| E5 - E9 |
Hydrogen electrode reactions in an alkali bromide melt
Kasajima T, Nishikiori T, Nohira T, Ito Y |
| A75 - A79 |
Structured silicon anodes for lithium battery applications
Green M, Fielder E, Scrosati B, Wachtler M, Moreno JS |
| A80 - A84 |
In situ X-ray diffraction during lithium extraction from rhombohedral and monoclinic Li3V2(PO4)(3)
Morcrette M, Leriche JB, Patoux S, Wurm C, Masquelier C |
| A85 - A87 |
Composite supercapacitor containing tin oxide and electroplated ruthenium oxide
Kuo SL, Wu NL |
| A88 - A90 |
Reliable and fast-responding methanol concentration sensor with novel design
Qi ZG, He CZ, Hollett M, Attia A, Kaufman A |
| A91 - A95 |
Electrolyte materials for intermediate temperature fuel cells produced via combustion chemical vapor condensation
Maric R, Seward S, Faguy PW, Oljaca M |
| A96 - A97 |
Electrochemical intercalation of lithium into graphite in room-temperature molten salt containing ethylene carbonate
Katayama Y, Yukumoto M, Miura T |
| B23 - B24 |
Corrosion of copper in BTA solutions - Effects of passive film removal
Al-Hinai AT, Osseo-Asare K |
| C67 - C69 |
Superconformal silver deposition using KSeCN derivatized substrates
Baker BC, Witt C, Wheeler D, Josell D, Moffat TP |
| C70 - C72 |
Ti-Al-N thin films prepared by the combination of metallorganic plasma-enhanced atomic layer deposition of Al and TiN
Lee YJ, Kang SW |
| C73 - C76 |
Oblique incidence reflectivity difference as an in situ probe of Co electrodeposition on polycrystalline Au
Schwarzacher W, Gray J, Zhu XD |
| C77 - C78 |
Rapid growth of thick quartz films by catalyst-enhanced vapor-phase epitaxy under atmospheric pressure
Takahashi N, Nakumura T, Nonaka S, Yagi H, Sinriki Y, Tamanuki K |
| F17 - F19 |
LaOx thin film deposited by direct liquid injection MOCVD
Jun J, Jun JH, Choi DJ |
| G63 - G65 |
Surface charge evolution during early stage of thermal oxidation of silicon
Wang JB, Roman P, Kamieniecki E, Ruzyllo J |
| G66 - G68 |
Highly reliable nickel silicide formation with a Zr capping layer
Lee TL, Lee JW, Lee MC, Lei TF, Lee CL |
| G69 - G71 |
Direct Patterning of low-k hydrogen silsesquioxane using X-ray exposure technology
Chang TC, Tsai TM, Liu PT, Mor YS, Chen CW, Sheu JT, Tsengb TY |
| G72 - G74 |
Superpolishing for planarizing copper damascene interconnects
Chang SC, Shieh JM, Dai BT, Feng MS, Li YH, Shih CH, Tsai MH, Shue SL, Liang RS, Wang YL |
| G75 - G77 |
Measurements of wet etch dynamics using an in situ optical monitor
Yi EH, Akdogan IG, Parker MA |
