1 - 9 |
Implementation of micromirror arrays as optical binary switches and amplitude modulators Kolesar ES, Allen PB, Wilken JW, Howard JT |
10 - 15 |
Laser induced chemical vapor deposition of optical thin films on curved surfaces Tamir S, Berger S, Rabinovitch K, Gilo M, Dahan P |
16 - 20 |
Process monitoring and control of low temperature reactively sputtered AlN Kirkpatrick SR, Rohde SL, Mihut DM, Kurruppu ML, Swanson JR, Thomson D, Woollam JA |
21 - 24 |
Deposition of tungsten thin films by dual frequency inductively coupled plasma assisted CVD Colpo P, Rossi F, Gibson N, Gilliland D |
25 - 29 |
Ellipsometry and transport studies of thin-film metal nitrides Humlicek J, Nebojsa A, Hora J, Strasky M, Spousta J, Sikola T |
30 - 33 |
Correlation of predicted and observed optical properties of multilayer thermal control coatings Jaworske DA |
34 - 39 |
Highly transparent nano-crystalline diamond films via substrate pretreatment and methane fraction optimization Chen KH, Bhusari DM, Yang JR, Lin ST, Wang TY, Chen LC |
40 - 45 |
Thick SiOxNy and SiO2 films obtained by PECVD technique at low temperatures Alayo MI, Pereyra I, Carreno MNP |
46 - 49 |
Optical properties of RF sputtered strontium substituted barium titanate thin films Panda B, Dhara A, Nigam GD, Bhattacharya DB, Ray SK |
50 - 55 |
Extremely fast ellipsometry solutions using cascaded neural networks alone Urban FK, Barton D, Boudani NI |
56 - 61 |
Properties of carbon nitride films deposited by magnetron sputtering Kusano Y, Evetts JE, Somekh RE, Hutchings IM |
62 - 68 |
Vibrational properties of carbon nitride films by Raman spectroscopy Chowdhury AKMS, Cameron DC, Hashmi MSJ |
69 - 73 |
Preparation of CNx-phases using plasma-assisted and hot filament chemical vapour deposition Leonhardt A, Gruger H, Selbmann D, Arnold B, Thomas J |
74 - 79 |
Sputtering process of carbon nitride films by using a novel bio-molecular C-N containing target Lu TR, Chen LC, Chen KH, Bhusari DM, Chen TM, Kuo CT |
80 - 86 |
Structures and properties of disordered boron carbide coatings generated by magnetron sputtering Hu T, Steihl L, Rafaniello W, Fawcett T, Hawn DD, Mashall JG, Rozeveld SJ, Putzig CL, Blackson JH, Cermignani W, Robinson MG |
87 - 92 |
A technique for large area deposition of diamond via combustion flame synthesis Rozbicki RT, Sarin VK |
93 - 97 |
Microwave plasma chemical vapor deposition of diamond films with low residual stress on large area porous silicon substrates Khan MA, Haque MS, Naseem HA, Brown WD, Malshe AP |
98 - 102 |
DC electrical conductivity of chemical vapour deposited diamond sheets : a correlation with hydrogen content and paramagnetic defects Sikder AK, Jacob AP, Sharda T, Misra DS, Pandey M, Kabiraj D, Avasthi DK |
103 - 108 |
The investigation of thermal effect on the properties of pulsed laser deposited diamond-like carbon films Jung HS, Park HH, Pang SS, Lee SY |
109 - 112 |
Thermal diffusion in molecular dynamics simulations of thin film diamond deposition Pailthorpe BA, Mitchell D, Bordes NS |
113 - 117 |
On the hardness of a-C : H films prepared by methane plasma decomposition Marques FC, Lacerda RG, Odo GY, Lepienski CM |
118 - 123 |
The microstructural dependence of the opto-electronic properties of nitrogenated hydrogenated amorphous carbon thin films Silva SRP, Khan RUA, Burden AP, Anguita JV, Shannon JM, Sealy BJ, Papworth AJ, Kiely CJ, Amaratunga GAJ |
124 - 129 |
Influence of water vapour and oxygen on the tribological behaviour of diamond coatings steel couple Schmitt M, Paulmier D, Le Huu T, El Mansori M, Grabchenko A, Mamalis AG |
130 - 135 |
Structural modifications and temperature stability of silicon incorporated diamond-like a-C : H films Camargo SS, Santos RA, Neto ALB, Carius R, Finger F |
136 - 140 |
Diamond deposition from methanol-hydrogen-water mixed gas using a low pressure, radio frequency, inductively-coupled plasma Hiramatsu M, Noda H, Nagai H, Shimakura M, Nawata M |
141 - 145 |
Gas desorption and adsorption properties of carbon based material used for cathode ray tube Hashiba M, Hino T, Hirohata Y, Shinbori H, Deyama S, Chiyoda H |
146 - 150 |
Influence of stress distribution on adhesion strength of sputtered hard coatings Tonshoff HK, Karpuschewski B, Mohlfeld A, Seegers H |
151 - 156 |
The nano-scratch tester (NST) as a new tool for assessing the strength of ultrathin hard coatings and the mar resistance of polymer films Consiglio R, Randall NX, Bellaton B, von Stebut J |
157 - 163 |
A laser-acoustic method for testing and classifying hard surface layers Schneider D, Schultrich B, Scheibe HJ, Ziegele H, Griepentrog M |
164 - 171 |
Mechanical properties of SiO2 and Si3N4 coatings : a BAM/NIST co-operative project Beck U, Smith DT, Reiners G, Dapkunas SJ |
172 - 179 |
Indentation of graded substrates Giannakopoulos AE |
180 - 184 |
Crack formation mechanisms during micro and macro indentation of diamond-like carbon coatings on elastic-plastic substrates Thomsen NB, Fischer-Cripps AC, Swain MV |
185 - 188 |
Strength of HVOF coating-substrate interfaces Nygards CM, White KW, Ravi-Chandar K |
189 - 194 |
Measurement of the micro mechanical properties of sol-gel TiO2 films Jamting AK, Bell JM, Swain MV, Wielunski LS, Clissold R |
195 - 201 |
Mechanical properties of W and W(C) thin films : Young's modulus, fracture toughness and adhesion Harry E, Rouzaud A, Ignat M, Juliet P |
202 - 208 |
Comparison of mechanical properties of TiN thin films using nanoindentation and bulge test Shojaei OR, Karimi A |
209 - 214 |
Electronic structure and chemical characterization of ultrathin insulating films Sanz JM, Soriano L, Prieto P, Tyuliev G, Morant C, Elizalde E |
215 - 219 |
Depth profiling of non-conductive oxidic multilayers with plasma-based SNMS in HF-mode Goschnick J, Natzeck C, Sommer M, Zudock F |
220 - 224 |
Electrical and microwave characterization of kanthal thin films : temperature and size effect Bhat KS, Datta SK, Suresh C |
225 - 229 |
Hexagonal nitride coatings : electronic and mechanical properties of V2N, Cr2N and delta-MoN Sanjines R, Hones P, Levy F |
230 - 234 |
Surface- and microanalytical characterization of silicon-carbonitride thin films prepared by means of radio-frequency magnetron co-sputtering Lutz H, Bruns M, Link F, Baumann H |
235 - 239 |
Corrosion of titanium-nitride encapsulated silver films exposed to a H2S ambient Adams D, Julies BA, Mayer JW, Alford TL |
240 - 246 |
Sputter deposited chromium nitride based ternary compounds for hard coatings Hones P, Sanjines R, Levy F |
247 - 251 |
Effect of external magnetic field on c-axis orientation and residual stress in AlN films Kusaka K, Ao T, Hanabusa T, Tominaga K |
252 - 256 |
Microstructural characterisation of carbonaceous dust generated during the deposition of diamond-like carbon coatings Burden AP, Anguita JV, Silva SRP |
257 - 261 |
Technique for characterization of thin film porosity Taylor DJ, Fleig PF, Hietala SL |
262 - 266 |
Secondary electron imaging of nucleation and growth of semiconductors for nanostructure fabrication Homma Y |
267 - 271 |
Structural and electrochromic properties of InN thin films Asai N, Inoue Y, Sugimura H, Takai O |
272 - 276 |
Characterizing and modeling the apparent anomalous behavior of resistivity in Cr-Si-O thin films Jankowski AF |
277 - 281 |
Structural studies of ITO thin films with the Rietveld method Quaas M, Eggs C, Wulff H |
282 - 289 |
On the energy influx to the substrate during sputter deposition of thin aluminium films Kersten H, Kroesen GMW, Hippler R |
290 - 294 |
Raman microscopy study of pulsed laser ablation deposited silicon carbide films Neri F, Trusso S, Vasi C, Barreca F, Valisa P |
295 - 299 |
Study on chromium oxide synthesized by unbalanced magnetron sputtering Wang DY, Lin JH, Ho WY |
300 - 304 |
Effect of excess Pb and O content on the ferroelectric properties of sputter deposited Pb(Zr0.52Ti0.48)O-3/Pt system Park HH, Jin IS, Kim DH, Kim TS |
305 - 311 |
A study on the structural distribution of Se-passivated GaAs surface Kim JW, Sa SH, Kang MG, Park HH |
312 - 318 |
Texture and surface roughness of PRCVD aluminum films Yang D, Jonnalagadda R, Rogers BR, Hillman JT, Foster RF, Cale TS |
319 - 324 |
A low temperature integrated aluminum metallization technology for ULSI devices Guo T, Chen LY, Brown D, Besser P, Voss S, Mosely R |
325 - 328 |
Evaluation of tantalum silicide sputtering target materials for amorphous Ta-Si-N diffusion barrier for Cu metallization Ivanov E |
329 - 334 |
Characterization of a PECVD WxN process using N-2, H-2, and WF6 Lai KK, Mak AW, Wendling TPHF, Jian P, Hathcock B |
335 - 339 |
TiN reactive sputter deposition studied as a function of the pumping speed Heuvelman WM, Helderman P, Janssen GCAM, Radelaar S |
340 - 344 |
Synthesis and processing of a Cu-In-Ga-Se sputtering target Suryanarayana C, Ivanov E, Noufi R, Contreras MA, Moore JJ |
345 - 350 |
The effects of plasma treatment for low dielectric constant hydrogen silsesquioxane (HSQ) Liu PT, Chang TC, Sze SM, Pan FM, Mei YJ, Wu WF, Tsai MS, Dai BT, Chang CY, Shih FY, Huang HD |
351 - 355 |
Enhancing the thermal stability of low dielectric constant hydrogen silsesquioxane by ion implantation Chang TC, Chou MF, Mei YJ, Tsang JS, Pan FM, Wu WF, Tsai MS, Chang CY, Shih FY, Huang HD |
356 - 361 |
Uncooled thin film infrared imaging device with aerogel thermal isolation : deposition and planarization techniques Ruffner JA, Clem PG, Tuttle BA, Brinker CJ, Sriram CS, Bullington JA |
362 - 368 |
Precursor selection for plasma deposited fluorinated amorphous Mountsier TW, Samuels JA |
369 - 374 |
Properties of low dielectric constant fluorinated silicon oxide films prepared by plasma enhanced chemical vapor deposition Kim K, Kwon D, Lee GS |
375 - 378 |
MOS capacitor characteristics of plasma oxide on partially strained SiGeC films Ray SK, Bera LK, Maiti CK, John S, Banerjee SK |
379 - 384 |
Assessment of post-CMP cleaning mechanisms using statistically-designed experiments Zhang G, Burdick G, Dai F, Bibby T, Beaudoin S |
385 - 390 |
A modified multi-chemical spray cleaning process for post shallow trench isolation chemical mechanical polishing cleaning application Wang YL, Wang TC, Wu J, Tseng WT, Lin CF |
391 - 396 |
Chemical-mechanical polishing for giant magnetoresistance device integration Hu YZ, Gutmann RJ, Chow TP, Witcraft B |
397 - 403 |
Material characteristics and chemical-mechanical polishing of aluminum alloy thin films Wang YL, Wu J, Liu CW, Wang TC, Dun JW |
404 - 411 |
Advanced salicides for 0.10 mu m CMOS : Co salicide processes with low diode leakage and Ti salicide processes with direct formation of low resistivity C54 TiSi2 Kittl JA, Hong QZ, Yang H, Yu N, Samavedam SB, Gribelyuk MA |
412 - 417 |
Selective deposition of TiSi2 on ultra-thin silicon-on-insulator (SOI) wafers Maa JS, Ulrich B, Hsu ST, Stecker G |
418 - 422 |
The effects of the process parameters on the electrical and microstructure characteristics of the CrSi thin resistor films : part I Wu F, McLaurin AW, Henson KE, Managhan DG, Thomasson SL |
423 - 427 |
Characterization of multilayered Ti/TiN films grown by chemical vapor deposition Hu JC, Chang TC, Chen LJ, Yang YL, Chang CY |
428 - 436 |
Low parasitic resistance contacts for scaled ULSI devices Osburn CM, Bellur KR |
437 - 443 |
Effect of GaAs surface treatments using HCl or (NH4)(2)S-x solutions on the interfacial bonding states induced by deposition of Au Kang MG, Park HH |
444 - 448 |
Effect of O-2 plasma treatment on the properties of SiO2 aerogel film Kim HR, Park HH, Hyun SH, Yeom GY |
449 - 454 |
The effect of sol viscosity on the sol-gel derived low density SiO2 xerogel film for intermetal dielectric application Hong JK, Kim HR, Park HH |
XIII - XIII |
Papers presented at the 25th International Conference on Metallurgical Coatings and Thin Films, San Diego, CA, USA, April 27 May 1, 1998 - Preface Sartwell BD, Givens JH, Mitterer C, Rhode SL |