Experiments on micro-patterning of FPCB and RPCB were conducted using the NQD photoresist, a positive-type, and the commercial DFR, a negative-type. A micro-circuit pattern formation on flexible thin copper plate was compared with each other in terms of developing and etching for micro-circuit making. When DFR was used for the formation of micro-lines, the limit of line size for patterning was 40μm. On the other hands, liquid-type photoresist made from positive type NQD compound was revealed the applicability of more micro-sized patterning that is, less than 40μm through the enhancement of the photosensitivety.