삼차아민 촉매를 첨가한 에폭시시스템의 경화사이클 연구

김재구; 김경원; 김정일; 주혁종; Jae Koo Kim; Kyung Won Kim; Jung Il Kim; Hyeok Jong Joo

Polymer(Korea), Vol.23, No.4, 597-603, July, 1999

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삼차아민 촉매를 첨가한 에폭시시스템의 경화사이클 연구

A Study on the Cure Cycle for a Tertiary Amine Catalyzed-Epoxy Systems

김재구, 김경원, 김정일, 주혁종^†

충남대학교 고분자공학과

Jae Koo Kim, Kyung Won Kim, Jung Il Kim, and Hyeok Jong Joo^†

Department of Polymer Sci. & Eng., Chungnam National University, Taejon, Korea

E-mail:

초록

에폭시수지. 산무수물 경화제와 삼차아민 촉매를 혼합한 에폭시시스템에 thermogravimetric analysis (TGA)를 이용하여 임의의 여러 개의 경화온도를 선정하였다. 또한 differential scanning calorimetry (DSC)를 이용하여 유리전이온도 (Tg), 잔여발열량 (ΔH_r)과 전환율 (α)사이에 1 : 1의 상호관계가 존재함을 이용하여 등온-Tg 곡선, 유리화 곡선, 완전경화선 등이 포함된 time-temperature-transformation (TTT) 경화도표를 작성하였고 최적의 경화조건을 Tg_∞ 영역 근처에서 선정하였다.

Arbitrary cure temperatures were selected by using thermogravimetric analysis(TGA) for a uncured mixture of epoxy resins and anhydrides with catalysts. The time-temperature-transformation(TTT) cure diagram, including the iso-Tg contours, the vitrification curve, and the full cure line, was determinated by using a one-to-one relationship amont the temperature of glass transition (T_g), the residual enthalpy (ΔHr), and the conversion ratio(α) which were obtained by using differential scanning calorimetry (DSC). And then an optimum cure cycle was considered within the region of the glass transition temperature, Tg_∞, of a fullyu cured epoxy system.

Keywords:TTT(time-temperature-transformation);iso-T_g contours;vitrification curve;full cure line;temperature of glass transition(T_g)

[References]

Aronhime MT, Dusek K, Gillham JK, Kelley FN, LeMay JD, Lohse F, Zweifel H, "Epoxy Resins and Composites," ed. by K. Dusek, p. 83, Springer-Verlag Berlin Heidelberg (1986)
Chan LC, Nae HN, Gillham JK, J. Appl. Polym. Sci., 29, 3307 (1984)
Pang KP, Gillham JK, J. Appl. Polym. Sci., 39, 909 (1990)
Wang X, Gillham JK, J. Appl. Polym. Sci., 47, 425 (1993)
Lee WI, Loose AC, Springer GS, J. Comput. Mater., 16, 510 (1982)
Dusi MR, Lee WI, Cirscioli PR, Springer GS, J. Comput. Mater., 21, 243 (1987)
Wisanrakkit G, Gillham JK, J. Appl. Polym. Sci., 41, 2885 (1990)
Monterrat S, J. Appl. Polym. Sci., 44, 545 (1992)
Guibe C, Francillette J, J. Appl. Polym. Sci., 62(11), 1941 (1996)

[1] Aronhime MT, Dusek K, Gillham JK, Kelley FN, LeMay JD, Lohse F, Zweifel H, "Epoxy Resins and Composites," ed. by K. Dusek, p. 83, Springer-Verlag Berlin Heidelberg (1986)

[2] Chan LC, Nae HN, Gillham JK, J. Appl. Polym. Sci., 29, 3307 (1984)

[3] Pang KP, Gillham JK, J. Appl. Polym. Sci., 39, 909 (1990)

[4] Wang X, Gillham JK, J. Appl. Polym. Sci., 47, 425 (1993)

[5] Lee WI, Loose AC, Springer GS, J. Comput. Mater., 16, 510 (1982)

[6] Dusi MR, Lee WI, Cirscioli PR, Springer GS, J. Comput. Mater., 21, 243 (1987)

[7] Wisanrakkit G, Gillham JK, J. Appl. Polym. Sci., 41, 2885 (1990)

[8] Monterrat S, J. Appl. Polym. Sci., 44, 545 (1992)

[9] Guibe C, Francillette J, J. Appl. Polym. Sci., 62(11), 1941 (1996)