뉴 디자인된 히트싱크의 열 유동 현상 컴퓨터 시뮬레이션

임송철; 최종운; 강계명; Song Chul Lim; Jong Un Choi; Kae Myung Kang

Korean Journal of Materials Research, Vol.14, No.11, 775-779, November, 2004

DOI10.3740/MRSK.2004.14.11.775 Export Citation

뉴 디자인된 히트싱크의 열 유동 현상 컴퓨터 시뮬레이션

Computational Simulation of Heat flow phenomena in Newly Designed Heat Sinks

임송철, 최종운 , 강계명 ^†

서울산업대학교 신소재공학과

Song Chul Lim, Jong Un Choi , and Kae Myung Kang^†

Department of Materials Science and Engineering, Seoul National University of Technology, Seoul, 139-743, Korea

E-mail:

For improvement of heat dissipation performance, heat analysis is conducted on the newly designed heat sinks under two convection conditions by using computational fluid dynamics(CFD). Three types of heat sink, plate, wave and top vented wave, are used, and convection conditions are the variations of gravity direction at natural convection and of fan location at forced convection. The results of analysis showed that the heat resistances of top vented wave heat sink were 0.17 ? C /W(forced convection) and 0.48 ? C /W(natural convection). In the case of natural convection, gravity direction affected heat flow change, and protection against heat performance was superior in case of z-axis gravity direction. Under the forced convection, all the heat sinks revealed superior thermal characteristics in the fan position of z-axis rather than y-axis. In this study, it was observed that the top vented wave type heat sink showed the best ability of heat radiation comparing with the others.

Keywords:heat sink;heat conductivity;natural convection;forced convection

[References]

Chien HC, Tseng MH, Wang CY, Chu CH , in Proceedings Seventeenth IEEE SEMI-THERM Sympo-sium (2001 IEEE) p.219 (2001)
Kamal Karimanal and Rajesh Nair, in Proceedings 2000 Inter Society Conference on Thermal Phenome (2000 IEEE) p.308 (2000)
Chein R, Huang G, Applied Thermal Engineering, 24(14-15), 2207 (2004)
Maranzanz G, Perry I, Maillet D, Rael S, Interna-tional Journal of Thermal Sciences, 43(1), 21 (2004)
Nagulapally M, Karimanal K, in Proceedings 2002 Inter Society Conference on Thermal Phenome (2002 IEEE) p.330 (2002)
Linton RL, Agonafer D, IEEE Transactions on Components, Packaging and Manufacturing Technology - Part A, 18(3), 517 (1995) (1995)
Leung CW, Probert SD, Int. J. Energy, 62, 94 (1989)
Lim SC, Chang SY, Kim HT, Lee DH, Kang KM, Korean J. of Mater. Research, 14(7), 522 (2004)
Shankatullah H, Storr WR, Hansen JB, Gaynes MA, IEEE Transactions on Components, Packaging and Manufacturing Technology - Part A, 19(4), 486 (1996) (1996)
Lin SC, Chou CA, Apllied Thermal Engineering, 24(16), 2375 (2004)

[Related Articles]

[1] Chien HC, Tseng MH, Wang CY, Chu CH , in Proceedings Seventeenth IEEE SEMI-THERM Sympo-sium (2001 IEEE) p.219 (2001)

[2] Kamal Karimanal and Rajesh Nair, in Proceedings 2000 Inter Society Conference on Thermal Phenome (2000 IEEE) p.308 (2000)

[3] Chein R, Huang G, Applied Thermal Engineering, 24(14-15), 2207 (2004)

[4] Maranzanz G, Perry I, Maillet D, Rael S, Interna-tional Journal of Thermal Sciences, 43(1), 21 (2004)

[5] Nagulapally M, Karimanal K, in Proceedings 2002 Inter Society Conference on Thermal Phenome (2002 IEEE) p.330 (2002)

[6] Linton RL, Agonafer D, IEEE Transactions on Components, Packaging and Manufacturing Technology - Part A, 18(3), 517 (1995) (1995)

[7] Leung CW, Probert SD, Int. J. Energy, 62, 94 (1989)

[8] Lim SC, Chang SY, Kim HT, Lee DH, Kang KM, Korean J. of Mater. Research, 14(7), 522 (2004)

[9] Shankatullah H, Storr WR, Hansen JB, Gaynes MA, IEEE Transactions on Components, Packaging and Manufacturing Technology - Part A, 19(4), 486 (1996) (1996)

[10] Lin SC, Chou CA, Apllied Thermal Engineering, 24(16), 2375 (2004)