| 학회 | 한국재료학회 |
| 학술대회 | 2013년 가을 (11/06 ~ 11/08, 제주롯데호텔) |
| 권호 | 19권 2호 |
| 발표분야 | A. 전자/반도체 재료(Electronic and Semiconductor Materials) |
| 제목 | Enhancement of Thermal Conductivity and Thermal Resistivity of Copper Alloy for LED lead frame |
| 초록 | Copper alloy has been used as interconnection materials for various electronic applications due to their specific properties of high conductivity and pertinent strength. The requirement of Copper alloy’s properties has been correspondingly intensified to let performance of product be highly enhanced. That is to say, the Copper alloy featuring both high conductivity and high strength has recently been needed. However, the both properties are generally accepted as an inverse relationship each other. We suggested new methodology for enhancing electrical and thermal conductivity of Copper alloy using the combined structure, which consists of a strengthened bulk with discretely thin-layered Copper embedded by Silver. The embedded layer, conduction path, having a 10~100um width was formed by photo resist coating, UV exposure/development, chemical etching and silver plating, which is similar to the conventional semiconductor process. It was expected that the combined structure consisting of Copper and Silver would show higher conductivity than the conventional Copper due to Silver embedded lines. In this work, thermal conductivity of Copper alloy/Ag combined structure was also increased 40% with that of Copper alloy due to thermal conductivity of Silver, where the Silver conduction path is definitely contributed to enhance conductivity. Also, thermal resistivity of Copper alloy with Ag plating is approximately 9.913K/W, and that of silver combined Copper alloy was measured as more than 6.423K/W, which was 155% times higher from the bottom of the heating performance. The Copper-Ag combined structure was developed for improving thermal conductivity and resistivity, which is very available for high power LED applications such as lead frame and heat spreader. |
| 저자 | 이해중, 김상우, 구슬이, 신형원, 이효수 |
| 소속 | 한국생산기술(연) |
| 키워드 | thin copper foils; thermal conductivity; thermal resistivity; LED lead frame |
