The technique to mechanically structure silicon for highly efficient multicrystalline silicon solar cells has been developed at the University of Konstanz over the last few years. In order to make this technology suitable for a high-throughput industrial environment, a new texturization tool -the structuring wheel - has been designed. An extensive tool wear study indicates that the structuring wheels presently applied in our high-throughput mechanical texturization technology may be used to V groove at least 1 million wafers with a single abrasive layer. This results in a cost for the texturization step of about 0.025US$ per wafer in a production scenario. First results from a simulation program to determine two- and three-dimensional optical carrier generation profiles in textured silicon are given.