폴리아닐린과 첨가제에 따른 아연전기도금층의 표면 외관 특성

이상백; 박형호; 배인성; 윤재식; 김병일; Sang Baek Lee; Hyung Ho Park; In Sung Bae; Jae Sik Yoon; Byung Il Kim

Korean Journal of Materials Research, Vol.12, No.2, 146-152, February, 2002

DOI10.3740/MRSK.2002.12.2.146 Export Citation

폴리아닐린과 첨가제에 따른 아연전기도금층의 표면 외관 특성

Characteristics of Surface Appearance of Zn Electrodeposits with Polyaniline and Additives

이상백^†, 박형호¹, 배인성¹, 윤재식¹, 김병일²

자동차부품 및 소재연구개발센터
¹회유금속 소재 연구소
²순천대학교 재료 · 금속공학과

Sang Baek Lee^†, Hyung Ho Park¹, In Sung Bae¹, Jae Sik Yoon¹, and Byung Il Kim²

Research and Development Center for Automobile Parts and Materials, Korea
¹Korea Research Institute of Rare Metals, Korea
²Materials Science and Metallurgical Engineering, Sunchon National University, Korea

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Effect of polyaniline and additives on surface appearance of Zn electrodeposition was investigated by SEM and XRD analyzing. We carried out the experiment from sulfate Zinc bath containing sulfonated polyaniline, gelatin and thiourea by EG(Electrogalvanizing) simulator. Addition of polyaniline and gelatin in bath, crystal size and shape of hexagonal plane of Zn crystal reduced. Mixing of thiourea, however, brittle deposits were observed because of the difference between vertical growth and parallel growth. (1011) peak appeared with polyaniline and gelatin in XRD analysis. In case of mixing of polyaniline, gelatin and thiourea, (1011) peak appeared and intensity of Zn basal plane decreased. These results suggested that overpotential increased with addition of polyaniline and additives In bath.

Keywords:Zinc;electrodeposition;polyaniline;gelatin;thiourea

[References]

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Yum HT, Lee JS, Electroplating & Surface treatment, (1991) (1991)
Hovestad A, Janssen LJ, 50th ISE Meeting, Abstract No. 56, Pavia, Italy, 5-10 Sept. (1999) (1999)
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Kondo K, Ohgishi A, Tanaka Z, J. Electrochem. Sci, 147(7), 261 (2000)
Celis JP, Roos JR, Buelens CA, J. Electrochem. Soc., mathematical model for the electrolytic codeposition of particles with a metallic matrix, 134, 1402 (1987)
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驚山勝, 川正樹, 渡勉 : 鐵と鋼, 76, 1301 (1990) (1990)
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[1] Tuck, 'Modern Battery Technology', 23, Ellis Horwood (1991) (1991)

[2] Zuchkerman L, The New York Times, Sept. 22, (1997) (1997)

[3] Yum HT, Lee JS, Electroplating & Surface treatment, (1991) (1991)

[4] Hovestad A, Janssen LJ, 50th ISE Meeting, Abstract No. 56, Pavia, Italy, 5-10 Sept. (1999) (1999)

[5] Alexandridou S, Kiparissides C, Fransaer J, Surf. Coat. Technol., 71, 267 (1995)

[6] Tacken RA, Jiskoot P, Janssen LJ, J. Appl. Electrochem., 26(2), 129 (1996)

[7] Ding XM, Merk N, Ilschner B, J. Membr. Sci., Mechanical behaviour of metal-matrix composite deposits, 33, 803 (1998)

[8] Greco VP, Baldauf W, Plating, 55, 250 (1968)

[9] Dieter GE, 'Mechanical metallurgy' McGraw-Hill, London, (1988) (1988)

[10] Marshall GW, Lewis DB, layton DC, Blake K, Dodds B, Surf. Coat. Technol., 96, 353 (1997)

[11] Hiramatsu M, Kawaski H, Hyoumen-gijitu, 40, 406 (1989)

[12] Hiramatsu M, Kawaski H, Omi T, Nakayama Y, Hyoumen-gijitu, 38, 12 (1987)

[13] Aslanidis D, Fransaer J, Celis JP, J. Electrochem. Soc., 144(7), 2352 (1997)

[14] Kondo K, Ohgishi A, Tanaka Z, J. Electrochem. Sci, 147(7), 261 (2000)

[15] Celis JP, Roos JR, Buelens CA, J. Electrochem. Soc., mathematical model for the electrolytic codeposition of particles with a metallic matrix, 134, 1402 (1987)

[16] Terzieva V, Fransaer J, Celis JP, J. Electrochem. Soc., Codeposition of hydrophilic and hydrophobic silica with copper from acid copper sulfate baths, 147(1), 198 (2000)

[17] 驚山勝, 川正樹, 渡勉 : 鐵と鋼, 76, 1301 (1990) (1990)

[18] 高杉政伺, 渡秋男, 岡囊二 : 鐵と鋼, 71, 462 (1985) (1985)