균일 침전법에 의한 ITO powder 합성

류미영; 최정환; 김희택; Mi Young Ryu; Jeong Hwan Choi; Hee Taik Kim

Journal of the Korean Industrial and Engineering Chemistry, Vol.12, No.3, 249-254, May, 2001

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균일 침전법에 의한 ITO powder 합성

Formation of the Indium Tin Oxide (ITO) Powder Using Homogeneous Precipitation Method

류미영, 최정환, 김희택 ^†

한양대학교 공학대학 화학공학과, 안산 425-791

Mi Young Ryu, Jeong Hwan Choi, and Hee Taik Kim^†

Department of Chemical Engineering, Hanyang University, Ansan 425-791, Korea

E-mail:

초록

질산 인듐(In(NO3)3·3.3H2O,4 N)과 염화주석(SnCl4·5H2O,4 N)을 용매인 에탄올(99.9%), 증류수 및 iso-propanol, butanol 등에 용해시킨 후 침전제로 1 M 암모니아수 및 urea, hexamethylene tetramine(HMTA)를 가하여 indium tin oxide(ITO) 콜로이드 용액을 합성하였다. 반응조건에 따른 ITO의 입자크기 및 결정 상들을 살펴보았다. 실험결과 반응온도가 높을수록 입자의 크기가 작아졌으며, 60 ℃ 이상의 반응온도에서는 불안정한 입자들이 형성되었다. 용매에 따른 ITO 분말의 비 표면적을 분석해 본 결과 분자량이 작은 H2O에서의 입자 크기가 가장 컸으며 분자량이 큰 butanol에서의 입자크기가 가장 작았다. 그러나 용해도에 따른 차이 때문에 용매에 따라 ITO 분말의 수율이 달라졌다. 또 urea, HMTA의 첨가에 의해 겔화 시간이 길어져 입자의 크기 제어에 영향을 줄 수 있음을 알았다.

To synthesize ITO colloidal solution solute(dissloute) indium and tin in the ethanol, distilled water, iso-propanol, and butanol solvate were added to the solution with precipitation agent 1 M NH4OH, urea and HMTA. Observed particle size and crystal phase of ITO in different reaction condition. From the test result, if reaction temperature is higher, particle size becomes smaller. Furthermore unstable particles were made at higher temperature than 60 ℃. By analyzing surface area of ITO with different solution, we found that particle size was the biggest in the H2O solution and the smallest in butanol solution. However, the yield of ITO powder were changed by solution because of its different solubility. We also found that size of particles could be influenced by the longer gelation time due to the addition of urea and HMTA.

Keywords:ITO;homogeneous precipitation;urea;HMTA

[References]

Ma HL, Zhang DH, Ma P, Win SZ, Li SY, Thin Solid Films, 263(1), 105 (1995)
Chopra KL, Major S, Pandya DK, Thin Solid Films, 102, 43 (1983)
Dawar AL, Joshi JC, J. Mater. Sci., 19, 1 (1984)
Djaoued Y, Phong VH, Badilescu S, Ashrit PV, Girouard FE, Truong VV, Thin Solid Films, 293(1-2), 108 (1997)
Furusaki T, Kodaira K, Yamamoto M, Shimada S, Matsushita T, Mater. Res. Bull., 21, 803 (1986)
Hjortsberg A, Hambeg I, Granqvist CG, Thin Solid Films, 90, 323 (1982)
Sugimoto T, Adv. Colloid Interface Sci., 28, 65 (1987)
Ju CS, Lee MG, Hong SS, HWAHAK KONGHAK, 35(5), 655 (1997)
Terrier C, Chatelon JP, Berjoan R, Roger JA, Thin Solid Films, 263(1), 37 (1995)
Jan SW, Lee SC, J. Electrochem. Soc., 134, 2056 (1987)
Hamberg I, Granqvist CG, J. Appl. Phys., 60(11), R123 (1986)
Gallagher D, Ring TA, Ceram. Powder Sci., 4, 719
Tahar RBH, Ban T, Ohya Y, Takahasi Y, J. Appl. Phys., 82(2), 865 (1997)
Tahar RBH, Ban T, Ohya Y, Takahasi Y, J. Appl. Phys., 83(4), 2139 (1998)
Tahar RBH, Ban T, Ohya Y, Takahasi Y, J. Appl. Phys., 83(5), 2631 (1998)
김병희, 이화학 사전, 1194 (1997)

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[1] Ma HL, Zhang DH, Ma P, Win SZ, Li SY, Thin Solid Films, 263(1), 105 (1995)

[2] Chopra KL, Major S, Pandya DK, Thin Solid Films, 102, 43 (1983)

[3] Dawar AL, Joshi JC, J. Mater. Sci., 19, 1 (1984)

[4] Djaoued Y, Phong VH, Badilescu S, Ashrit PV, Girouard FE, Truong VV, Thin Solid Films, 293(1-2), 108 (1997)

[5] Furusaki T, Kodaira K, Yamamoto M, Shimada S, Matsushita T, Mater. Res. Bull., 21, 803 (1986)

[6] Hjortsberg A, Hambeg I, Granqvist CG, Thin Solid Films, 90, 323 (1982)

[7] Sugimoto T, Adv. Colloid Interface Sci., 28, 65 (1987)

[8] Ju CS, Lee MG, Hong SS, HWAHAK KONGHAK, 35(5), 655 (1997)

[9] Terrier C, Chatelon JP, Berjoan R, Roger JA, Thin Solid Films, 263(1), 37 (1995)

[10] Jan SW, Lee SC, J. Electrochem. Soc., 134, 2056 (1987)

[11] Hamberg I, Granqvist CG, J. Appl. Phys., 60(11), R123 (1986)

[12] Gallagher D, Ring TA, Ceram. Powder Sci., 4, 719

[13] Tahar RBH, Ban T, Ohya Y, Takahasi Y, J. Appl. Phys., 82(2), 865 (1997)

[14] Tahar RBH, Ban T, Ohya Y, Takahasi Y, J. Appl. Phys., 83(4), 2139 (1998)

[15] Tahar RBH, Ban T, Ohya Y, Takahasi Y, J. Appl. Phys., 83(5), 2631 (1998)

[16] 김병희, 이화학 사전, 1194 (1997)