The Acceleration Effect of Hydroxyl Compound on DGEBA/MDA/Nitrile Systems

J.Y.Lee; M.J. Shim; S.W.Kim

Journal of Industrial and Engineering Chemistry, Vol.5, No.2, 128-132, June, 1999

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The Acceleration Effect of Hydroxyl Compound on DGEBA/MDA/Nitrile Systems

J.Y.Lee, M.J. Shim¹, and S.W.Kim^†

Department of Chemical Engineering, The University of Seoul, Seoul 130-743, Korea
¹Department of Life Science, The University of Seoul, Seoul 130-743, Korea

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To investigate the acceleration effect of hydroxyl group, hydroquinone (HQ) which has two hydroxyl groups was introduced to DGEBA/MDA/Nitrile systems. The activation energy of DGEBA/MDA/MN system was 47.8 kJ/mol and that of DGEBA/MDA/MN/HQ was 41.4 kJ/mol, which was lowered by 15%. With the addition of HQ, curing reaction started at lower temperature and the T^p was lowered. With the increment of HQ contents, these temperatures decreased gradually. These results were due to the catalytic role of hydroxyl groups in HQ, which assisted the opening of epoxide ring by the formation of termolecular transition state.

Keywords:epoxy;cure kinetics;DSC analysis;hydroxyl compound;Kissinger equation

[References]

Kishore K, Joseph M, Dharumaraj V, Vijayshree MN, J. Appl. Polym. Sci., 31, 2829 (1986)
Munns TE, Seferis JC, J. Appl. Polym. Sci., 28, 2227 (1983)
Shimbo M, Nakaya T, J. Polym. Sci., 24, 1931 (1986)
Zilkha A, Weinstein J, J. Appl. Polym. Sci., 6, 643 (1962)
Smith RE, Smith CH, J. Appl. Polym. Sci., 31, 929 (1986)
Gu J, Narang SC, Pearce EM, J. Appl. Polym. Sci., 30, 2997 (1985)
Lu MG, Shim MJ, Kim SW, Thermochim. Acta, 323(1-2), 37 (1998)
Lee JY, Shim MJ, Kim SW, J. Ind. Eng. Chem., 4(1), 1 (1998)
Prime RB, Thermal Characterization of Polymeric Materials, E.A. Turi Ed., Ch. 5, Academic Press, New York (1982)
Lee JY, Shim MJ, Kim SW, Mater. Chem. Phys., 44, 74 (1996)
Lu MG, Shim M, Kim S, Polym. Eng. Sci., 39(2), 274 (1999)
Lee SN, Yuo WB, Polym. Eng. Sci., 27, 1317 (1987)
Schneider NS, Sprouse JF, Hagnauer GL, Polym. Eng. Sci., 19, 304 (1979)
Chern CS, Poehlein GW, Polym. Eng. Sci., 27, 788 (1987)
Woo EM, Seferis JC, J. Appl. Polym. Sci., 40, 1237 (1990)
Horie K, Mita I, Kambe H, J. Polym. Sci. A: Polym. Chem., 8, 2839 (1970)
Chun IS, Shim MJ, Kim SW, J. Korean Ind. Eng. Chem., 6(1), 35 (1995)
Lee JY, Shim MJ, Kim SW, J. Korean Mater. Res., 5, 667 (1995)
Keenan MR, J. Appl. Polym. Sci., 33, 1725 (1987)

[Referenced By]

[1] Kishore K, Joseph M, Dharumaraj V, Vijayshree MN, J. Appl. Polym. Sci., 31, 2829 (1986)

[2] Munns TE, Seferis JC, J. Appl. Polym. Sci., 28, 2227 (1983)

[3] Shimbo M, Nakaya T, J. Polym. Sci., 24, 1931 (1986)

[4] Zilkha A, Weinstein J, J. Appl. Polym. Sci., 6, 643 (1962)

[5] Smith RE, Smith CH, J. Appl. Polym. Sci., 31, 929 (1986)

[6] Gu J, Narang SC, Pearce EM, J. Appl. Polym. Sci., 30, 2997 (1985)

[7] Lu MG, Shim MJ, Kim SW, Thermochim. Acta, 323(1-2), 37 (1998)

[8] Lee JY, Shim MJ, Kim SW, J. Ind. Eng. Chem., 4(1), 1 (1998)

[9] Prime RB, Thermal Characterization of Polymeric Materials, E.A. Turi Ed., Ch. 5, Academic Press, New York (1982)

[10] Lee JY, Shim MJ, Kim SW, Mater. Chem. Phys., 44, 74 (1996)

[11] Lu MG, Shim M, Kim S, Polym. Eng. Sci., 39(2), 274 (1999)

[12] Lee SN, Yuo WB, Polym. Eng. Sci., 27, 1317 (1987)

[13] Schneider NS, Sprouse JF, Hagnauer GL, Polym. Eng. Sci., 19, 304 (1979)

[14] Chern CS, Poehlein GW, Polym. Eng. Sci., 27, 788 (1987)

[15] Woo EM, Seferis JC, J. Appl. Polym. Sci., 40, 1237 (1990)

[16] Horie K, Mita I, Kambe H, J. Polym. Sci. A: Polym. Chem., 8, 2839 (1970)

[17] Chun IS, Shim MJ, Kim SW, J. Korean Ind. Eng. Chem., 6(1), 35 (1995)

[18] Lee JY, Shim MJ, Kim SW, J. Korean Mater. Res., 5, 667 (1995)

[19] Keenan MR, J. Appl. Polym. Sci., 33, 1725 (1987)