Polymer(Korea), Vol.44, No.4, 527-534, July, 2020
UV 임프린트 리소그래피 공정을 통한 친환경적인 다양한 패턴필름의 제조와 특성분석
Preparation and Characterization of Environment Friendly Various Pattern Film via UV Imprint Lithography Process
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초록
임프린트 리소그래피 공정(ILP) 중, 자외선(UV) 광선을 이용한 ILP 기술은 패턴이 형성된 마스터를 사용하여 몰드를 제작하고, 제작된 몰드로 UV 경화성 레진(resin)을 일정한 압력(낮은 압력)으로 눌러준 다음, UV 조사하여 레진을 경화시킨 후, 몰드를 떼어내어 패턴을 전사시키는 방법이다. 이 방법은 고온과 고압이 필요로 하는 thermal ILP 기술보다 간단하고, 효율적인 방법이다. 본 연구에서는 다양한 패턴형성을 위해 UV-ILP 기술로 진행하였고, UV 경화성 레진은 친환경적인 아크릴계 레진을 사용하였다. 이 레진에는 불소성분을 함유하지 않아 낮은 발수성을 가질 수 있어 ILP 기술로 표면의 패턴을 다양하게 형성하여 초발수의 표면특성을 구현했다. 제작한 다양한 패턴필름의 표면형상, 경도, 접촉각, 및 열적특성 등의 평가를 수행하였고, 결론적으로 평면 타입 패턴필름 대비 육각형 패턴필름에서 120° 이상의 높은 발수성을 확인할 수 있었다.
During the imprint lithography process (ILP), ILP technology using ultraviolet (UV) light is the method of pressing UV curing resins at a constant pressure (low pressure) with mold fabricated using pattern master, then UV irradiation, hardening resins, and then pulling away and transcription. This method is simpler and more efficient than the thermal ILP technology, which requires high temperature and high pressure. Thus, in this study, the UV-ILP for various pattern formulation was conducted, and the UV curing resin developed was used with environment-friendly acrylic resin. The resin does not contain fluorine, making it difficult to develop hydrophobic properties. Thus, by different mold surface patterns through the imprint process, acrylic resin also showed the super-hydrophobic surface characteristics. To evaluate the physical characteristics of UV curing resins developed, the surface properties, hardness, contact angle, and thermal characteristics were conducted. In conclusion, water-contact angle of honeycomb pattern film has shown the super-hydrophobic property over than 120 degree compared to the flat type pattern film.
- Fei G, Tuinea-Bobe C, Li D, Li G, Whiteside B, Coates P, Xia H, RSC Adv., 46, 24132 (2013)
- Park YM, Bang HC, Seo YH, Kim BH, Korean Soc. Manuf. Technol. Eng., 23, 64 (2014)
- Nam J, Lim H, Kim D, Shin S, Lab Chip, 19, 3361 (2011)
- Park YM, Seo SH, Seo YH, Kim BH, J. Korean Soc. Manuf. Technol. Eng., 24, 38 (2015)
- Lee MJ, Kim YS, Electron. Mater. Lett., 3, 155 (2007)
- Lee SJ, J. Adv. Eng. Technol., 20, 335 (2017)
- Chang SI, Yoon JB, Opt. Lett., 31, 3016 (2006)
- Li T, Zhang L, Leung KM, Yang J, J. Micromech. Microeng., 20, 105024 (2010)
- Lee BK, Hong LY, Lee HY, Kim DP, Kawai T, Langmuir, 25(19), 11768 (2009)
- Lee SJ, Park DJ, Bae JH, Lee SH, Kim JK, Kim KY, et al., J. Inf. Disp., 11, 49 (2010)
- Chang JH, Lee SG, Lee KB, Lee SJ, Cho JW, Lee SW, Jo GR, Lee KY, Kong HS, Kwon S, Rev. Sci. Instrum., 86, 055108 (2015)
- Kim SH, Park S, Moon SN, Lee W, Song K, Polym. Korea, 36(4), 536 (2012)
- Jeong J, Sim Y, Sohn H, Lee E, Microelectron. Eng., 75, 165 (2004)
- Heo JC, Kim KS, Kim KW, Tribology Society, 6, 40 (2009)
- Schlaich C, Yu L, Camacho LC, Wei Q, Haag R, Polym. Chem., 7, 7446 (2016)
- Hao C, Liu Y, Chen X, Li J, Zhang M, Zhao Y, Wang Z, Small, 12, 1825 (2016)
- Wen L, Tian Y, Jiang L, Angew. Chem.-Int. Edit., 54, 3387 (2015)
- Su B, Tian Y, Jiang L, J. Am. Chem. Soc., 138, 1727 (2015)
- Yuan S, Luan S, Yan S, Shi H, Yin J, ACS Appl. Mater Inter., 7, 19466 (2015)
- Zhang XY, Li Z, Liu KS, Jiang L, Adv. Funct. Mater., 23(22), 2881 (2013)
- Chu Z, Feng Y, Seeger S, Angew. Chem.-Int. Edit., 54, 2328 (2015)
- Zhao J, Song L, Yin J, Ming W, Chem. Commun., 49, 9191 (2013)
- Tesler AB, Kim P, Kolle S, Howell C, Ahanotu O, Aizenberg J, Nat. Commun., 6, 8694 (2015)
- Feng XJ, Jiang L, Adv. Mater., 18(23), 3063 (2006)
- Koch K, Bhushan B, Jung YC, Barthlott W, Soft Matter, 5, 1386 (2009)
- Zhang P, Wang S, Wang S, Jiang L, Small, 11, 1939 (2015)
- Bixler GD, Bhushan B, Soft Matter, 8, 11271 (2012)
- Nishimoto S, Bhushan B, RSC Adv., 3, 671 (2013)
- Wong TS, Kang SH, Tang SKY, Smythe EJ, Hatton BD, Grinthal A, Aizenberg J, Nature, 447, 443 (2011)
- Kim P, Wong TS, Alvarenga J, Kreder MJ, AdornoMartinez WE, Aizenberg J, ACS Nano, 6, 6569 (2012)
- Xiao L, Li J, Mieszkin S, Di Fino A, Clare AS, Callow ME, Callow JA, Grunze M, Rosenhahn A, Levkin PA, ACS Appl. Mater. Inter., 5, 10074 (2013)
- Leslie DC, Waterhouse A, Berthet JB, Valentin TM, et al., Nat. Biotechnol., 32, 1134 (2014)
- Hou X, Hu YH, Grinthal A, Khan M, Aizenberg J, Nature, 519(7541), 70 (2015)
- Wang J, Kato K, Blois AP, Wong TS, ACS Appl. Mater. Inter., 8, 8265 (2016)
- Martin JW, Mabury SA, Solomon KR, Muir DCG, Environ. Toxicol. Chem., 22, 196 (2003)
- Martin JW, Mabury SA, Solomon KR, Muir DCG, Environ. Toxicol. Chem., 22, 189 (2003)
- Betts KS, Environ. Health Perspect., 115, 250 (2007)
- Olsen GW, Burris JM, Ehresman DJ, Froehlich JW, Seacat AM, Butenhoff JL, Zobel LR, Environ. Health Perspect., 115, 1298 (2007)
- Lau C, Butenhoff JL, Rogers JM, Toxicol. Appl. Pharmacol., 198, 231 (2004)
- Wu W, Wang X, Liu X, Zhou F, ACS Appl. Mater. Inter., 1, 1656 (2009)
- Wang Z, Xu Y, Liu Y, Shao L, J. Mater. Chem. A, 3, 12171 (2015)
- Zhang W, Lu X, Xin Z, Zhou C, Liu J, RSC Adv., 5, 55513 (2015)
- Xu Z, Zhao Y, Wang H, Zhou H, Qin C, Wang X, Lin T, ACS Appl. Mater. Inter., 8, 5661 (2016)
- Mates JE, Ibrahim R, Vera A, Guggenheim S, Qin J, Calewarts D, Waldroup DE, Megaridis CM, Green Chem., 18, 2185 (2016)
- Tenjimbayashi M, Togasawa R, Manabe K, Matsubayashi T, Moriya T, Komine M, Shiratori S, Adv. Funct. Mater., 36, 6693 (2016)
- Wooh S, Vollmer D, Angew. Chem.-Int. Edit., 55, 6822 (2016)
- Moon BJ, Hwang SH, Polym. Korea, 35(2), 183 (2011)
- Yang JW, Seo AY, Lee CW, Appl. Chem. Eng., 24(5), 499 (2013)
- Chung ID, Kim TY, Jeong J, J. Adhesion and Interface, 16, 116 (2015).
- Bae JW, Jung JH, Wang HS, Kim SH, Kim IJ, Kim IJ, Song K, Polym. Korea, 41(2), 361 (2017)
- He J, Zhao C, Yiqiang F, Zhang J, Tong J, Yang W, Microsyst. Technol., 25, 3311 (2019)