In this article we present a mechanical pattern transfer process where a thermosetting polymer mold instead of a metal, dielectric, ceramic, or semiconductor master made by conventional lithography was used as the master to pattern thermoplastic polymers in hot embossing lithography. The thermosetting polymer mold was fabricated by a soft lithography strategy, microtransfer molding. For comparison, the thermosetting polymer mold and the silicon wafer master were both used to imprint the thermoplastic polymer, polymethylmethacrylate. Replication of the thermosetting polymer mold and the silicon wafer master was of the same quality. This indicates that the thermosetting polymer mold could be used for thermoplastic polymer patterning in hot embossing lithography with high fidelity. (C) 2003 American Vacuum Society.