Thermal Conductivity and Adhesion Properties of Thermally Conductive Pressure-Sensitive Adhesives

Jin Kon Kim; Jong Won Kim; Myung Im Kim; Min Seok Song

Macromolecular Research, Vol.14, No.5, 517-523, October, 2006

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Thermal Conductivity and Adhesion Properties of Thermally Conductive Pressure-Sensitive Adhesives

Jin Kon Kim^†, Jong Won Kim, Myung Im Kim, and Min Seok Song

National Creative Research Initiative Center for Block Copolymer Self-Assembly and Department of Chemical Engineering, Pohang University of Science and Technology, Gyungbuk 790-784, Korea

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The effects of particle content, size and shape on the thermal conductivity (k) and adhesion properties of thermally conductive, pressure-sensitive adhesives (PSAs) were investigated. The matrix resins were thermally crosslinkable, 2-ethylhexyl acrylic polyol and ultraviolet (UV)-curable, random copolymer consisting of acrylic oligomer and various acrylates. We found that k increased with increasing diameter and particle aspect ratio, and was further enhanced due to the reduction of the interfacial thermal barrier when the coupling agent, which increases the adhesion between particles and the matrix resin, was used. On the other hand, adhesion properties such as peel strength and tack of the thermally crosslinkable resin decreased sharply with increasing particle content. However, for UV curable resin, increased particle addition inhibited the decrease in adhesion properties.

Keywords:thermal conductivity;adhesion properties;pressure-sensitive adhesives

[References]

Ishida H, Rimdusit S, Thermochim. Acta, 320(1-2), 177 (1998)
Bae JW, Kim W, Cho SH, Lee SH, J. Mater. Sci., 35(23), 5907 (2000)
Xu Y, Chung DDL, Mroz C, Composites: Part A, 32, 1749 (2001)
Bujard P, Kuhnlein G, Ino S, Shiobara T, IEEE Trans. Compon. Packag. Manuf. Technol. Part A, 17, 527 (1994)
Hill RF, Supancic PH, J. Am. Ceram. Soc., 85, 851 (2002)
Murrary CT, Rudman RL, Sabade MB, Pocius AV, MRS Bull., 28, 449 (2003)
Japan Patent, 2000-290615A (Tokai Rubber Co., Japan)
Japan Patent 2005-97440A (Sumitio-3M Co., Japan)
Bae JW, Kim W, Hwang S, Choe YS, Lee SH, Macromol. Res., 12(1), 78 (2004)
Kang DW, Yeo HG, Polym.(Korea), 29(2), 161 (2005)
Wong CP, Bollampally RS, J. Appl. Polym. Sci., 74(14), 3396 (1999)
Wong CP, Bollampally RS, IEEE Transac. Adv. Packg., 22, 54 (1999)
Tavman IH, Int. Comm. Heat Mass Transfer, 25, 723 (1998)
Nagai Y, Lai G, J. Ceram. Soc. Jpn., 105, 213 (1996)
Mamunya YP, Davydenko VV, Pissis P, Lebedev EV, Eur. Polym. J., 38, 1887 (2002)
Kumlut D, Tavman IH, Coban MT, Compos. Sci. Technol., 63, 113 (2003)
Boudenne A, Ibos L, Fois M, Majeste JC, Gehin E, Composites: Part A, 36, 1545 (2005)
Gustafsson SE, Rev. Sci. Instrum., 62, 797 (1991)
Kim JK, Kim WH, Lee DH, Polymer, 43(18), 5005 (2002)

[Referenced By]

[Related Articles]

[1] Ishida H, Rimdusit S, Thermochim. Acta, 320(1-2), 177 (1998)

[2] Bae JW, Kim W, Cho SH, Lee SH, J. Mater. Sci., 35(23), 5907 (2000)

[3] Xu Y, Chung DDL, Mroz C, Composites: Part A, 32, 1749 (2001)

[4] Bujard P, Kuhnlein G, Ino S, Shiobara T, IEEE Trans. Compon. Packag. Manuf. Technol. Part A, 17, 527 (1994)

[5] Hill RF, Supancic PH, J. Am. Ceram. Soc., 85, 851 (2002)

[6] Murrary CT, Rudman RL, Sabade MB, Pocius AV, MRS Bull., 28, 449 (2003)

[7] Japan Patent, 2000-290615A (Tokai Rubber Co., Japan)

[8] Japan Patent 2005-97440A (Sumitio-3M Co., Japan)

[9] Bae JW, Kim W, Hwang S, Choe YS, Lee SH, Macromol. Res., 12(1), 78 (2004)

[10] Kang DW, Yeo HG, Polym.(Korea), 29(2), 161 (2005)

[11] Wong CP, Bollampally RS, J. Appl. Polym. Sci., 74(14), 3396 (1999)

[12] Wong CP, Bollampally RS, IEEE Transac. Adv. Packg., 22, 54 (1999)

[13] Tavman IH, Int. Comm. Heat Mass Transfer, 25, 723 (1998)

[14] Nagai Y, Lai G, J. Ceram. Soc. Jpn., 105, 213 (1996)

[15] Mamunya YP, Davydenko VV, Pissis P, Lebedev EV, Eur. Polym. J., 38, 1887 (2002)

[16] Kumlut D, Tavman IH, Coban MT, Compos. Sci. Technol., 63, 113 (2003)

[17] Boudenne A, Ibos L, Fois M, Majeste JC, Gehin E, Composites: Part A, 36, 1545 (2005)

[18] Gustafsson SE, Rev. Sci. Instrum., 62, 797 (1991)

[19] Kim JK, Kim WH, Lee DH, Polymer, 43(18), 5005 (2002)