Journal of Vacuum Science & Technology A, Vol.14, No.6, 3043-3048, 1996
Self-Thickness-Limited Plasma Polymerization of an Ultrathin Antiadhesive Film
Ultrathin (<5 nm) fluorinated polymer films of homogeneous thicknesses have been deposited from a CF4/H-2 microwave discharge. The films have an extremely low surface energy of 4.2 mJ/m(2), which is more than four times lower than that for polytetrafluoroethylene. The deposition was carried out in a type of "self-thickness-limited" mode, in which the thickness of the deposited polymer film is limited by the plasma parameters. The deposition can be separated into two phases, a growth and a treatment phase. During the treatment phase, the deposited film is fluorinated, which results in a dramatic decrease of the surface energy. The thickness limiting behavior of the plasma is explained by the dualism of etching and polymerization occurring in fluorocarbon discharges. The film was tested as antiadhesion film for the replication of micro-optical structures, using a Ni shim with a very fine surface relief grating (400 nm periodicity) to hot emboss (at 180 degrees C) polycarbonate sheed. The tests demonstrate the excellent antiadhesive property of the film with the polycarbonate and reveal a good adhesion of the film with the Ni substrate.
Keywords:FABRICATION;ELEMENTS