Deep microtrenches having a high aspect ratio on the surfaces of silica glass were fabricated by laser-induced backside wet etching (LlBWE). The focused laser beam of a diode-pumped solid state (DPSS) UV laser lambda = 266 nm on the repetition rate of 30-40 kHz was directed to the sample cell of the glass by a galvanometer-based point scanning system. Vertical and inclined trench structures were successfully fabricated on the glass by changing the incident angle of the laser beam. The depth of filed (DOF) in LIBWE was analyzed by inclined laser irradiation. Flexible rapid prototyping by the mask-less exposure system was demonstrated. (c) 2007 Elsevier B.V. All rights reserved.