Korean Chemical Engineering Research, Vol.42, No.4, 404-412, August, 2004
저압에서 초임계영역까지의 이산화탄소와 니켈도금액의 계면장력 측정과 계면활성제의 영향
The Measurement of the Interfacial Tension Between CO2 + Nickel-Plating Solution System and the Effect of Surfactant on this System in the Range of Low Pressure to Supercritical State
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초록
초임계 상태의 매크로에멀젼을 이용한 도금공정에서 필요한 기초 연구로 모세관 오름법을 이용하여 니켈도금액과 이산화탄소의 계면장력을 측정하였다. 계면활성제는 친이산화탄소기 및 친수기를 동시에 지닌 fluorinated analogues계면활성제인 sodium salt of bis(2,2,3,3,4,4,5,5-octafluoro-1-pentanol) sulfosuccinate였으며, 실험된 시스템은 이산화탄소+물과 이산화탄소+니켈도금액이였다. 이 시스템들의 계면장력을 측정하고, 계면활성제와 에탄올을 첨가하여 계면장력에 미치는 영향을 고찰하였다. 이 시스템들의 계면장력은 일정 온도에서, 계면활성제와 에탄올을 각각 첨가함에 따라 감소하였으나 두 물질을 동시에 첨가할 때에는 계면장력이 증가하는 것으로 나타났다. 본 연구는 저압에서부터 초임계 상태에 이르기까지 마이크로-, 매크로에멀젼을 형성시키는데 적합한 계면활성제와 첨가제를 선택하는데 유용하며, 이산화탄소와 물 혹은 니켈 도금액과 같은 극성물질 사이의 계면현상을 이해하는데 효과적이다.
The interfacial tension of Ni-plating solution+CO2 was measured by using the capillary rise method, which is requisite as a basic research for researching new electroplating using macroemulsion in supercritical CO2. The synthesized surfactant was sodium salt of bis(2,2,3,3,4,4,5,5-octafluoro-1-pentanol) sulfosuccinate which has CO2 philic chains and hydrophilic head group, and the experimental systems were water+CO2 and Ni-plating solution+CO2. In measuring the interfacial tension of Ni-plating solution+CO2, the effects of surfactant and ethanol were investigated. The interfacial tension of this system was decreased as the surfactant and ethanol were added into Ni-plating solution for Niplating solution+CO2 system, respectively. However, the interfacial tension of this system at constant temperature was increased as both the surfactant and ethanol were added into this solution simultaneously. This research is useful to select the proper surfactant and additives, and is effective to understand the interface phenomena between CO2 and polar chemicals such as water or Ni-plating solution for forming the micro-, and macroemulsion in the range of low pressure to supercritical state.
Keywords:Interfacial Tension;CO2;Ni-Plating Solution;Capillary Rise Method;Sodium Salt of Bis(2,2,3,3,4,4,5,5-octafluoro-1-pentanol) Sulfosuccinate;Surfactant;Ethanol
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