentacene with the Si(100) surface Hughes G, Roche J, Carty D, Cafolla T, Smith KE |
1626 - 1639 |
Properties of (In,Ga)N/GaN quantum wells grown by plasma-assisted molecular beam epitaxy Brandt O, Waltereit P, Dhar S, Jahn U, Sun YJ, Trampert A, Ploog KH, Taglient MA, Tapfer L |
1640 - 1646 |
Role of hydrogen in surface reconstructions and growth of GaN Van de Walle CG, Neugebauer J |
1647 - 1655 |
Mechanism of anomalous current transport in n-type GaN Schottky contacts Hasegawa H, Oyama S |
1656 - 1663 |
Control of ZnO film polarity Hong SK, Ko HJ, Chen YF, Yao T |
1664 - 1670 |
Steps on the (001) SrTiO3 surface Zhang XD, Demkov AA |
1671 - 1676 |
Scanning capacitance spectroscopy of an AlxGa1-xN/GaN heterostructure field-effect transistor structure: Analysis of probe tip effects Schaadt DM, Yu ET |
1677 - 1681 |
Scanning tunneling potentiometry of semiconductor junctions Dong Y, Feenstra RM, Hey R, Ploog KH |
1682 - 1689 |
Scanning spreading resistance microscopy current transport studies on doped III-V semiconductors Lu RP, Kavanagh KL, Dixon-Warren SJ, SpringThorpe AJ, Streater R, Calder I |
1690 - 1698 |
Determination of the erosion rate in the transient region of an ultralow energy secondary ion mass spectrometry profile using medium energy ion scattering McConville CF, Al-Harthi SH, Dowsett MG, Gard FS, Ormsby TJ, Guzman B, Noakes TCQ, Bailey P |
1699 - 1705 |
Simplified bond-hyperpolarizability model of second harmonic generation: Application to Si-dielectric interfaces Wang JFT, Powell GD, Johnson RS, Lucovsky G, Aspnes DE |
1706 - 1709 |
Controlling the threshold voltage of a metal-oxide-semiconductor field effect transistor by molecular protonation of the Si : SiO2 interface Yang JM, de la Garza L, Thornton TJ, Kozicki M, Gust D |
1710 - 1719 |
Electronic structure of SiO2: Charge redistribution contributions to the dynamic dipoles/effective charges of the infrared active normal modes Whitten JL, Zhang Y, Menon M, Lucovsky G |
1720 - 1725 |
Defects at the interface of (100)Si with ultrathin layers of SiOx, Al2O3, and ZrO2 probed by electron spin resonance Stesmans A, Afanas'ev VV |
1726 - 1731 |
Electronic states at the interface of Ti-Si oxide on Si(100) Fulton CC, Lucovsky G, Nemanich RJ |
1732 - 1738 |
Interface electronic structure of Ta2O5-Al2O3 alloys for Si-field-effect transistor gate dielectric applications Ulrich MD, Johnson RS, Hong JG, Rowe JE, Lucovsky G, Quinton JS, Madey TE |
1739 - 1747 |
Electronic structure of high-k transition metal oxides and their silicate and aluminate alloys Lucovsky G, Zhang Y, Rayner GB, Appel G, Ade H, Whitten JL |
1748 - 1758 |
Nonlinear composition dependence of x-ray photoelectron spectroscopy and Auger electron spectroscopy features in plasma-deposited zirconium silicate alloy thin films Rayner GB, Kang D, Zhang Y, Lucovsky G |
1759 - 1765 |
Surface and interface properties of In0.8Ga0.2As metal-insulator-semiconductor structures Wieder HH, Sari H |
1766 - 1770 |
Plasmon damping in molecular beam epitaxial-grown InAs(100) Veal TD, Bell GR, McConville CF |
1771 - 1776 |
Anion exchange at the interfaces of mixed anion III-V heterostructures grown by molecular beam epitaxy Brown T, Brown A, May G |
1777 - 1780 |
Valence band offset at the CdS/CdTe interface Boieriu P, Sporken R, Sivananthan S |
1781 - 1787 |
Ballistic electron emission microscopy studies of ZnSe-BeTe heterojunctions Chahboun A, Fink V, Fleischauer M, Kavanagh KL, Lu RP, Hansen L, Becker CR, Molenkamp LW |