| 학회 |
한국고분자학회 |
| 학술대회 |
2009년 봄 (04/09 ~ 04/10, 대전컨벤션센터) |
| 권호 |
34권 1호 |
| 발표분야 |
고분자 가공/복합재료 |
| 제목 |
Mechanicaland morphological properties of build up filmcontrolled byin organic filler in printed circuite board manufacturing process |
| 초록 |
The main purpose of incorporating filler into epoxy resin composition is to decrease costs and improve mechanical properties. Structural differences between inorganic filler and organic matrix give rise to the formation of large filler agglomerates in the polymer matrix, which influence the mechanical response of the material. Silane coupling agent can not only help filler achieve better dispersion in polymer matrix, but also improve the roughness of the composite with good rigidity at the same time. The coupling agents of the 3-Glycidoxypropyltrimethoxy silane at various concentrations were used to facilitate the link between filler and matrix. The effect of surface treatment of the inorganic filler into the build up film is measured by peel strength after Cu plating. Mechanical tests and fractographic studies revealed that some of the silane coupling agent can improve of the interface between the epoxy matrix and the CaCO3 filler leading to increases in mechanical properties |
| 저자 |
박문수, 이화영, 조재춘, 임성택, 오준록
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| 소속 |
삼성전기 중앙(연) |
| 키워드 |
CaCO3; filler; build up film; epoxy resin; PCB; mechanical properties
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| E-Mail |
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