Journal of the Korean Industrial and Engineering Chemistry, Vol.15, No.3, 316-322, May, 2004
초임계 CO2에서 구리판에 대한 니켈 plating의 특성연구
Study on Characteristics of Nickel Plating on Copper Substrate in Supercritical CO2
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초록
초임계 이산화탄소를 용매로 사용하여 구리판에 대한 니켈 전기도금을 실시했다. 0.1 vol% 계면활성제 농도조건에서 에멀젼 용액의 전도도가 가장 높았으며 이산화탄소의 농도는 50 vol% 이하에서 저항값이 가장 낮았다. 45 ℃, 160 atm 조건에서 니켈도금막의 분산상태가 가장 양호했다. 초임계 이산화탄소에서 도금된 니켈막은 고유한 니켈 결정구조를 가지고 있었고 도금시간이 증가함에 따라 니켈 도금막의 표면은 점점 평활해졌다. 80 ~ 160 atm의 압력조건에서 표면경도는 135 ~ 164 kg/cm2로 압력에 따라 증가했는데 45 ℃, 80 atm에서 도금한 니켈막의 경도가 45 ℃, 1 atm에서 습식법에 의해 도금된 니켈막보다 130% 높았다. SCNP 시스템에서 니켈도금막의 분산상태를 양호하게 유지하기 위해서는 에멀젼 용액의 분산성이 개선되어야 하며 압력이 높을수록 니켈도금막 표면의 평활성과 경도가 향상되었다.
Nickel electroplating was performed on the copper substrate by using supercritical carbon dioxide as a solvent. Conductivity of the emulsion solution was the highest at 0.1 vol% surfactant concentration and resistance value was the lowest at concentration lower than 50 vol% CO2. The dispersion property of the nickel film plated at 45 ℃ and 160 atm was better than at any other temperature and pressure. The nickel film plated with SCNP system had the peak pattern of a typical nickel crystal structure. The surface roughness of nickel film was smoothed with an increasing plating time. Hardness value of the nickel film increased from 135 to 164 kg/cm2 with increased pressure from 80 to 160 atm; at 45 ℃ and 80 atm the value was higher by 130% than that at 45 ℃ and 1 atm by a conventional method. The dispersion property of emulsion solution must be enhanced in order to get the dispersion state of the nickel film plated SCNP system. Smoothness and hardness properties of nickel film were enhanced by increasing pressure.
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