| 학회 | 한국고분자학회 |
| 학술대회 | 2005년 봄 (04/14 ~ 04/15, 전경련회관) |
| 권호 | 30권 1호, p.415 |
| 발표분야 | 기능성 고분자 |
| 제목 | Adhesion improvement between copper and polyimide substrate by base-coupling agent treatment |
| 초록 | Polyimide film, which is well known as Kapton TM (produced by De Pont), is used in large quantities as an insulating materials in the filed of microelectronics technology due to its excellent properties of a low dielectric constant and high temperature resistance, etc. A practical usage of polyimide film [1] in the microelectronics technology is an flexible printed circuit board (FPCB), which is a lamination of PI film and copper metal. Due to poor adhesion between PI film and copper metal, the lamination in the popular FPCB is done with the assistance of adhesives. The direct deposition of copper metal onto the PI film surfaces will be possible for manufacturing FPCB without an adhesive. It is possible to modify polyimide film surfaces to obtain the desired surface properties. A number of surface modifications, such as wet-chemical treatment, UV excimer irradiation, plasma treatment, and ion beam irradiation have been applied to the polyimide substrates to enhance their adhesion to copper[2]. In this work, we prepared 2-layer flexible copper clad lamates using the wet modified procedure, and copper sputtering and electroplating. Wet process with KOH aqueous solutions was performed for the surface treatment of polyimide film and N,N'- carbonyldiimidazole was used to improve adhesion properties with copper. The properties and characterization of copper sputted polyimide film was investigated. The peel strength and thermal properties of copper deposited polyimide films will be discussed. Reference 1. Richard R. Thomas, Journal of colloid and interface science 279, 515 (2004) 2. Yi Li, Qinghua Lu, Xuefeng Qian, Zikang Zhu, Jie Yin, Applied surface science , accepted 23 March (2004) |
| 저자 | 김화진, 강휘원, 강형대, 김석제, 홍영택 |
| 소속 | 한국화학(연) |
| 키워드 | polyimide film; copper; surface modification; FPCB |
