| 학회 | 한국고분자학회 |
| 학술대회 | 2004년 가을 (10/08 ~ 10/09, 경북대학교) |
| 권호 | 29권 2호, p.591 |
| 발표분야 | 기능성 고분자 |
| 제목 | Characterization and adhesion properties of modified PI films using ion beam and coupling treatment |
| 초록 | Polyimides (PI)s have found various applications because of their excellent chemical and thermal stability, superior mechanical properties, and low dielectric constants. In microelectronic devices, the PI film is frequently used for copper cladding laminates for flexible PCB. In the composite PI films deposited with copper by thermal evaporator or sputtering techniques, its surface should be modified by plasma or eximer laser or UV irradiation or ion-beam treatment to improve adhesion properties due to poor adhesion with copper. In this study, we investigated the surface modification by a combination of plasma and ion beam treatment and silane coupling reaction to improve the adhesion between PI film and copper. The PI film surface was first treated by ion-beam , followed by dipping it into a silane coupling agent solution. The morphology of polyimide film modified by ion-beam and coupling agent treatment was shown in Figure 1. The detailed characterization and adhesion to copper of the modified PI film will be discussed. Fig 1. AFM image of polyimide film modified by ion-beam and coupling agent References 1. X.P.Zou, E.T.Kang, K.G.Neoh, Y.Zhang, K.L.Tan, C.Q.Cui and T.B.Lim , Polym.Adv.Technol.12,538-595(2001) 2. Z.J.Yu, E.T.Kang ,K.G.Neoh, polymer 43,(2002)4137-4146 |
| 저자 | 강형대1, 강휘원1, 김석제1, 정 선2, 서동학3, 홍영택1 |
| 소속 | 1한국화학(연), 2아텍엔지니어링, 3한양대 |
| 키워드 | polyimide; ion-beam; surface; adhesion; coupling agent |
