Large-Scale and High-Resolution Patterning Based on the Intense Pulsed Light Transfer of Inkjet-Printed Light-Emitting Materials

Youngwoo Lee; Young Joon Han; Kuk Young Cho; Kwan Hyun Cho; Yong-Cheol Jeong

Macromolecular Research, Vol.29, No.2, 172-177, February, 2021

DOI10.1007/s13233-021-9017-4 Export Citation

Large-Scale and High-Resolution Patterning Based on the Intense Pulsed Light Transfer of Inkjet-Printed Light-Emitting Materials

Youngwoo Lee^{1, 2}, Young Joon Han¹, Kuk Young Cho^{2, †}, Kwan Hyun Cho^{1, †}, and Yong-Cheol Jeong^{1, †}

¹Micro/Nano scale Manufacturing R&D Department, KITECH, Ansan 15588, Korea
²Department of Materials Science and Chemical Engineering, Hanyang University, 55 Hanyangdaehak-ro, Sangnok-gu, Ansan 15588, Korea

E-mail:, ,

In this study, we present a hybrid fabrication method using the intense pulsed light transfer of inkjet-printed light-emitting materials for large-scale and high-resolution patterning. The surface morphology of inkjet-printed thin film is improved by introducing a newly synthesized non-sublimable additive to the conventional light-emitting materials. Finally, we also demonstrate successful photothermal transfer from a light-to-heat-conversion donor substrate to the target device substrate with a 1000 PPI resolution pattern.

Keywords:fine pixel pattern;inkjet printing;intense pulsed light;OLED

[References]

Lee TW, Noh T, Shin HW, Kwon O, Park JJ, Choi BK, Kim MS, Shin DW, Kim YR, Adv. Funct. Mater., 19(10), 1625 (2009)
Han TH, Choi MR, Jeon CW, Kim YH, Kwon SK, Lee TW, Sci. Adv., 2, e16014 (2016)
Mao GL, Wu ZX, He Q, Jiao B, Xu GJ, Hou X, Chen ZJ, Gong QH, Appl. Surf. Sci., 257(17), 7394 (2011)
Park SY, Choi S, Park GE, Kim HJ, Lee C, Moon JS, Kim SW, Park S, Kwon JH, Cho MJ, Choi DH, ACS Appl. Mater. Interfaces, 10, 14966 (2018)
Fu Q, Chen J, Shi C, Ma D, ACS Appl. Mater. Interfaces, 4, 6579 (2012)
Cai M, Xiao T, Hellerich E, Chen Y, Shinar R, Shinar J, Adv. Mater., 23(31), 3590 (2011)
He Z, Wang C, Zhao J, Du X, Yang H, Zhong P, Zheng C, Lin H, Tao S, Zhang X, J. Mater. Chem. C, 7, 11806 (2019)
Matsuoka K, Albrecht K, Nakayama A, Yamamoto K, Fujita K, ACS Appl. Mater. Interfaces, 10, 33343 (2018)
Tsai KW, Hung MK, Mao YH, Chen SA, Adv. Funct. Mater., 29, 190102 (2019)
Zhong C, Duan C, Huang F, Wu H, Cao Y, Chem. Mater., 23, 326 (2011)
Lee JY, Kim J, Kim H, Kim MC, ACS Appl. Mater. Interfaces, 12, 23244 (2020)
Zhou L, Yang L, Yu M, Jiang Y, Liu CF, Lai WY, Huang W, ACS Appl. Mater. Interfaces, 9, 40533 (2017)
Li J, Xu L, Tang CW, Shestopalov AA, ACS Appl. Mater. Interfaces, 8, 16809 (2016)
Lee SH, Kim J, Park HL, Kang S, Lee SD, Org. Electron., 73, 332 (2019)
Cho KH, et al., SID Symposium Digest of Technical Papers, 1507 (2019).
Cho H, Lee HN, Jeong YC, Park YM, Kang KT, Cho KH, ACS Appl. Mater. Interfaces, 12, 45064 (2020)
Kang YJ, Bail R, Lee CW, Chin BD, ACS Appl. Mater. Interfaces, 11, 21784 (2019)
Kim K, Kim G, Lee BR, Ji S, Kim SY, An BW, Song MH, Park JU, Nanoscale, 7, 13410 (2015)
Alaman J, Alicante R, Pena JI, Sanchez-Somonlinos C, Materials, 9, 910 (2016)
Li Z, Palacios E, Butun S, Kocer H, Aydin K, Sci. Rep., 5, 15137 (2015)

[Referenced By]

[1] Lee TW, Noh T, Shin HW, Kwon O, Park JJ, Choi BK, Kim MS, Shin DW, Kim YR, Adv. Funct. Mater., 19(10), 1625 (2009)

[2] Han TH, Choi MR, Jeon CW, Kim YH, Kwon SK, Lee TW, Sci. Adv., 2, e16014 (2016)

[3] Mao GL, Wu ZX, He Q, Jiao B, Xu GJ, Hou X, Chen ZJ, Gong QH, Appl. Surf. Sci., 257(17), 7394 (2011)

[4] Park SY, Choi S, Park GE, Kim HJ, Lee C, Moon JS, Kim SW, Park S, Kwon JH, Cho MJ, Choi DH, ACS Appl. Mater. Interfaces, 10, 14966 (2018)

[5] Fu Q, Chen J, Shi C, Ma D, ACS Appl. Mater. Interfaces, 4, 6579 (2012)

[6] Cai M, Xiao T, Hellerich E, Chen Y, Shinar R, Shinar J, Adv. Mater., 23(31), 3590 (2011)

[7] He Z, Wang C, Zhao J, Du X, Yang H, Zhong P, Zheng C, Lin H, Tao S, Zhang X, J. Mater. Chem. C, 7, 11806 (2019)

[8] Matsuoka K, Albrecht K, Nakayama A, Yamamoto K, Fujita K, ACS Appl. Mater. Interfaces, 10, 33343 (2018)

[9] Tsai KW, Hung MK, Mao YH, Chen SA, Adv. Funct. Mater., 29, 190102 (2019)

[10] Zhong C, Duan C, Huang F, Wu H, Cao Y, Chem. Mater., 23, 326 (2011)

[11] Lee JY, Kim J, Kim H, Kim MC, ACS Appl. Mater. Interfaces, 12, 23244 (2020)

[12] Zhou L, Yang L, Yu M, Jiang Y, Liu CF, Lai WY, Huang W, ACS Appl. Mater. Interfaces, 9, 40533 (2017)

[13] Li J, Xu L, Tang CW, Shestopalov AA, ACS Appl. Mater. Interfaces, 8, 16809 (2016)

[14] Lee SH, Kim J, Park HL, Kang S, Lee SD, Org. Electron., 73, 332 (2019)

[15] Cho KH, et al., SID Symposium Digest of Technical Papers, 1507 (2019).

[16] Cho H, Lee HN, Jeong YC, Park YM, Kang KT, Cho KH, ACS Appl. Mater. Interfaces, 12, 45064 (2020)

[17] Kang YJ, Bail R, Lee CW, Chin BD, ACS Appl. Mater. Interfaces, 11, 21784 (2019)

[18] Kim K, Kim G, Lee BR, Ji S, Kim SY, An BW, Song MH, Park JU, Nanoscale, 7, 13410 (2015)

[19] Alaman J, Alicante R, Pena JI, Sanchez-Somonlinos C, Materials, 9, 910 (2016)

[20] Li Z, Palacios E, Butun S, Kocer H, Aydin K, Sci. Rep., 5, 15137 (2015)