| 학회 |
한국고분자학회 |
| 학술대회 |
2008년 봄 (04/10 ~ 04/11, 컨벤션 뷰로(대전)) |
| 권호 |
33권 1호 |
| 발표분야 |
고분자 가공/복합재료 |
| 제목 |
Phenomenological Analysis of Blister Mechanism in Printed Circuit Board (PCB) Manufacturing Process |
| 초록 |
To meet the high level of environmental conditions and data storage capacity, current electronic devices enquire more robust structure & reliability. Such limitations accompany naturally the increase of manufacturing cost and more strict material specification than the previous methods. To compensate such contradiction, PCB industries have tried to design completely new PCB processes and proper materials. In doing such effort, previous conventional processes and materials confront another limit of reliability problems such as different type of delamination phenomenon, which was hard to be found in old processes. In this study, we carefully examined the different type of delamination behavior of PCB substrates; dielectric polymer vs. conducting Cu layers, and explained the phenomenological mechanism of such failure under the harsh reliability test and manufacturing condition. |
| 저자 |
임성택1, 이화영2, 조재춘1, 이근용2, 오준록1
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| 소속 |
1eMD Center, 2삼성전기(주) |
| 키워드 |
Blister Mechanism; Delamination; PCB
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| E-Mail |
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