BTDA-BBPA 단위구조를 갖는 신규 감광성 폴리아믹산에스테르(PSPAE): 합성, 광패터닝 및 이미드화

박유진; 이중헌; 문유경; 서영범; 김윤호; 원종찬; 김진수; Yu Jin Park; Jung Heon Lee; Yu Kyoung Moon; Young Beom Seo; Yun Ho Kim; Jong Chan Won; Jinsoo Kim

Polymer(Korea), Vol.43, No.2, 268-273, March, 2019

DOI10.7317/pk.2019.43.2.268 Export Citation

BTDA-BBPA 단위구조를 갖는 신규 감광성 폴리아믹산에스테르(PSPAE): 합성, 광패터닝 및 이미드화

New Photosensitive Poly(amic acid ester) with BTDA-BBPA Unit: Synthesis, Photopatterning, and Imidization

박유진¹, 이중헌^{1, 2}, 문유경¹, 서영범¹, 김윤호^{1, 2}, 원종찬^{1, 2}, 김진수^{1, 2, †}

¹한국화학연구원 고기능고분자연구센터
²과학기술연합대학원대학교 KRICT스쿨

Yu Jin Park¹, Jung Heon Lee^{1, 2}, Yu Kyoung Moon¹, Young Beom Seo¹, Yun Ho Kim^{1, 2}, Jong Chan Won^{1, 2}, and Jinsoo Kim^{1, 2, †}

¹Center for Advanced Funtional Polymers, Korea Reserch Institute of Chemical Technology, Gajeongro 141, Yuseong, Daejeon 34114, Korea
²KRICT School, University of Science and Technology (UST), Gajeongro 217, Yuseong, Daejeon 34113, Korea

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초록

BTDA 산이무수물과 BBPA 디아민을 사용하여 새로운 감광성 폴리아믹산 에스테르인 PSPAE(BTDA-BBPAHEMA) 를 합성하였다. PSPAE(BTDA-BBPA-HEMA)를 NMP에 녹인 후 TEGDA(가교제), Irgacure 819(광개시제)를 첨가하여 네가티브 감광성 PSPAE 조성물을 제조하였다. PSPAE 조성물을 스핀코팅하여 제조한 PSPAE-F1 필름을 350 °C 에서 이미드화하여 폴리이미드 필름(PI-F1)을 얻었다. PSPAE-F1과 PI-F1 필름의 TGA 곡선을 기록하고 열적 거동을 조사하였다. PSPAE 필름을 광패터닝 후 이미드화를 실시하여 20-100 μm의 해상도와 20 μm 두께를 갖는 패터닝된 PI 필름을 제조하였다. 또한 이미드화 후 막두께 감소율은 약 25%로 측정되었으며 이는 기존 PSPAE (PMDA-ODA-HEMA) 제품의 막두께 감소율(40-50%)과 비교하여 현저히 향상되었다.

The new photosensitive polyamic acid ester, PSPAE(BTDA-BBPA-HEMA), was synthesized by using BTDA and BBPA as an acid dianhydride and a diamine, respectively. After dissolving PSPAE(BTDA-BBPA-HEMA) in NMP, TEGDA (crosslinker) and Irgacure 819 (photoinitiator) were added to produce a negative photosensitive PSPAE composition. The polyimide film (PI-F1) was prepared by spin coating of the PSPAE composition followed by imidization of PSPAE-F1 at 350 °C. The TGA curves of PSPAE-F1 and PI-F1 films were recorded and the thermal behavior was investigated. The PSPAE film was photopatterned and imidized to produce the patterned PI film having a resolution of 20-100 μm and a thickness of 20 μm. In addition, the film reduction rate after imidization was about 25%, which was remarkably improved compared with that (40-50%) of the conventional PSPAE (PMDA-ODA HEMA) products.

Keywords:photosensitive poly(amic acid ester);synthesis;formulation;photopatterning;film thickness

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