| 초록 |
The trend of miniaturization and higher performance for electronic device leads to development of high density packages, including the PCB industry. Epoxy resins are widely used in the PCB manufacturing, because of their superior thermal, mechanical, and electrical properties. However, their rigidity and brittleness due to high cross-linking density result in deterioration of long-term reliability for PCB products. To enhance their toughness, many attempts have been to modify epoxy resins with introducing rubber modifier or thermoplastics into epoxy networks. In this work, optimal epoxy blending system to improve the long-term reliability is investigated in terms of thermal and mechanical properties for the buildup films. As a result, toughness of the buildup films using the epoxy blending system is increased with introducing reinforces such as silicone- modified rubber or thermoplastics. |
