The study evaluates the effect of introducing Cu granules and control milling on the microstructure, interfacial bonding and mechanical properties including sintered density, hardness, compressive strength, flexural strength and electrical conductivity of Copper-Graphite (Gr) composite synthesize by flake powder metallurgy (Flake PM). It develops the flake composite particles by control mechanical alloying (MA) which further laminates over the refine granules surface. This encapsulation facilitates the strong interfacial bonding among the composite constituents during sintering. Results highlight that the 10% Cu granules in Cu-10Gr composite exhibit excellent mechanical properties. It increases the relative density, hardness, compressive strength, and flexural strength by 4.19%, 28.23%, 98.31%, and 11.8% respectively. However, the electrical conductivity increases by 6.73% (%IACS) for 15% of Cu granules in the Cu-10Gr composite. The improvements in the results are the synergistic coordination of dispersion homogeneity, surface integrity, work hardening, and the superior interfacial adhesion between composite powder and Cu granules. (C) 2019 The Society of Powder Technology Japan. Published by Elsevier B.V. and The Society of Powder Technology Japan. All rights reserved.